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MC33972ATEK

NXP Semiconductors

MC33972ATEK by NXP Semiconductors

INTERFACE CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3;

Median Price

$7.370

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

MC33972ATEK by NXP Semiconductors
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 10 parts In-Stock

1+ parts

$7.370

100+ parts

$3.870

1k+ parts

$3.550

10k+ parts

$3.380

10

$7.370

$3.870

$3.550

$3.380

Avnet

USA . 420 parts In-Stock

1+ parts

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420

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Distributors (In-Stock)

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Digiode

USA . 3,665 parts In-Stock

1+ parts

$5.728

100+ parts

-

1k+ parts

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10k+ parts

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3,665

$5.728

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-

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Maritex

Poland . 588 parts In-Stock

1+ parts

$7.720

100+ parts

$4.122

1k+ parts

-

10k+ parts

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588

$7.720

$4.122

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Vyrian

USA . 8,130 parts In-Stock

1+ parts

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8,130

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Anansix

USA . 2,632 parts In-Stock

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2,632

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LIBRA Elektronik GmbH

Germany . 21 parts In-Stock

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Kiltronic GmbH

Germany . 6 parts In-Stock

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6

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,671 parts In-Stock

1+ parts

$5.427

100+ parts

-

1k+ parts

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10k+ parts

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1,671

$5.427

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Microchip USA

USA . 2,487 parts In-Stock

1+ parts

$14.603

100+ parts

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2,487

$14.603

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A-Z Elektronik GmbH

Germany . 11,130 parts In-Stock

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11,130

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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UNI Independent Distributors

Spain . 2,762 parts In-Stock

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2,762

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Perfect Parts

USA . 605 parts In-Stock

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605

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Technical Specifications

Other Function Interface ICs MC33972ATEK attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Interface IC Type:

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

40

Trade Compliance

MC33972ATEK Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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