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MC33CD1030AER2

NXP Semiconductors

MC33CD1030AER2 by NXP Semiconductors

MC33CD1030AER2 by NXP Semiconductors is a SMARTMOS technology interface IC with 48 terminals in a square package. It operates b/w -40 to 125 °C, with supply voltage ranging from 4.5V to 36V. Ideal for applications requiring low profile and fine pitch components.

Median Price

$3.295

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 11 parts In-Stock

1+ parts

$3.402

100+ parts

-

1k+ parts

-

10k+ parts

-

11

$3.402

-

-

-

DigiKey

USA . 1,980 parts In-Stock

1+ parts

$5.780

100+ parts

$3.704

1k+ parts

$3.486

10k+ parts

$3.257

1,980

$5.780

$3.704

$3.486

$3.257

Mouser Electronics

USA . 1,287 parts In-Stock

1+ parts

$5.780

100+ parts

$3.710

1k+ parts

$3.490

10k+ parts

$3.250

1,287

$5.780

$3.710

$3.490

$3.250

Future Electronics

Canada . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$2.780

4,000

-

-

-

$2.780

EBV Elektronik

Germany . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

-

-

-

-

Verical

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.188

10k+ parts

$3.000

3,000

-

-

$3.188

$3.000

Rochester

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

$2.850

1k+ parts

$2.550

10k+ parts

$2.400

3,000

-

$2.850

$2.550

$2.400

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,603 parts In-Stock

1+ parts

$3.232

100+ parts

-

1k+ parts

-

10k+ parts

-

3,603

$3.232

-

-

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$3.630

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$3.630

-

-

-

IBS Electronics

USA . 12,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$3.899

12,000

-

-

-

$3.899

Chip Stock

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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6,000

-

-

-

-

NAC Semi

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$4.280

4,000

-

-

-

$4.280

Anansix

USA . 2,437 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,437

-

-

-

-

TME

Poland . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$3.730

2,000

-

-

-

$3.730

Vyrian

USA . 810 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

810

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,955 parts In-Stock

1+ parts

$3.062

100+ parts

-

1k+ parts

-

10k+ parts

-

1,955

$3.062

-

-

-

Continental Prestige Electronics

USA . 5,525 parts In-Stock

1+ parts

$3.630

100+ parts

-

1k+ parts

-

10k+ parts

$3.557

5,525

$3.630

-

-

$3.557

Argo Parts USA

USA . 4,848 parts In-Stock

1+ parts

$3.630

100+ parts

-

1k+ parts

-

10k+ parts

-

4,848

$3.630

-

-

-

Netroflash

USA . 500 parts In-Stock

1+ parts

$3.630

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$3.630

-

-

-

Ampacity Inc.

Singapore . 503 parts In-Stock

1+ parts

$5.410

100+ parts

-

1k+ parts

-

10k+ parts

-

503

$5.410

-

-

-

Microchip USA

USA . 4,384 parts In-Stock

1+ parts

$20.287

100+ parts

-

1k+ parts

-

10k+ parts

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4,384

$20.287

-

-

-

Lixinc

USA . 14,312 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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14,312

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UNI Independent Distributors

Spain . 4,524 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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4,524

-

-

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GreenTree Electronics

Israel . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

2,000

-

-

-

-

Overview

Discover the innovation and reliability of the MC33CD1030AER2 by NXP Semiconductors, a leading manufacturer in the industry. This cutting-edge interface IC offers a wide range of applications, ensuring seamless integration into various systems. With high-quality materials and advanced technology, this product guarantees optimal performance and durability. Experience the value and benefits it brings to your projects, from enhanced functionality to increased efficiency. Trust NXP Semiconductors to deliver top-notch solutions for all your interface circuit needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material offers good durability and reliability for the IC.

Surface Mount: YES

Enables easy and efficient PCB assembly.

Maximum Supply Voltage: 36 V

Suitable for applications requiring higher voltage operation.

Package Shape: SQUARE

Square shape helps in easy integration into the circuit design.

No. of Terminals: 48

Sufficient number of terminals for versatile connectivity options.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Multiple package styles for different mounting and cooling requirements.

Minimum Supply Voltage: 4.5 V

Allows operation at lower voltage levels for energy-efficient applications.

Maximum Operating Temperature: 125 °C

Can withstand high operating temperatures for reliable performance.

Minimum Operating Temperature: -40 °C

Operational even in extremely low temperatures.

Terminal Position: QUAD

Quad terminal position for efficient signal transmission.

Maximum Seated Height: 1.6 mm

Low profile design for compact electronic devices.

Width: 7 mm

Compact width for space-constrained applications.

Maximum Time At Peak Reflow Temperature (s): 40

Can withstand peak reflow temperatures for specified duration.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures during assembly process.

Length: 7 mm

Compact length for space-saving integration.

Technology: SMARTMOS

Advanced SmartMOS technology for enhanced functionality.

Terminal Form: GULL WING

Gull wing terminal form for secure and reliable connections.

Nominal Supply Voltage: 16 V

Optimal supply voltage for efficient operation.

Terminal Pitch: 0.5 mm

Fine terminal pitch for precise connections.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates good resistance to moisture during storage and handling.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed for interface circuit applications.

Technical Specifications

Other Function Interface ICs MC33CD1030AER2 attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Interface IC Type:

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

16 V

Surface Mount:

YES

Technology:

SMARTMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7 mm

Trade Compliance

MC33CD1030AER2 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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