Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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XOMAP3530CCBC by Texas Instruments is a microprocessor with 32-bit external data bus width, 15-bit address bus width, and max clock frequency of 38.4 MHz. It is used in applications requiring low power mode, such as mobile devices and embedded systems.
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Corphita
The plastic/epoxy package body material is lightweight and durable, making it easy to handle and resistant to damage during installation or handling.
Having integrated cache improves the overall performance of the microprocessor by reducing the time it takes to access frequently used data and instructions.
The surface mount feature allows for easy and efficient installation on printed circuit boards, saving space and simplifying the assembly process.
A wider address bus width allows the microprocessor to access a larger range of memory locations, enhancing its capability to handle complex tasks and data processing.
The square package shape is compact and space-efficient, making it ideal for applications where board space is limited.
The high number of terminals provides enhanced connectivity options and allows for more efficient data transfer and communication with other components.
The grid array package style with a very thin profile and fine pitch ensures high-density mounting and precise connections, improving overall performance and reliability.
Having terminals positioned at the bottom facilitates better heat dissipation and allows for easier routing of signal traces on the PCB, enhancing overall system performance.
The low maximum seated height enables a slim and compact design, making it suitable for space-constrained applications such as mobile devices or embedded systems.
The compact width of the microprocessor allows for efficient placement on the PCB and enables space-saving design configurations.
The boundary scan feature allows for efficient testing and debugging of the microprocessor during manufacturing, ensuring a higher level of quality control.
A wider external data bus width enhances the speed and efficiency of data transfer between the microprocessor and other components, improving overall system performance.
The high maximum clock frequency enables fast processing speeds and responsiveness, making the microprocessor suitable for demanding computational tasks.
The compact length of the microprocessor allows for flexible placement on the PCB and enables space-saving design options.
The microprocessor with RISC architecture offers simplified instruction sets and fast execution, making it ideal for applications requiring high performance and efficiency.
The CMOS technology used in the microprocessor ensures low power consumption and high reliability, making it suitable for battery-powered devices and energy-efficient applications.
The ball terminal form provides reliable electrical connections and enables efficient heat dissipation, enhancing the overall performance and longevity of the microprocessor.
The low nominal supply voltage contributes to energy efficiency and reduces power consumption, making the microprocessor suitable for applications requiring low power operation.
The small terminal pitch allows for dense packing of terminals on the PCB, enabling high-speed data transfer and efficient signal routing for improved system performance.
The floating-point format enhances the microprocessor's capability to perform complex mathematical calculations with high precision, making it suitable for scientific and engineering applications.
The high speed of 600 rpm enables fast data processing and efficient task execution, making the microprocessor well-suited for time-critical applications and real-time systems.
The low power mode feature allows for reduced power consumption during idle or low-usage periods, extending battery life and enhancing energy efficiency in portable devices.
Microprocessors XOMAP3530CCBC attributes and parameters. Explore more Microprocessors devices from Texas Instruments
Address Bus Width:
Boundary Scan:
Maximum Clock Frequency:
External Data Bus Width:
Format:
Integrated Cache:
JESD-30 Code:
Length:
Low Power Mode:
No. of Terminals:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Maximum Seated Height:
Speed:
Nominal Supply Voltage:
Surface Mount:
Technology:
Terminal Form:
Terminal Pitch:
Terminal Position:
Width:
Peripheral IC Type:
XOMAP3530CCBC Peripheral ICs trade compliance attributes, and parameters.
ECCN
3A991.A.2
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
STM32H753IIT6
STMicroelectronics
STM32H753IIT6 by STMicroelectronics is a 32-bit microcontroller with 176 terminals, operating at up to 48 MHz. It features 20-Ch 16-Bit ADCs and 2-Ch 12-Bit DACs, suitable for industrial applications requiring high-speed data processing and connectivity via CAN, ETHERNET, USB, and more.
LM358N
NXP Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
LM2931Z-5.0G
Onsemi
LM2931Z-5.0G by Onsemi is a Fixed Positive Single Output LDO Regulator with 5V output voltage, 0.6V dropout voltage, and 0.1A output current. It is ideal for applications requiring stable power supply in temperature-sensitive environments due to its operating range of -40°C to 125°C.
