Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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XOMAP3530DCUSE by Texas Instruments is a Microprocessor with 32-bit External Data Bus, 15-bit Address Bus, and 38.4 MHz Max Clock Frequency. Ideal for low power applications in mobile devices due to its CMOS technology and integrated cache feature.
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Digiode
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Vyrian
AZTECH Wire
$13.296
Parana Technologies
$22.438
$23.109
ChromeModa Solutions
$25.211
$20.673
IDEA Electronic Components Group
$23.950
$22.690
One Stop Electronics
$33.000
DigiPath Technology Company
$22.730
Corphita
The use of plastic/epoxy for the package body material makes the product lightweight and cost-effective.
Having integrated cache improves the processing speed and efficiency of the microprocessor.
The surface mount capability makes it easy to integrate this microprocessor into various electronic devices.
A wider address bus width allows for better memory addressing capabilities.
Higher number of terminals provide more connectivity options and flexibility in circuit design.
The package style of grid array, low profile, and fine pitch allows for efficient heat dissipation and space-saving design.
Bottom terminal positioning enables easier soldering and integration into PCBs.
The low maximum seated height helps in compact device designs with limited space.
Compact width enables the microprocessor to be used in space-constrained applications.
Boundary scan capability allows for efficient testing and debugging of the microprocessor.
A wider external data bus width enhances data transfer speeds and overall performance.
Higher clock frequency results in faster processing speeds and better performance.
Compact length makes the microprocessor suitable for small form factor devices.
RISC architecture offers efficient processing and improved performance for the microprocessor.
CMOS technology offers low power consumption and high noise immunity for reliable operation.
Ball terminal form provides reliable electrical connections and secure mounting.
Low nominal supply voltage helps in reducing power consumption and heat generation.
Narrow terminal pitch allows for high-density mounting and compact PCB designs.
Floating point format enables precise mathematical calculations and improved accuracy.
High speed of 600 rpm allows for quick data processing and computation tasks.
Low power mode helps in reducing energy consumption and extending battery life in portable devices.
Microprocessors XOMAP3530DCUSE attributes and parameters. Explore more Microprocessors devices from Texas Instruments
Address Bus Width:
Boundary Scan:
Maximum Clock Frequency:
External Data Bus Width:
Format:
Integrated Cache:
JESD-30 Code:
Length:
Low Power Mode:
No. of Terminals:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Maximum Seated Height:
Speed:
Nominal Supply Voltage:
Surface Mount:
Technology:
Terminal Form:
Terminal Pitch:
Terminal Position:
Width:
Peripheral IC Type:
XOMAP3530DCUSE Peripheral ICs trade compliance attributes, and parameters.
ECCN
3A991.A.2
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
1N4148WS
Jiangsu Changjiang Electronics Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM107H/883
Rochester Electronics
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Maximum Average Bias Current (IIB): .1 uA;
BSS138
Siemens
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Drain-Source On Resistance: 3.5 ohm; Terminal Finish: Tin/Lead (Sn/Pb);
1N4148
Shandong Yiguang Electronic Joint Stock
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Hitachi
MBRS1100T3G
Onsemi
MBRS1100T3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.75V. It operates in temperatures ranging from -65 to 175°C, making it suitable for power applications. With a reverse test voltage of 100V, this diode is ideal for high-power circuits requiring efficient rectification.
SS14
Jinan Jingheng Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Vishay Intertechnology
Vishay Intertechnology's LL4148 diode features a max reverse recovery time of 0.004 us, forward voltage of 1 V, and output current of 0.15 A. Ideal for rectification applications in electronics due to its high efficiency and low power dissipation capabilities.
2N2222A
Loras Industries
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BAV99+
Multicomp Pro
BAV99+ by Multicomp Pro is a series connected diode with 0.2A output current and 75V peak reverse voltage. Its 0.006us reverse recovery time makes it ideal for high-speed applications. This small outline rectifier diode is designed for surface mount installation in electronic circuits.
