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MC33SB0401ES

NXP Semiconductors

MC33SB0401ES by NXP Semiconductors

INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 40;

Median Price

$9.256

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 320 parts In-Stock

1+ parts

$11.150

100+ parts

$7.440

1k+ parts

$7.110

10k+ parts

-

320

$11.150

$7.440

$7.110

-

Mouser Electronics

USA . 121 parts In-Stock

1+ parts

$11.150

100+ parts

$7.450

1k+ parts

$6.820

10k+ parts

$6.720

121

$11.150

$7.450

$6.820

$6.720

Rochester

USA . 260 parts In-Stock

1+ parts

-

100+ parts

$5.890

1k+ parts

$5.270

10k+ parts

$4.960

260

-

$5.890

$5.270

$4.960

Verical

USA . 260 parts In-Stock

1+ parts

-

100+ parts

$7.362

1k+ parts

$6.588

10k+ parts

$6.200

260

-

$7.362

$6.588

$6.200

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,317 parts In-Stock

1+ parts

$6.222

100+ parts

-

1k+ parts

-

10k+ parts

-

2,317

$6.222

-

-

-

Flip Electronics

USA . 10,920 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,920

-

-

-

-

Vyrian

USA . 5,565 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,565

-

-

-

-

Anansix

USA . 902 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

902

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,654 parts In-Stock

1+ parts

$5.895

100+ parts

-

1k+ parts

-

10k+ parts

-

3,654

$5.895

-

-

-

Microchip USA

USA . 5,573 parts In-Stock

1+ parts

$32.340

100+ parts

-

1k+ parts

-

10k+ parts

-

5,573

$32.340

-

-

-

UNI Independent Distributors

Spain . 6,621 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,621

-

-

-

-

Technical Specifications

Other Function Interface ICs MC33SB0401ES attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Interface IC Type:

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48(UNSPEC)

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Supply Voltage:

20 V

Minimum Supply Voltage:

6 V

Surface Mount:

YES

Technology:

SMARTMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Trade Compliance

MC33SB0401ES Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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