Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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XOMAP3530BCUS by Texas Instruments is a microprocessor with integrated cache and low power mode. It operates at a max clock frequency of 19.2 MHz, suitable for applications requiring high-speed processing in compact devices. With a package style of grid array and very thin profile, it is ideal for space-constrained designs in various electronic products.
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Plastic/Epoxy material provides durability and protection for the microprocessor, ensuring longevity and reliability.
Integrated cache improves the performance of the microprocessor by reducing data access times and increasing processing speeds.
Higher maximum supply voltage allows for stable operation and flexibility in power requirements.
Square package shape makes the microprocessor easier to handle and install in different devices.
Multiple power supply options provide compatibility with a range of devices and power sources.
Large number of terminals allow for versatile connectivity and integration with other components.
Grid array style with fine pitch and thin profile enhances the microprocessor's performance and makes it suitable for compact devices.
Lower minimum supply voltage helps in reducing power consumption and heat generation, making the microprocessor energy-efficient.
Bottom terminal position facilitates easy and efficient PCB layout and soldering for seamless integration.
Low seated height allows for slim and compact device designs, optimizing space utilization.
Compact width dimension enables the microprocessor to fit in a variety of devices without sacrificing performance.
Boundary scan feature aids in debugging, testing, and diagnosing issues in the microprocessor for improved functionality.
Higher clock frequency allows for faster data processing and improved overall performance of the microprocessor.
Optimal length dimension ensures compatibility and easy integration of the microprocessor in various electronic systems.
Designed as a microprocessor for advanced computing tasks, offering high processing power and efficiency.
CMOS technology provides low power consumption, high speed, and reliability for the microprocessor, making it suitable for various applications.
Ball terminal form offers secure connections and efficient heat dissipation for enhanced performance and reliability.
Stable nominal supply voltage ensures consistent and reliable operation of the microprocessor in different environments.
Fine terminal pitch allows for high-density mounting and increased connectivity options for the microprocessor.
Floating point format enables precise and accurate numerical calculations, enhancing the performance of the microprocessor in complex computations.
High speed of 600 rpm ensures fast data processing and efficient operation of the microprocessor in demanding applications.
Low power mode option increases energy efficiency and reduces power consumption, making the microprocessor more environmentally friendly.
Microprocessors XOMAP3530BCUS attributes and parameters. Explore more Microprocessors devices from Texas Instruments
Address Bus Width:
Boundary Scan:
Maximum Clock Frequency:
External Data Bus Width:
Format:
Integrated Cache:
JESD-30 Code:
Length:
Low Power Mode:
No. of Terminals:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Power Supplies (V):
Qualification:
Maximum Seated Height:
Speed:
Sub-Category:
Maximum Supply Voltage:
Minimum Supply Voltage:
Nominal Supply Voltage:
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Peripheral IC Type:
XOMAP3530BCUS Peripheral ICs trade compliance attributes, and parameters.
HTS
8542.31.00.01
SB
8542.31.00.00
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
2N2222A
Semitronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148WT
Taitron Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
CRCW080510K0FKEA
Vishay Intertechnology
Vishay Intertechnology's CRCW080510K0FKEA is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.125 W power dissipation. Ideal for surface mount applications in automotive electronics due to AEC-Q200 reference standard compliance and -55 to 155 °C operating temperature range.
FDC5614P
MSKSEMI SEMICONDUCTOR
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2 W; Transistor Element Material: SILICON; Minimum DS Breakdown Voltage: 60 V;
BAV99
Kec
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Telcom Semiconductor
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Operating Temperature: 150 Cel; JESD-609 Code: e0;
06035C104KAT2A
KYOCERA AVX
06035C104KAT2A by KYOCERA AVX is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications requiring compact size and reliable performance in various electronic circuits.
Yangzhou Yangjie Electronics
MBRA340T3G
Onsemi
MBRA340T3G by Onsemi is a Schottky rectifier diode with 40V reverse test voltage and 3A max output current. Ideal for power applications, it operates b/w -55 to 150°C, features matte tin terminal finish, and comes in a small outline package.
BAV99WT1G
BAV99WT1G by Onsemi is a series connected diode with 0.006 us reverse recovery time. It is a small outline rectifier diode with 70V peak reverse voltage, ideal for surface mount applications in electronics requiring fast switching and low forward voltage drop.
