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XCZU6EG-2FFVC900I

Xilinx

XCZU6EG-2FFVC900I by Xilinx

XCZU6EG-2FFVC900I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance and reliability.

Median Price

$3,967.610

Lifecycle Status

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Nova Conductors

Japan . 35 parts In-Stock

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Vyrian

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AZTECH Wire

Italy . 300 parts In-Stock

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$13.380

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Semicontronic

India . 1,512 parts In-Stock

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Modulus Dynamics

Lithuania . 1,054 parts In-Stock

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MARBEL Systems

Belgium . 23,046 parts In-Stock

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Texas Native Microelectronics

USA . 450 parts In-Stock

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Kenton Components

USA . 1,598 parts In-Stock

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Ampacity Inc.

Singapore . 1,595 parts In-Stock

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One Stop Electronics

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Qasali Group International

UK . 1,324 parts In-Stock

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Corohmni

South Africa . 2,411 parts In-Stock

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Aztec Data Supply Inc.

USA . 3,976 parts In-Stock

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Microchip USA

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Aranea Global

USA . 100 parts In-Stock

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$3,888.258

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Continental Prestige Electronics

USA . 5,742 parts In-Stock

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Argo Parts USA

USA . 5,255 parts In-Stock

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$3,848.582

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QUARKTWIN TECHNOLOGY LTD

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Supply Digital

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Vigor

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Corphita

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Overview

Unlock the power of cutting-edge technology with the XCZU6EG-2FFVC900I from Xilinx. As a leading manufacturer in the industry, Xilinx delivers top-quality products that guarantee reliability and performance. Ideal for a wide range of applications in the Other Function uPs,uCs & Peripheral ICs category, this product offers unparalleled value to customers looking for advanced solutions. Experience seamless operation, efficient functionality, and innovative design with the XCZU6EG-2FFVC900I, setting new standards in the industry. Elevate your projects with this exceptional microprocessor circuit today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and protection to the components inside, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving time and space in the assembly process.

Maximum Supply Voltage: 0.876 V

The high maximum supply voltage ensures stable and reliable performance even under varying electrical conditions.

Package Shape: RECTANGULAR

The rectangular shape makes it compatible with a wide range of applications and easier to integrate into various designs.

No. of Terminals: 900

The large number of terminals allows for versatile connectivity options and greater functionality in the overall system.

Package Style (Meter): GRID ARRAY

The grid array package style offers excellent thermal performance and efficient heat dissipation for optimal operation.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows for reliable operation in harsh environments or extreme conditions.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The use of multiple terminal finish options ensures strong and reliable connections for improved signal transmission.

Moisture Sensitivity Level (MSL): 4

MSL 4 indicates that the product has a moderate level of moisture sensitivity, making it suitable for a variety of storage and operating conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU6EG-2FFVC900I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B900

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

900

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU6EG-2FFVC900I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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