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XCZU9CG-2FFVB1156I

Xilinx

XCZU9CG-2FFVB1156I by Xilinx

XCZU9CG-2FFVB1156I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance and reliability.

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Vyrian

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AZTECH Wire

Italy . 619 parts In-Stock

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Ampacity Inc.

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Semicontronic

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MARBEL Systems

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Texas Native Microelectronics

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Kenton Components

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One Stop Electronics

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Modulus Dynamics

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Qasali Group International

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Corohmni

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Overview

Experience top-notch performance and reliability with the XCZU9CG-2FFVB1156I by Xilinx. As a trusted manufacturer in the industry, Xilinx delivers cutting-edge solutions for a wide range of applications. This versatile product falls under the category of Other Function uPs,uCs & Peripheral ICs, providing unparalleled value and benefits to customers. With its advanced technology and industrial-grade components, this microprocessor circuit ensures optimal functionality even in extreme conditions. Upgrade your systems with the XCZU9CG-2FFVB1156I and elevate your performance to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Being made from plastic/epoxy, this product is lightweight and durable, making it ideal for a variety of applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on PCBs, saving time and effort during assembly.

Maximum Supply Voltage: 0.876 V

With a high maximum supply voltage, this product can handle power fluctuations and ensure stable performance.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient use of space on the PCB, increasing design flexibility.

No. of Terminals: 1156

With a high number of terminals, this product offers extensive connectivity options, making it suitable for complex electronic systems.

Package Style (Meter): GRID ARRAY

The grid array package style provides a compact footprint while enabling high terminal density, making it suitable for space-constrained designs.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and maintain reliable operation.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The use of tin/silver/copper terminal finish ensures good conductivity and corrosion resistance, enhancing the product's longevity.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The inclusion of a microprocessor circuit enables advanced functionality and processing capabilities, making this product suitable for complex tasks.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in demanding environments, making this product suitable for industrial applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU9CG-2FFVB1156I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B1156

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU9CG-2FFVB1156I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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