SS14
Rugao Dachang Electronic
RECTIFIER DIODE; Surface Mount: YES; Maximum Repetitive Peak Reverse Voltage: 40 V; Maximum Forward Voltage (VF): .55 V; No. of Elements: 1; Technology: SCHOTTKY;
C0603X104K5RACAUTO
KEMET Corporation
C0603X104K5RACAUTO by KEMET Corp is a ceramic capacitor with capacitance of 0.1 uF and rated DC voltage of 50 V. It has a temperature coefficient of 15% and can operate b/w -55 to 125 °C. This SMT package is commonly used in automotive applications due to its AEC-Q200 reference standard.
1N4148WS
1N4148
Invensys Sensor Systems
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Reverse Recovery Time: .004 us; Config: SINGLE; Maximum Repetitive Peak Reverse Voltage: 100 V;
LL4148
Rectron
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Rfe International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Semiconductor Technology
Jiangsu Changjiang Electronics Technology
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): .715 V; Maximum Operating Temperature: 150 Cel; Maximum Reverse Recovery Time: .006 us; Maximum Output Current: .2 A;
Minilogic Device
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .625 W; Maximum Collector Current (IC): .001 A;
MC7448HX1400ND
NXP Semiconductors
The NXP Semiconductors MC7448HX1400ND is a 32-bit microprocessor with a max clock frequency of 1400 MHz. It operates at a voltage range of 1.1V to 1.3V and features low power mode for energy efficiency. Ideal for applications requiring high-speed processing in compact devices due to its small package size and ceramic, metal-sealed co-fired body material.
MPC8313EVRAFFC
Freescale Semiconductor
MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 516; Package Code: HBGA; Package Shape: SQUARE;
MCIMX6QP6AVT1AA
MCIMX6QP6AVT1AA by NXP Semiconductors is a 32-bit microprocessor with integrated cache and a max supply voltage of 1.5V. It is commonly used in automotive applications due to its temperature grade, low power mode, and boundary scan capability.
STM32MP135FAF7T
STMicroelectronics
STM32MP135FAF7T by STMicroelectronics is a 32-bit microprocessor with integrated cache, 26-bit address bus width, and 48 MHz max clock frequency. It is ideal for applications requiring low power mode, such as IoT devices, industrial automation, and consumer electronics.
MPC880ZP133
NXP Semiconductors' MPC880ZP133 microprocessor features 32-bit address and external data bus width, with integrated cache and low power mode. Ideal for RISC-based applications, it operates at a speed of 133 rpm and supports a max supply voltage of 1.9 V. The package style is grid array with 357 terminals in a square shape, making it suitable for various electronic devices requiring high processing power in a compact form factor.
FH8065301487717SR3UT
Intel
Intel FH8065301487717SR3UT is a 64-bit microprocessor with 1170 terminals, operating at speeds up to 1910 rpm. Suitable for industrial applications, it features integrated cache, CMOS technology, and a rectangular grid array package shape.
CH80566EE014DT/SLGPP
Intel CH80566EE014DT/SLGPP is a 64-bit microprocessor with 28-bit address bus width and 64-bit external data bus width. It operates at speeds up to 1330 rpm, suitable for industrial applications requiring low power consumption. The processor features integrated cache, boundary scan, and CMOS technology for efficient performance in various electronic devices.
STM32MP135DAG7
STM32MP135DAG7 by STMicroelectronics is a 32-bit microprocessor with integrated cache and 172032 RAM words. It operates at a max clock frequency of 48 MHz, suitable for low power applications in various industries like IoT and consumer electronics. With a terminal pitch of 0.5 mm and boundary scan capability, it offers high performance in a compact package.
SPC5200CBV400B
NXP Semiconductors' SPC5200CBV400B is a 32-bit microprocessor with integrated cache and a max clock frequency of 66 MHz. It is commonly used in industrial applications due to its low power mode and temperature grade.
P2010NXN2KFC
The NXP Semiconductors P2010NXN2KFC microprocessor features a 64-bit external data bus width, 16-bit address bus width, and operates at a max clock frequency of 100 MHz. It is commonly used in applications requiring low power consumption and high processing speeds, such as embedded systems and IoT devices.
MIMXRT1051DVL6BR
MICROPROCESSOR, RISC; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN SILVER COPPER; Peak Reflow Temperature (C): 260; JESD-609 Code: e1; Maximum Time At Peak Reflow Temperature (s): 40;
AM3352BZCZA60
Texas Instruments
AM3352BZCZA60 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words and 16-bit external data bus width. It operates at a max clock frequency of 26 MHz, suitable for industrial applications requiring low power mode and boundary scan capability. With a terminal pitch of 0.8 mm and package style of grid array, it offers high performance in compact designs.
