Loading...

TSB41BA3FQPFPEP

Texas Instruments

TSB41BA3FQPFPEP by Texas Instruments

TSB41BA3FQPFPEP by Texas Instruments is an 80-terminal interface IC with a supply voltage range of 1.75V to 2V. It operates in temperatures from -40°C to 125°C, making it suitable for automotive applications. The package style is flatpack with gull wing terminals, ideal for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,189 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,189

-

-

-

-

Digiode

USA . 417 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

417

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 140 parts In-Stock

1+ parts

$1.500

100+ parts

-

1k+ parts

-

10k+ parts

-

140

$1.500

-

-

-

Parana Technologies

USA . 310 parts In-Stock

1+ parts

$4.495

100+ parts

-

1k+ parts

$4.937

10k+ parts

-

310

$4.495

-

$4.937

-

DigiPath Technology Company

USA . 579 parts In-Stock

1+ parts

$4.950

100+ parts

$4.554

1k+ parts

-

10k+ parts

-

579

$4.950

$4.554

-

-

ChromeModa Solutions

Germany . 2,194 parts In-Stock

1+ parts

$5.051

100+ parts

$4.142

1k+ parts

-

10k+ parts

-

2,194

$5.051

$4.142

-

-

IDEA Electronic Components Group

UK . 413 parts In-Stock

1+ parts

$5.051

100+ parts

-

1k+ parts

$4.546

10k+ parts

-

413

$5.051

-

$4.546

-

AZTECH Wire

Italy . 856 parts In-Stock

1+ parts

$15.184

100+ parts

-

1k+ parts

-

10k+ parts

-

856

$15.184

-

-

-

Corphita

USA . 327 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

327

-

-

-

-

Overview

Unlock the power of seamless connectivity with the TSB41BA3FQPFPEP by Texas Instruments. Crafted with precision and expertise, this innovative product belongs to the category of Other Function Interface ICs, offering unparalleled performance and reliability. Whether you're in the automotive industry or exploring new possibilities in technology, this interface circuit is designed to exceed your expectations. Experience the value of high-quality materials, advanced features, and a temperature grade suitable for any environment. Elevate your projects with Texas Instruments and take your creations to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and lightweight, making the product suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy installation and saves space on the PCB.

Maximum Supply Voltage: 2 V

The high maximum supply voltage of 2V provides flexibility and compatibility with different systems.

Package Shape: SQUARE

The square package shape is efficient in terms of space utilization on the PCB.

No. of Terminals: 80

Having 80 terminals allows for multiple connections and interfaces, making the product versatile.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

The various package styles offer options for different mounting configurations and cooling requirements.

Minimum Supply Voltage: 1.75 V

The low minimum supply voltage of 1.75V allows for efficient power consumption.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand extreme conditions and environments.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures from -40 to 125°C ensures reliability in various climates.

Terminal Position: QUAD

The quad terminal position enables secure connections and efficient signal transmission.

Maximum Seated Height: 1.2 mm

The low maximum seated height helps in compact PCB designs and reduces overall system height.

Width: 12 mm

The 12mm width offers a compact form factor for space-constrained applications.

Length: 12 mm

Having a length of 12mm complements the square package shape and aids in efficient board layout.

Temperature Grade: AUTOMOTIVE

The automotive-grade temperature rating ensures reliability in automotive applications where temperature variations are common.

Terminal Form: GULL WING

The gull-wing terminal form provides mechanical strength and stability during installation and operation.

Nominal Supply Voltage: 1.85 V

The nominal supply voltage of 1.85V is optimal for efficient operation and performance.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm allows for high-density packaging and precise connections.

Interface IC Type: INTERFACE CIRCUIT

Being an interface circuit type, the product facilitates communication and data transfer between different components effectively.

Technical Specifications

Other Function Interface ICs TSB41BA3FQPFPEP attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

S-PQFP-G80

Length:

12 mm

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.75 V

Nominal Supply Voltage:

1.85 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Trade Compliance

TSB41BA3FQPFPEP Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 2