Loading...

XOMAP3530DCUS

Texas Instruments

XOMAP3530DCUS by Texas Instruments

XOMAP3530DCUS by Texas Instruments is a 32-bit microprocessor with integrated cache and 16-bit external data bus width. It operates at a max clock frequency of 59 MHz, making it suitable for low power mode applications in devices requiring high-speed processing capabilities. The package style is grid array with a terminal pitch of 0.65 mm, ideal for compact designs where space-saving is crucial.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,217 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,217

-

-

-

-

Digiode

USA . 620 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

620

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 224 parts In-Stock

1+ parts

$10.836

100+ parts

-

1k+ parts

-

10k+ parts

-

224

$10.836

-

-

-

Parana Technologies

USA . 1,062 parts In-Stock

1+ parts

$18.889

100+ parts

-

1k+ parts

$18.964

10k+ parts

-

1,062

$18.889

-

$18.964

-

DigiPath Technology Company

USA . 1,830 parts In-Stock

1+ parts

$20.800

100+ parts

$19.136

1k+ parts

-

10k+ parts

-

1,830

$20.800

$19.136

-

-

ChromeModa Solutions

Germany . 5,303 parts In-Stock

1+ parts

$21.224

100+ parts

$17.404

1k+ parts

-

10k+ parts

-

5,303

$21.224

$17.404

-

-

IDEA Electronic Components Group

UK . 8 parts In-Stock

1+ parts

$21.224

100+ parts

$20.163

1k+ parts

$19.102

10k+ parts

-

8

$21.224

$20.163

$19.102

-

One Stop Electronics

USA . 387 parts In-Stock

1+ parts

$32.000

100+ parts

-

1k+ parts

-

10k+ parts

-

387

$32.000

-

-

-

Corphita

USA . 3,760 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,760

-

-

-

-

Overview

Experience unparalleled performance and efficiency with the XOMAP3530DCUS by Texas Instruments. As a trusted leader in microprocessor technology, Texas Instruments delivers top-quality products that exceed industry standards. Ideal for a wide range of applications, this microprocessor offers integrated cache and low power mode, ensuring optimal functionality while maximizing energy savings. With a compact square package shape and fine pitch terminal style, the XOMAP3530DCUS provides seamless integration and reliable performance. Upgrade your systems with Texas Instruments' cutting-edge technology and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and cost-effective.

Integrated Cache: YES

Having integrated cache helps in improving the overall performance of the microprocessor by reducing the average time to access memory.

Surface Mount: YES

The surface mount capability enables easy and efficient installation of the microprocessor on circuit boards.

Address Bus Width: 26

With a wider address bus width, the microprocessor can access a larger range of memory locations, enhancing its processing capability.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the circuit board, optimizing the overall layout.

Bit Size: 32

A bit size of 32 provides higher processing power and enables the microprocessor to handle more complex tasks.

Power Supplies (V): 1.1, 1.8, 3.3

The availability of multiple power supply options gives flexibility in designing systems with different power requirements.

No. of Terminals: 423

Having a high number of terminals allows for a greater number of connections, enabling the microprocessor to interface with a variety of peripherals.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The combination of grid array, low profile, and fine pitch package style facilitates efficient heat dissipation and compact design.

Terminal Position: BOTTOM

The bottom terminal position simplifies the mounting process and ensures secure connections with other components.

Maximum Seated Height: 1.4 mm

The low maximum seated height allows for a slim profile, ideal for applications where space is limited.

Width: 16 mm

The compact width makes the microprocessor suitable for small form factor devices and tight spaces.

Boundary Scan: YES

Having boundary scan capability facilitates testing and diagnostics during the manufacturing process, ensuring product quality.

External Data Bus Width: 16

The external data bus width of 16 enhances data transfer efficiency and speeds up overall processing tasks.

Maximum Clock Frequency: 59 MHz

With a high maximum clock frequency, the microprocessor can execute instructions quickly, enhancing system performance.

Length: 16 mm

The short length of the microprocessor contributes to space-saving designs and compact electronic devices.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC microprocessor, it offers simplified instruction set architecture for faster and more efficient processing.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and fast switching speeds, making the microprocessor energy-efficient and reliable.

Terminal Form: BALL

The ball terminal form ensures secure connections and reliable contact with the circuit board.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for denser packaging of terminals, increasing connectivity options and overall flexibility.

Format: FLOATING POINT

Supporting floating-point format enhances the microprocessor's ability to perform complex mathematical calculations with precision.

Speed: 600 rpm

With a speed of 600 rpm, the microprocessor can efficiently handle high-speed operations and demanding computing tasks.

Low Power Mode: YES

Having a low power mode option allows for power-saving operation when full processing power is not required, extending battery life in portable devices.

Technical Specifications

Microprocessors XOMAP3530DCUS attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

59 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B423

Length:

16 mm

Low Power Mode:

YES

No. of Terminals:

423

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA423,24X24,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.1,1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Speed:

600 rpm

Sub-Category:

Graphics Processors

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Width:

16 mm

Peripheral IC Type:

Trade Compliance

XOMAP3530DCUS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 19