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XCZU7CG-2FBVB900I

Xilinx

XCZU7CG-2FBVB900I by Xilinx

XCZU7CG-2FBVB900I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance and reliability.

Median Price

$4,006.255

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Nova Conductors

Japan . 54 parts In-Stock

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Vyrian

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Ampacity Inc.

Singapore . 577 parts In-Stock

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$2.000

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One Stop Electronics

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AZTECH Wire

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Semicontronic

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$8.775

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$8.730

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Corohmni

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MARBEL Systems

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Texas Native Microelectronics

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Kenton Components

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Modulus Dynamics

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Microchip USA

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Aranea Global

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Argo Parts USA

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$3,966.192

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$3,926.130

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$3,886.067

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Continental Prestige Electronics

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Qasali Group International

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Overview

Unlock the power of cutting-edge technology with the XCZU7CG-2FBVB900I from Xilinx. As a leading manufacturer in the industry, Xilinx delivers top-quality products that exceed expectations. This versatile microprocessor circuit offers a wide range of applications, providing unparalleled performance and reliability. Experience seamless functionality and enhanced efficiency with this industrial-grade peripheral IC. Trust Xilinx to bring you innovative solutions that drive success in your projects. Elevate your designs with the XCZU7CG-2FBVB900I and stay ahead of the curve.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability and lightweight design.

Surface Mount:

YES - Allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage:

0.876 V - Provides sufficient power for stable performance.

Package Shape:

RECTANGULAR - Fits well in standard mounting configurations.

No. of Terminals:

900 - Offers ample connection options for various components.

Package Style (Meter):

GRID ARRAY - Ensures secure and reliable connections.

Minimum Supply Voltage:

0.825 V - Allows for low power consumption.

Maximum Operating Temperature:

100 °C - Ideal for industrial environments with high temperatures.

Minimum Operating Temperature:

40 °C - Suitable for a wide range of operating conditions.

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) - Provides excellent conductivity and corrosion resistance.

Terminal Position:

BOTTOM - Facilitates easy assembly and connection to other components.

Maximum Time At Peak Reflow Temperature (s):

30 - Ensures proper soldering during manufacturing.

Peak Reflow Temperature °C:

245 - Allows for efficient soldering without damaging the product.

Temperature Grade:

INDUSTRIAL - Designed to withstand harsh industrial environments.

Peripheral IC Type:

MICROPROCESSOR CIRCUIT - Offers advanced functionality and processing power.

Technology:

CMOS - Provides efficient operation and low power consumption.

Terminal Form:

BALL - Ensures reliable connectivity and durability.

Nominal Supply Voltage:

0.85 V - Ensures stable and consistent power supply.

Moisture Sensitivity Level (MSL):

4 - Suitable for environments with moderate humidity levels.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU7CG-2FBVB900I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B900

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

900

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU7CG-2FBVB900I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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