M39029/58360
Souriau
CONNECTOR ACCESSORY; Associated Military - Specifications: MIL-DTL-38999; Tool Settings: M22520/2-09; Terminal Type: CRIMP; MIL Conformity: YES; Mating Contacts: M39029/56348;
BAV99
MICRODIODE ELECTRONICS SHENZHEN CO LTD
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002-T1-E3
Vishay Intertechnology
Vishay Intertechnology's 2N7002-T1-E3 is a N-CHANNEL FET for SWITCHING applications. Features include 60V DS Breakdown Voltage, 0.115A Drain Current, and 7.5 ohm On Resistance. With ENHANCEMENT MODE operation, this GULL WING transistor is ideal for small outline surface mount designs up to 150°C.
2N7002
Itt Semiconductor
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Package Shape: RECTANGULAR;
SN65HVD234DR
Texas Instruments
SN65HVD234DR by Texas Instruments is an 8-terminal interface circuit with a data rate of 1 Mbps. Operating temperature ranges from -40 to 125 °C, making it ideal for automotive applications. With a supply voltage of 3.3 V and low current draw of 6 mA, it's suitable for network interfaces in compact designs.
Teledyne Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; JESD-30 Code: R-PDSO-G3; Maximum Operating Temperature: 150 Cel; No. of Terminals: 3;
LM358MX
ROHM
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR;
BSS138
Siemens
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Drain-Source On Resistance: 3.5 ohm; Terminal Finish: Tin/Lead (Sn/Pb);
2N2222A
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Maximum Operating Temperature: 150 Cel;
Sinyork
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Operating Temperature: 85 Cel; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Operating Mode: ENHANCEMENT MODE;
1N4148WS
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
International Devices
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Vishay Sprague
SS14+
Multicomp Pro
SS14+ by Multicomp Pro is a Schottky rectifier diode with a max output current of 1A and a reverse test voltage of 40V. It is designed for surface mount applications in electronic circuits, offering a small outline package style and dual terminal position. With a temperature range from -65°C to 150°C, it is suitable for various industrial and consumer electronics.
1N4148
Semitron
RECTIFIER DIODE; Surface Mount: NO; JESD-609 Code: e0; Maximum Output Current: .15 A; Maximum Operating Temperature: 200 Cel; Maximum Reverse Recovery Time: .004 us;
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): 1 V; No. of Elements: 1; Maximum Output Current: .2 A; Config: SINGLE;
MMBF170LT1G
MMBF170LT1G by Onsemi is a N-CHANNEL FET with 60V DS Breakdown Voltage and 0.5A Drain Current. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE with a max power dissipation of 0.225W. This small outline transistor has a temperature range from -55 to 150 °C.
SAMA7G54-V/4HB
Microchip Technology
SAMA7G54-V/4HB by Microchip Technology is a microprocessor with integrated cache and 16-bit external data bus width. It operates at a max clock frequency of 50 MHz, suitable for low power mode applications. With 72 DMA channels, this CMOS technology processor is ideal for high-speed computing tasks in industrial automation systems.
MPC860DEVR80D4
Freescale Semiconductor
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 245;
ATSAMA5D27C-D1G-CU
ATSAMA5D27C-D1G-CU by Microchip Technology is a 16-bit microprocessor with integrated cache, operating at up to 24 MHz. Ideal for industrial applications, it features 65536 RAM words and 51 DMA channels, with low power mode and boundary scan support.
MCIMX6U5EVM10ACR
MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;
MCF5475ZP266
NXP Semiconductors' MCF5475ZP266 microprocessor features 32-bit address and external data bus width, operates at a max clock frequency of 66.66 MHz. Ideal for commercial applications requiring low power mode, this RISC-based processor has integrated cache and supports boundary scan technology.
CS80C286-16
Rochester Electronics
MICROPROCESSOR; Temperature Grade: COMMERCIAL; Terminal Form: J BEND; No. of Terminals: 68; Package Shape: SQUARE; Integrated Cache: NO;
LS1012ASE7EKB
LS1012ASE7EKB by NXP Semiconductors is a 64-bit microprocessor with 16-bit external data bus width, operating at a max clock frequency of 25 MHz. It features integrated cache, low power mode, and boundary scan capabilities. Ideal for applications requiring high-speed processing in compact devices.
AT91SAM9M10C-CU
Atmel
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: TFBGA; Package Shape: SQUARE;
P1011NSN2DFB
The NXP Semiconductors P1011NSN2DFB microprocessor features a 32-bit architecture with integrated cache and 16-bit address bus width. It is designed for applications requiring high-speed processing, with a max supply voltage of 1.05 V and external data bus width of 32 bits. The package style is grid array, making it suitable for surface mount configurations in various electronic devices.
