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TPD2S703QDSKRQ1

Texas Instruments

TPD2S703QDSKRQ1 by Texas Instruments

TPD2S703QDSKRQ1 by Texas Instruments is an AEC-Q100 compliant interface IC with a supply voltage range of 4.5V to 7V, ideal for automotive applications. It features a small outline package style with dual terminals and nickel palladium gold finish, suitable for surface mount assembly. Operating temperature ranges from -40°C to 125°C, making it reliable in harsh environments.

Median Price

$2.622

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 15,789 parts In-Stock

1+ parts

$1.734

100+ parts

$1.432

1k+ parts

$0.774

10k+ parts

-

15,789

$1.734

$1.432

$0.774

-

Mouser Electronics

USA . 2,257 parts In-Stock

1+ parts

$3.510

100+ parts

$1.760

1k+ parts

$1.260

10k+ parts

$1.110

2,257

$3.510

$1.760

$1.260

$1.110

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$0.982

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$0.982

-

-

-

Digiode

USA . 2,177 parts In-Stock

1+ parts

$1.647

100+ parts

-

1k+ parts

-

10k+ parts

-

2,177

$1.647

-

-

-

Dark Horse Electronics

USA . 51,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

51,000

-

-

-

-

Vyrian

USA . 6,918 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,918

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 9,589 parts In-Stock

1+ parts

$0.820

100+ parts

-

1k+ parts

-

10k+ parts

-

9,589

$0.820

-

-

-

Continental Prestige Electronics

USA . 4,913 parts In-Stock

1+ parts

$0.982

100+ parts

-

1k+ parts

-

10k+ parts

$0.962

4,913

$0.982

-

-

$0.962

Argo Parts USA

USA . 2,713 parts In-Stock

1+ parts

$0.982

100+ parts

-

1k+ parts

-

10k+ parts

-

2,713

$0.982

-

-

-

Corphita

USA . 2,675 parts In-Stock

1+ parts

$1.561

100+ parts

-

1k+ parts

-

10k+ parts

-

2,675

$1.561

-

-

-

Parana Technologies

USA . 1,399 parts In-Stock

1+ parts

$6.611

100+ parts

-

1k+ parts

$7.341

10k+ parts

-

1,399

$6.611

-

$7.341

-

ChromeModa Solutions

Germany . 2,259 parts In-Stock

1+ parts

$7.428

100+ parts

$6.091

1k+ parts

-

10k+ parts

-

2,259

$7.428

$6.091

-

-

IDEA Electronic Components Group

UK . 2,097 parts In-Stock

1+ parts

$7.428

100+ parts

-

1k+ parts

$6.685

10k+ parts

-

2,097

$7.428

-

$6.685

-

GreenTree Electronics

Israel . 12,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,000

-

-

-

-

A-Z Elektronik GmbH

Germany . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

DigiPath Technology Company

USA . 2,357 parts In-Stock

1+ parts

-

100+ parts

$6.697

1k+ parts

-

10k+ parts

-

2,357

-

$6.697

-

-

Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$0.962

1k+ parts

$0.933

10k+ parts

$0.913

2,000

-

$0.962

$0.933

$0.913

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Overview

Upgrade your connectivity with the TPD2S703QDSKRQ1 by Texas Instruments, a high-quality interface IC designed for automotive applications. With a wide operating temperature range and AEC-Q100 screening level, this product ensures reliability and durability in harsh environments. Its compact package body material and surface mount design make it easy to integrate into your system. Trust in Texas Instruments' reputation for excellence and choose the TPD2S703QDSKRQ1 for seamless performance and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product suitable for various applications.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 7 V

Can handle higher voltage inputs, providing flexibility in design.

Screening Level: AEC-Q100

Meets automotive industry standards for reliability and quality.

Minimum Operating Temperature: -40 °C

Can operate in extremely low temperature environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides high conductivity and corrosion resistance for reliable connections.

Width: 2.5 mm

Compact size allows for space-efficient placement on circuit boards.

Temperature Grade: AUTOMOTIVE

Suitable for use in automotive applications, meeting specific temperature and performance requirements.

Nominal Supply Voltage: 5 V

Standard voltage level that is compatible with many electronic systems.

Interface IC Type: INTERFACE CIRCUIT

Designed for use in interfacing different electronic components, enhancing versatility.

Technical Specifications

Other Function Interface ICs TPD2S703QDSKRQ1 attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

S-PDSO-N10

JESD-609 Code:

e4

Length:

2.5 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

.8 mm

Maximum Supply Voltage:

7 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.5 mm

Trade Compliance

TPD2S703QDSKRQ1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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