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TPD2S701QDSKRQ1

Texas Instruments

TPD2S701QDSKRQ1 by Texas Instruments

TPD2S701QDSKRQ1 by Texas Instruments is an AEC-Q100 compliant interface IC with a supply voltage range of 4.5V to 7V, ideal for automotive applications. It features a small outline package with dual terminals and nickel palladium gold finish, suitable for surface mount assembly. Operating temperature ranges from -40°C to 125°C, making it reliable in harsh environments.

Median Price

$0.950

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 90 parts In-Stock

1+ parts

$0.706

100+ parts

$0.663

1k+ parts

$0.600

10k+ parts

-

90

$0.706

$0.663

$0.600

-

Texas Instruments

USA . 142,014 parts In-Stock

1+ parts

$1.195

100+ parts

$0.920

1k+ parts

$0.484

10k+ parts

-

142,014

$1.195

$0.920

$0.484

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,665 parts In-Stock

1+ parts

$0.671

100+ parts

-

1k+ parts

-

10k+ parts

-

4,665

$0.671

-

-

-

Maritex

Poland . 698 parts In-Stock

1+ parts

$1.174

100+ parts

$0.599

1k+ parts

$0.515

10k+ parts

$0.451

698

$1.174

$0.599

$0.515

$0.451

Cyclops Electronics Ltd

UK . 75,547 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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75,547

-

-

-

-

Vyrian

USA . 9,599 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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9,599

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,023 parts In-Stock

1+ parts

$0.635

100+ parts

-

1k+ parts

-

10k+ parts

-

4,023

$0.635

-

-

-

Parana Technologies

USA . 1,057 parts In-Stock

1+ parts

$11.928

100+ parts

$1,107.675

1k+ parts

$10.735

10k+ parts

-

1,057

$11.928

$1,107.675

$10.735

-

DigiPath Technology Company

USA . 2,269 parts In-Stock

1+ parts

$13.134

100+ parts

$12.083

1k+ parts

-

10k+ parts

-

2,269

$13.134

$12.083

-

-

ChromeModa Solutions

Germany . 5,493 parts In-Stock

1+ parts

$13.402

100+ parts

$10.990

1k+ parts

-

10k+ parts

-

5,493

$13.402

$10.990

-

-

IDEA Electronic Components Group

UK . 357 parts In-Stock

1+ parts

$13.402

100+ parts

$12.732

1k+ parts

$12.062

10k+ parts

-

357

$13.402

$12.732

$12.062

-

AZTECH Wire

Italy . 313 parts In-Stock

1+ parts

$16.390

100+ parts

-

1k+ parts

-

10k+ parts

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313

$16.390

-

-

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Futuretech Components

Singapore . 20,000 parts In-Stock

1+ parts

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100+ parts

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20,000

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GreenTree Electronics

Israel . 3,000 parts In-Stock

1+ parts

-

100+ parts

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3,000

-

-

-

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A-Z Elektronik GmbH

Germany . 3,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,000

-

-

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iodParts Technologies Inc.

India . 1,010 parts In-Stock

1+ parts

-

100+ parts

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1,010

-

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Overview

Elevate your automotive electronics with the TPD2S701QDSKRQ1 by Texas Instruments, a cutting-edge interface circuit that delivers unparalleled quality and reliability. Manufactured with precision and expertise, this small outline package offers a very thin profile and dual terminal position for seamless integration. Designed to withstand extreme temperatures and voltage fluctuations, this IC is ideal for a wide range of automotive applications. Experience the value of superior performance and peace of mind with Texas Instruments' TPD2S701QDSKRQ1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to environmental factors, making the product suitable for a variety of applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 7 V

With a high maximum supply voltage, the product can handle a wide range of input voltages, increasing its versatility.

Screening Level: AEC-Q100

AEC-Q100 certification ensures that the product meets automotive grade standards, guaranteeing reliable performance in harsh operating conditions.

Package Shape: SQUARE

Square package shape facilitates easier mounting and alignment on PCBs, improving overall design efficiency.

No. of Terminals: 10

Having 10 terminals allows for more connections and functionalities, making the product suitable for complex circuitry.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline, heat sink/slug, and very thin profile package style enhances thermal dissipation and enables compact designs in space-constrained applications.

Minimum Supply Voltage: 4.5 V

Low minimum supply voltage ensures compatibility with a wide range of power sources, improving flexibility in system design.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows the product to function reliably in demanding thermal environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures the product can operate effectively in cold conditions without performance degradation.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish provides excellent conductivity and corrosion resistance, enhancing the product's reliability and longevity.

Terminal Position: DUAL

Dual terminal position offers redundancy and flexibility in connection options, improving overall system reliability.

Maximum Seated Height: 0.8 mm

Low maximum seated height reduces the overall profile of the product, allowing for compact and space-efficient designs.

Width: 2.5 mm

Compact width dimension enables the product to fit into tight spaces and densely packed PCB layouts.

Maximum Time At Peak Reflow Temperature (s): 30

The product can withstand peak reflow temperatures for up to 30 seconds, ensuring reliable soldering during assembly processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability ensures the product can endure manufacturing processes without damage or performance degradation.

Length: 2.5 mm

Compact length dimension further contributes to the product's space-efficient design and compatibility with various PCB layouts.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade rating indicates the product's suitability for automotive applications, where reliability under extreme temperature conditions is crucial.

Terminal Form: NO LEAD

No-lead terminal form eliminates the risk of lead contamination and complies with environmental regulations, making the product more eco-friendly.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage of 5V ensures compatibility with common power sources and simplifies integration into existing systems.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for high-density mounting and precise connections on the PCB, suitable for compact designs.

Moisture Sensitivity Level (MSL): 2

MSL 2 rating indicates the product can withstand moderate exposure to moisture during assembly and storage, reducing the risk of damage.

Interface IC Type: INTERFACE CIRCUIT

Featuring an interface circuit type, the product facilitates communication between different parts of a system, enhancing overall functionality and performance.

Technical Specifications

Other Function Interface ICs TPD2S701QDSKRQ1 attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

S-PDSO-N10

JESD-609 Code:

e4

Length:

2.5 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

.8 mm

Maximum Supply Voltage:

7 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.5 mm

Trade Compliance

TPD2S701QDSKRQ1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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