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XOMAP3530DCUSE

Texas Instruments

XOMAP3530DCUSE by Texas Instruments

XOMAP3530DCUSE by Texas Instruments is a Microprocessor with 32-bit External Data Bus, 15-bit Address Bus, and 38.4 MHz Max Clock Frequency. Ideal for low power applications in mobile devices due to its CMOS technology and integrated cache feature.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,464 parts In-Stock

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4,464

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Vyrian

USA . 3,197 parts In-Stock

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3,197

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Distributors (Availability)

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AZTECH Wire

Italy . 333 parts In-Stock

1+ parts

$13.296

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333

$13.296

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Parana Technologies

USA . 2,097 parts In-Stock

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$22.438

100+ parts

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$23.109

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2,097

$22.438

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$23.109

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ChromeModa Solutions

Germany . 6,949 parts In-Stock

1+ parts

$25.211

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$20.673

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6,949

$25.211

$20.673

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IDEA Electronic Components Group

UK . 199 parts In-Stock

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$25.211

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$23.950

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$22.690

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199

$25.211

$23.950

$22.690

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One Stop Electronics

USA . 1,289 parts In-Stock

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$33.000

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1,289

$33.000

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DigiPath Technology Company

USA . 1,118 parts In-Stock

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$22.730

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1,118

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$22.730

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Corphita

USA . 380 parts In-Stock

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Overview

Unleash the power of innovation with the XOMAP3530DCUSE by Texas Instruments. This cutting-edge microprocessor boasts integrated cache and a fast clock frequency, making it ideal for a wide range of applications. With Texas Instruments' reputation for quality and reliability, you can trust that this product will deliver exceptional performance. Whether you're designing a new mobile device or optimizing industrial automation systems, the XOMAP3530DCUSE offers unmatched value and efficiency. Elevate your projects to new heights with this state-of-the-art microprocessor from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material makes the product lightweight and cost-effective.

Integrated Cache: YES

Having integrated cache improves the processing speed and efficiency of the microprocessor.

Surface Mount: YES

The surface mount capability makes it easy to integrate this microprocessor into various electronic devices.

Address Bus Width: 15

A wider address bus width allows for better memory addressing capabilities.

No. of Terminals: 423

Higher number of terminals provide more connectivity options and flexibility in circuit design.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The package style of grid array, low profile, and fine pitch allows for efficient heat dissipation and space-saving design.

Terminal Position: BOTTOM

Bottom terminal positioning enables easier soldering and integration into PCBs.

Maximum Seated Height: 1.4 mm

The low maximum seated height helps in compact device designs with limited space.

Width: 16 mm

Compact width enables the microprocessor to be used in space-constrained applications.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and debugging of the microprocessor.

External Data Bus Width: 32

A wider external data bus width enhances data transfer speeds and overall performance.

Maximum Clock Frequency: 38.4 MHz

Higher clock frequency results in faster processing speeds and better performance.

Length: 16 mm

Compact length makes the microprocessor suitable for small form factor devices.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC architecture offers efficient processing and improved performance for the microprocessor.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for reliable operation.

Terminal Form: BALL

Ball terminal form provides reliable electrical connections and secure mounting.

Nominal Supply Voltage: 1.15 V

Low nominal supply voltage helps in reducing power consumption and heat generation.

Terminal Pitch: 0.65 mm

Narrow terminal pitch allows for high-density mounting and compact PCB designs.

Format: FLOATING POINT

Floating point format enables precise mathematical calculations and improved accuracy.

Speed: 600 rpm

High speed of 600 rpm allows for quick data processing and computation tasks.

Low Power Mode: YES

Low power mode helps in reducing energy consumption and extending battery life in portable devices.

Technical Specifications

Microprocessors XOMAP3530DCUSE attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

15

Boundary Scan:

YES

Maximum Clock Frequency:

38.4 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B423

Length:

16 mm

Low Power Mode:

YES

No. of Terminals:

423

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.4 mm

Speed:

600 rpm

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Width:

16 mm

Peripheral IC Type:

Trade Compliance

XOMAP3530DCUSE Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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