Microsemi
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM358N
NXP Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
EU2B-YS3203C
Idec
ROTARY SWITCH;
LM555CM
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
LM358M
Fairchild Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
STM32H743XIH6
STMicroelectronics
STM32H743XIH6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, 36-Ch 16-Bit ADC, and 2-Ch 12-Bit DAC. It operates at up to 48 MHz, has 1085440 bytes of RAM, and offers connectivity options like CAN, I2C, USB. Ideal for industrial applications requiring high-performance processing and extensive peripheral support.
CRG0805F10R
TE Connectivity
TE Connectivity's CRG0805F10R is a 10 ohm fixed resistor with 1% tolerance and 0.125 W power dissipation. It features thick film technology, SMT package style, and matte tin over nickel terminal finish. Ideal for surface mount applications in electronics, offering a temperature coefficient of 200 ppm/°C and operating voltage of 150 V.
Diodes Incorporated
Synsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MCF5251CVM140
NXP Semiconductors' MCF5251CVM140 microprocessor features 32-bit architecture, 140 MHz clock frequency, and 24-bit address bus width. Ideal for industrial applications requiring high-speed processing in a compact square package with ball terminals.
MIMXRT1064DVJ6B
NXP Semiconductors' MIMXRT1064DVJ6B microprocessor features 32-bit architecture, 1.3V max supply voltage, and 24MHz clock frequency. Ideal for low power applications, it offers integrated cache, 1048576 RAM words, and 32 DMA channels for efficient data processing in various electronic devices.
MC7448VU800ND
Freescale Semiconductor
MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 360; Package Code: LGA; Package Shape: SQUARE;
ADSP-21488KSWZ-4B1
Analog Devices
ADSP-21488KSWZ-4B1 by Analog Devices is a 40-bit microprocessor with 24-bit address bus width and 16-bit external data bus width. It operates at a max clock frequency of 25 MHz, making it suitable for applications requiring high-speed processing in commercial temperature environments. The package style includes flatpack, heat sink/slug, low profile, and fine pitch options for versatile integration.
P1010NXE5HHA
The NXP Semiconductors P1010NXE5HHA microprocessor features a 32-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for industrial applications, it operates at temperatures ranging from -40 to 105°C with a max supply voltage of 1.05V. This microprocessor is designed in a square package style with 425 terminals for surface mount assembly.
STM32MP153AAD3T
MICROPROCESSOR, RISC; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
MCF5329CVM240
The NXP Semiconductors MCF5329CVM240 microprocessor features a 32-bit architecture, 80 MHz clock frequency, and integrated cache. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities. With a temperature range of -40 to 85°C, it is suitable for various embedded systems.
ATSAMA5D27C-D1G-CUR
Microchip Technology
ATSAMA5D27C-D1G-CUR by Microchip Technology is a 16-bit microprocessor with integrated cache, operating at up to 24 MHz. Ideal for industrial applications, it features 51 DMA channels and low power mode for efficient performance. Package style: Grid Array, Thin Profile, Fine Pitch.
AT91SAM9261B-CU-999
Microchip Technology's AT91SAM9261B-CU-999 is a 32-bit RISC microprocessor with 8-bit data RAM width and 26-bit address bus width. It features integrated cache, operates at up to 20 MHz, and has low power mode for industrial applications.
AM3894CCYG120
Texas Instruments
The Texas Instruments AM3894CCYG120 microprocessor features 32-bit architecture, 8-word data RAM width, and a clock frequency of up to 27 MHz. Ideal for applications requiring high-speed processing such as embedded systems, industrial automation, and networking equipment.
14305R-2000
Echelon
MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
MCIMX6QP6AVT8AB
MCIMX6QP6AVT8AB by NXP Semiconductors is a MICROPROCESSOR with CMOS technology. It operates b/w -40 to 125 °C and has a max supply voltage of 1.5 V. Ideal for automotive applications due to its fine pitch GRID ARRAY package style.