STM32MP131CAF3
STM32MP131CAF3 by STMicroelectronics is a 32-bit microprocessor with 48 MHz clock frequency, 172032 RAM words, and 56 DMA channels. It is used in applications requiring low power mode, such as IoT devices and embedded systems.
AM3517AZERA
AM3517AZERA by Texas Instruments is a microprocessor with 16-bit address bus, 8-bit on-chip data RAM width, and 26 MHz max clock frequency. Ideal for industrial applications requiring high-speed processing in a compact package.
MCF5251CVM140R2
NXP Semiconductors' MCF5251CVM140R2 microprocessor features 32-bit architecture, 140 MHz clock frequency, and 24-bit address bus width. Ideal for industrial applications requiring high-speed processing with a max supply voltage of 1.32 V and operating temperature range from -40 to 85 °C.
STM32MP135AAF3
STM32MP135AAF3 by STMicroelectronics is a 32-bit microprocessor with 8-bit RAM width, 26-bit address bus, and 16-bit external data bus. It operates at a max clock frequency of 48 MHz and has low power mode. Ideal for applications requiring high-speed processing in compact devices.
XPC8240LZU200E
NXP Semiconductors XPC8240LZU200E microprocessor features 32-bit address and data bus width, with a clock frequency of 66 MHz. Suitable for low power applications, it has integrated cache memory and supports boundary scan testing.
CS80C286-25
Harris Semiconductor
MICROPROCESSOR; Temperature Grade: COMMERCIAL; Terminal Form: J BEND; No. of Terminals: 68; Package Code: QCCJ; Package Shape: SQUARE;
P1010NSE5HHA
The NXP Semiconductors P1010NSE5HHA microprocessor features 32-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for applications requiring a high-speed RISC processor with boundary scan capability. Operating temperature range from 0 to 105°C makes it suitable for various industrial environments.
MPC8321ECVRADDCA
NXP Semiconductors' MPC8321ECVRADDCA is a 32-bit microprocessor with integrated cache, operating at a max clock frequency of 66.67 MHz. This CMOS technology chip features low power mode and boundary scan capabilities, making it ideal for applications requiring high-speed processing in compact devices.
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DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
XOMAP3530FCBCE
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 515; Package Code: VFBGA; Package Shape: SQUARE; Format: FLOATING POINT;
XOMAP3530DCBB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 515; Package Code: VFBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH;
XOMAP3525CCUS
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 423; Package Code: LFBGA; Package Shape: SQUARE; Length: 16 mm;
XOMAP3530FCBC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 515; Package Code: VFBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
XOMAP3530DCUS
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 423; Package Code: LFBGA; Package Shape: SQUARE; Power Supplies (V): 1.1,1.8,3.3;
XOMAP3530FCUS
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 423; Package Code: LFBGA; Package Shape: SQUARE; External Data Bus Width: 32;
XOMAP3525BCUS
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 423; Package Code: VFBGA; Package Shape: SQUARE; Qualification: Not Qualified;
XOMAP3530DCBC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 515; Package Code: VFBGA; Package Shape: SQUARE; Integrated Cache: YES;
XOMAP3530BCBB
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 515; Package Code: VFBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
XOMAP3530ECBB
XOMAP3530DCUSD
XOMAP3530BCBC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 515; Package Code: VFBGA; Package Shape: SQUARE; Package Equivalence Code: BGA515,26X26,20;
XOMAP3530FCBCD
XOMAP3525CCBC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 515; Package Code: VFBGA; Package Shape: SQUARE; Nominal Supply Voltage: 1.15 V;
XOMAP3530CCBC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 515; Package Code: VFBGA; Package Shape: SQUARE; Technology: CMOS;
XOMAP3525BCBB
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 515; Package Code: VFBGA; Package Shape: SQUARE; Minimum Supply Voltage: 1.71 V;
XOMAP3525CCBB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 515; Package Code: VFBGA; Package Shape: SQUARE; Address Bus Width: 15;
XOMAP3530BCBBE
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 515; Package Code: VFBGA; Package Shape: SQUARE; Maximum Seated Height: .9 mm;
XOMAP3530DCUSE
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 423; Package Code: LFBGA; Package Shape: SQUARE; Nominal Supply Voltage: 1.15 V;
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