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TSB41BA3FTPFPEP

Texas Instruments

TSB41BA3FTPFPEP by Texas Instruments

TSB41BA3FTPFPEP by Texas Instruments is an 80-terminal interface IC with a supply voltage range of 1.75V to 2V. It operates in temperatures from -40°C to 110°C, making it suitable for industrial applications requiring high reliability and performance. The package style is flatpack with a thin profile, ideal for surface mount assembly processes.

Median Price

$63.765

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 4 parts In-Stock

1+ parts

$58.660

100+ parts

-

1k+ parts

-

10k+ parts

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4

$58.660

-

-

-

Texas Instruments

USA . 2,328 parts In-Stock

1+ parts

$61.200

100+ parts

$54.400

1k+ parts

$40.000

10k+ parts

-

2,328

$61.200

$54.400

$40.000

-

Arrow

USA . 4 parts In-Stock

1+ parts

$63.280

100+ parts

$58.660

1k+ parts

-

10k+ parts

-

4

$63.280

$58.660

-

-

Chip1Stop

Japan . 40 parts In-Stock

1+ parts

$64.250

100+ parts

$59.750

1k+ parts

-

10k+ parts

-

40

$64.250

$59.750

-

-

DigiKey

USA . 106 parts In-Stock

1+ parts

$70.380

100+ parts

$62.560

1k+ parts

-

10k+ parts

-

106

$70.380

$62.560

-

-

Mouser Electronics

USA . 34 parts In-Stock

1+ parts

$86.200

100+ parts

$64.370

1k+ parts

-

10k+ parts

-

34

$86.200

$64.370

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,686 parts In-Stock

1+ parts

$55.727

100+ parts

-

1k+ parts

-

10k+ parts

-

1,686

$55.727

-

-

-

Vyrian

USA . 7,068 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,068

-

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Prism Electronics

USA . 24 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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24

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,783 parts In-Stock

1+ parts

$4.833

100+ parts

-

1k+ parts

$5.350

10k+ parts

-

1,783

$4.833

-

$5.350

-

DigiPath Technology Company

USA . 579 parts In-Stock

1+ parts

$5.321

100+ parts

-

1k+ parts

-

10k+ parts

-

579

$5.321

-

-

-

ChromeModa Solutions

Germany . 1,984 parts In-Stock

1+ parts

$5.430

100+ parts

$4.453

1k+ parts

-

10k+ parts

-

1,984

$5.430

$4.453

-

-

IDEA Electronic Components Group

UK . 195 parts In-Stock

1+ parts

$5.430

100+ parts

-

1k+ parts

$4.887

10k+ parts

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195

$5.430

-

$4.887

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Corphita

USA . 1,574 parts In-Stock

1+ parts

$52.794

100+ parts

-

1k+ parts

-

10k+ parts

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1,574

$52.794

-

-

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Component Stockers USA

USA . 91 parts In-Stock

1+ parts

$62.010

100+ parts

-

1k+ parts

-

10k+ parts

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91

$62.010

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-

-

Overview

Unlock the power of seamless connectivity with the TSB41BA3FTPFPEP by Texas Instruments. This innovative Interface IC boasts top-notch quality and reliability from a trusted manufacturer, making it a go-to choice for a wide range of applications. Whether you're looking to enhance your industrial systems or streamline communication in your electronics projects, this product offers unparalleled value and benefits. Say goodbye to compatibility issues and hello to smooth operation with the TSB41BA3FTPFPEP.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protects the IC from external elements, ensuring a longer product lifespan.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing manufacturing costs.

Maximum Supply Voltage: 2 V

With a maximum supply voltage of 2V, this IC is suitable for low-power applications, which can help in energy-efficient designs.

Package Shape: SQUARE

Square package shape makes it easier to mount and align the IC on the PCB, resulting in a more compact and efficient design.

No. of Terminals: 80

Having 80 terminals provides flexibility in connecting to other components, enabling a wide range of functionality in the system.

Package Style: FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Multiple package styles allow for different mounting options and heat dissipation methods, making the IC versatile for various applications.

Minimum Supply Voltage: 1.75 V

Low minimum supply voltage ensures compatibility with a wide range of power sources, making it suitable for diverse electronic devices.

Maximum Operating Temperature: 110 °C

High maximum operating temperature ensures reliability in harsh environments, making the IC suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the IC to function in cold environments without performance degradation, enhancing its versatility.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish provides excellent conductivity and corrosion resistance, ensuring reliable connections for long-term use.

Terminal Position: QUAD

Quad terminal position allows for efficient routing of signals and power, enhancing the overall performance of the IC in complex electronic systems.

Maximum Seated Height: 1.2 mm

Low seated height facilitates compact PCB designs, enabling space-efficient integration of the IC in miniaturized electronic devices.

Width: 12 mm

The 12mm width of the IC provides a balance between space-saving design and ease of handling during assembly, making it user-friendly.

Maximum Time At Peak Reflow Temperature (s): 30

The ability to withstand peak reflow temperature for up to 30 seconds ensures reliable soldering during manufacturing, reducing the risk of defects.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability of 260°C allows for lead-free soldering, meeting industry standards for environmentally-friendly manufacturing.

Length: 12 mm

The 12mm length of the IC complements its square shape, making it easy to align and mount on the PCB for efficient integration.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh conditions, making the IC suitable for rugged industrial applications.

Terminal Form: GULL WING

Gull wing terminal form enables secure soldering and robust mechanical connection, enhancing the overall durability of the IC on the PCB.

Nominal Supply Voltage: 1.85 V

Nominal supply voltage of 1.85V allows for stable operation within the specified voltage range, ensuring consistent performance in electronic systems.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables high-density mounting on the PCB, saving space and optimizing the layout for enhanced functionality.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate moisture sensitivity, requiring standard handling procedures during storage and assembly to maintain product quality.

Interface IC Type: INTERFACE CIRCUIT

Designed as an interface circuit, this IC facilitates communication between different components or systems, enabling seamless integration and data transfer.

Technical Specifications

Other Function Interface ICs TSB41BA3FTPFPEP attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.75 V

Nominal Supply Voltage:

1.85 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Trade Compliance

TSB41BA3FTPFPEP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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