MCF54452CVR200
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 360; Package Code: BGA; Package Shape: SQUARE;
AM3517AZERC
AM3517AZERC by Texas Instruments is a microprocessor with 16-bit address bus, 8-bit on-chip data RAM width, and integrated cache. It operates at a max clock frequency of 26 MHz and has low power mode for energy efficiency. Ideal for applications requiring high-speed processing in compact devices.
MIMXRT1061DVJ6B
MICROCONTROLLER, RISC; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN SILVER; JESD-609 Code: e2;
MIMXRT1051DVJ6B
NXP Semiconductors' MIMXRT1051DVJ6B is a 32-bit microprocessor with integrated cache, 524288 RAM words, and 29 serial I/Os. Ideal for low power applications, it operates at up to 24 MHz clock frequency and features boundary scan technology. With a package style of grid array, this CMOS processor is suitable for various embedded systems requiring high-speed data processing.
ADSP-21489KSWZ-4A
Analog Devices
ADSP-21489KSWZ-4A by Analog Devices is a 40-bit microprocessor with integrated cache and a max clock frequency of 25 MHz. It is commonly used in applications requiring high-speed processing and floating-point calculations.
MPC8280CVVUPEA
NXP Semiconductors' MPC8280CVVUPEA microprocessor features 32-bit address and data bus width, with integrated cache. Suitable for industrial applications, it operates b/w -40 to 105°C, with a max supply voltage of 1.6V. The package style is grid array, low profile, with 480 terminals in a square shape.
STM32MP131AAF3
STM32MP131AAF3 by STMicroelectronics is a 32-bit microprocessor with integrated cache and 48 MHz clock frequency. It features 172032 RAM words, 56 DMA channels, and operates b/w -40 to 125 °C. Ideal for low power applications in IoT devices due to its compact size and high-speed processing capabilities.
ATSAMA5D35A-CN
ATSAMA5D35A-CN by Microchip Technology is a 32-bit microprocessor with 131072 RAM words, 48 MHz clock frequency, and 39 DMA channels. Ideal for industrial applications, it features a low profile grid array package with a max operating temperature of 105°C.
MPC8321ECVRADDCA
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B516;
MPC8343CVRAGDB
MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 620; Package Code: BGA; Package Shape: SQUARE;
STM32MP135CAG3
STM32MP135CAG3 by STMicroelectronics is a 32-bit microprocessor with 172032 RAM words, 48 MHz clock frequency, and 56 DMA channels. It is used in applications requiring a RISC peripheral IC with low power mode, such as IoT devices and embedded systems.
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CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
XOMAP3530FCBCE
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 515; Package Code: VFBGA; Package Shape: SQUARE; Format: FLOATING POINT;
XOMAP3530DCBB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 515; Package Code: VFBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH;
XOMAP3525CCUS
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 423; Package Code: LFBGA; Package Shape: SQUARE; Length: 16 mm;
XOMAP3530FCBC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 515; Package Code: VFBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
XOMAP3530DCUS
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 423; Package Code: LFBGA; Package Shape: SQUARE; Power Supplies (V): 1.1,1.8,3.3;
XOMAP3530BCUS
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 423; Package Code: VFBGA; Package Shape: SQUARE; Minimum Supply Voltage: 1.71 V;
XOMAP3530FCUS
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 423; Package Code: LFBGA; Package Shape: SQUARE; External Data Bus Width: 32;
XOMAP3525BCUS
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 423; Package Code: VFBGA; Package Shape: SQUARE; Qualification: Not Qualified;
XOMAP3530DCBC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 515; Package Code: VFBGA; Package Shape: SQUARE; Integrated Cache: YES;
XOMAP3530BCBB
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 515; Package Code: VFBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
XOMAP3530ECBB
XOMAP3530DCUSD
XOMAP3530BCBC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 515; Package Code: VFBGA; Package Shape: SQUARE; Package Equivalence Code: BGA515,26X26,20;
XOMAP3530FCBCD
XOMAP3525CCBC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 515; Package Code: VFBGA; Package Shape: SQUARE; Nominal Supply Voltage: 1.15 V;
XOMAP3525BCBB
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 515; Package Code: VFBGA; Package Shape: SQUARE; Minimum Supply Voltage: 1.71 V;
XOMAP3525CCBB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 515; Package Code: VFBGA; Package Shape: SQUARE; Address Bus Width: 15;
XOMAP3530BCBBE
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 515; Package Code: VFBGA; Package Shape: SQUARE; Maximum Seated Height: .9 mm;
XOMAP3530DCUSE
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 423; Package Code: LFBGA; Package Shape: SQUARE; Nominal Supply Voltage: 1.15 V;
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