MIMXRT1061DVL6B
MICROCONTROLLER, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1; Peak Reflow Temperature (C): 260;
MCF5282CVM66
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: LFBGA; Package Shape: SQUARE;
XAM5718AABCXEA
XAM5718AABCXEA by Texas Instruments is a microprocessor with 32-bit external data bus width, 16-bit address bus width, and max clock frequency of 38.4 MHz. It is used in industrial applications requiring low power mode and features a CMOS technology with terminal finish of Tin Silver Copper.
KMPC885VR133
KMPC885VR133 by Freescale Semiconductor is a 32-bit microprocessor with integrated cache and low power mode. It operates at a speed of 133 rpm, with a max supply voltage of 1.9 V. This processor is commonly used in applications requiring high performance and low power consumption.
KMPC8347VVAJFB
KMPC8347VVAJFB by Freescale Semiconductor is a 32-bit microprocessor with integrated cache and low power mode. It operates at a max clock frequency of 66 MHz, suitable for applications requiring high-speed processing in industrial environments. The package style is grid array, making it ideal for surface mount assembly with 672 terminals.
STM32MP153AAB3T
AM5K2E04XABD4
The Texas Instruments AM5K2E04XABD4 microprocessor features integrated cache, 64-bit external data bus width, and 16-bit address bus width. Ideal for applications requiring high-speed processing and low power consumption in a compact form factor.
MPC8323ECVRADDCA
NXP Semiconductors' MPC8323ECVRADDCA is a 32-bit microprocessor with integrated cache, operating at a max clock frequency of 66.67 MHz. This CMOS technology chip features low power mode and boundary scan capabilities, making it ideal for applications requiring high-speed processing in compact devices.
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DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
XOMAP3530FCBCE
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 515; Package Code: VFBGA; Package Shape: SQUARE; Format: FLOATING POINT;
XOMAP3530DCBB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 515; Package Code: VFBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH;
XOMAP3525CCUS
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 423; Package Code: LFBGA; Package Shape: SQUARE; Length: 16 mm;
XOMAP3530FCBC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 515; Package Code: VFBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
XOMAP3530DCUS
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 423; Package Code: LFBGA; Package Shape: SQUARE; Power Supplies (V): 1.1,1.8,3.3;
XOMAP3530BCUS
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 423; Package Code: VFBGA; Package Shape: SQUARE; Minimum Supply Voltage: 1.71 V;
XOMAP3530FCUS
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 423; Package Code: LFBGA; Package Shape: SQUARE; External Data Bus Width: 32;
XOMAP3525BCUS
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 423; Package Code: VFBGA; Package Shape: SQUARE; Qualification: Not Qualified;
XOMAP3530DCBC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 515; Package Code: VFBGA; Package Shape: SQUARE; Integrated Cache: YES;
XOMAP3530BCBB
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 515; Package Code: VFBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
XOMAP3530ECBB
XOMAP3530DCUSD
XOMAP3530BCBC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 515; Package Code: VFBGA; Package Shape: SQUARE; Package Equivalence Code: BGA515,26X26,20;
XOMAP3530FCBCD
XOMAP3525CCBC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 515; Package Code: VFBGA; Package Shape: SQUARE; Nominal Supply Voltage: 1.15 V;
XOMAP3530CCBC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 515; Package Code: VFBGA; Package Shape: SQUARE; Technology: CMOS;
XOMAP3525BCBB
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 515; Package Code: VFBGA; Package Shape: SQUARE; Minimum Supply Voltage: 1.71 V;
XOMAP3525CCBB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 515; Package Code: VFBGA; Package Shape: SQUARE; Address Bus Width: 15;
XOMAP3530BCBBE
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 515; Package Code: VFBGA; Package Shape: SQUARE; Maximum Seated Height: .9 mm;
Supply Digital Components
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