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XCZU7CG-1FFVC1156I

Xilinx

XCZU7CG-1FFVC1156I by Xilinx

XCZU7CG-1FFVC1156I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. This GRID ARRAY package has 1156 terminals and is ideal for industrial applications requiring high performance uPs/uCs.

Median Price

$3,439.149

Lifecycle Status

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VNN

France . 312 parts In-Stock

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Nova Conductors

Japan . 1,000 parts In-Stock

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Vyrian

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One Stop Electronics

USA . 914 parts In-Stock

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AZTECH Wire

Italy . 510 parts In-Stock

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Semicontronic

India . 688 parts In-Stock

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$14.625

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Ampacity Inc.

Singapore . 1,433 parts In-Stock

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MARBEL Systems

Belgium . 5,879 parts In-Stock

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Corohmni

South Africa . 2,595 parts In-Stock

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Modulus Dynamics

Lithuania . 1,385 parts In-Stock

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Texas Native Microelectronics

USA . 25 parts In-Stock

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Kenton Components

USA . 6,686 parts In-Stock

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Microchip USA

USA . 1,077 parts In-Stock

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Continental Prestige Electronics

USA . 690 parts In-Stock

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Argo Parts USA

USA . 211 parts In-Stock

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$3,439.040

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$3,369.564

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$3,369.564

Qasali Group International

UK . 3,116 parts In-Stock

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Vigor

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Overview

Unleash the power of innovation with the XCZU7CG-1FFVC1156I by Xilinx. As a leader in the industry, Xilinx delivers top-quality products that exceed expectations. This versatile microprocessor circuit offers endless possibilities in various applications. From enhancing performance to increasing efficiency, this product provides unmatched value and benefits to customers. Elevate your projects to new heights with the XCZU7CG-1FFVC1156I and experience the difference that Xilinx technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and cost-effective.

Surface Mount: YES

With surface mount capability, the product can be easily integrated onto circuit boards, saving space and allowing for efficient assembly.

Maximum Supply Voltage: 0.876 V

The high maximum supply voltage allows for stable operation under varying voltage conditions, ensuring reliable performance.

Package Shape: RECTANGULAR

The rectangular package shape is space-efficient and facilitates easy placement on circuit boards.

No. of Terminals: 1156

The large number of terminals provides ample connectivity options, making the product versatile for various applications.

Package Style (Meter): GRID ARRAY

The grid array package style enhances thermal performance and allows for efficient heat dissipation, leading to better overall product reliability.

Minimum Operating Temperature: -40 °C

The wide operating temperature range ensures that the product can function reliably in extreme temperature conditions.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature minimizes the risk of damage to the product during assembly processes, improving manufacturing yield.

Technology: CMOS

The use of CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Moisture Sensitivity Level (MSL): 4

The moisture sensitivity level of 4 indicates that the product is less sensitive to moisture during storage and assembly, increasing its shelf life and reliability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU7CG-1FFVC1156I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B1156

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU7CG-1FFVC1156I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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