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XOMAP3530FCBCD

Texas Instruments

XOMAP3530FCBCD by Texas Instruments

XOMAP3530FCBCD by Texas Instruments is a microprocessor with 32-bit external data bus width, 15-bit address bus width, and max clock frequency of 38.4 MHz. It is used in applications requiring low power mode, such as mobile devices and embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,778 parts In-Stock

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2,778

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Vyrian

USA . 2,272 parts In-Stock

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2,272

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Distributors (Availability)

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AZTECH Wire

Italy . 206 parts In-Stock

1+ parts

$10.014

100+ parts

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206

$10.014

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One Stop Electronics

USA . 191 parts In-Stock

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$31.000

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191

$31.000

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Parana Technologies

USA . 1,429 parts In-Stock

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$39.625

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1,429

$39.625

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ChromeModa Solutions

Germany . 4,000 parts In-Stock

1+ parts

$44.522

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$36.508

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4,000

$44.522

$36.508

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IDEA Electronic Components Group

UK . 1,587 parts In-Stock

1+ parts

$44.522

100+ parts

$42.296

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$40.070

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1,587

$44.522

$42.296

$40.070

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DigiPath Technology Company

USA . 2,108 parts In-Stock

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$40.141

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2,108

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$40.141

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Corphita

USA . 1,980 parts In-Stock

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1,980

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Overview

Unlock the power of cutting-edge technology with the XOMAP3530FCBCD by Texas Instruments. As a leader in microprocessors, Texas Instruments guarantees top-notch quality and reliability in every product. Ideal for a wide range of applications, this microprocessor offers seamless integration and superior performance. With integrated cache and low power mode, customers can enjoy optimized efficiency and speed. Experience innovation at its finest with the XOMAP3530FCBCD and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the product lightweight and durable, ideal for portable devices.

Integrated Cache: YES

Having integrated cache improves the overall speed and performance of the microprocessor.

Surface Mount: YES

Surface mount capability makes it easy to integrate this microprocessor onto printed circuit boards.

Address Bus Width: 15

A wider address bus width allows for efficient data transfer and processing capabilities.

Package Shape: SQUARE

Square package shape allows for easy and compact placement within electronic devices.

No. of Terminals: 515

High number of terminals enable compatibility with a wide range of devices and applications.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style offers high density, low profile design, making it suitable for compact devices with limited space.

Terminal Position: BOTTOM

Bottom terminal position ensures easy and secure connection during installation.

Maximum Seated Height: 1 mm

Low seated height allows for slim and sleek designs in electronic products.

Width: 14 mm

Compact width of 14mm enables the microprocessor to fit in smaller devices while maintaining high performance.

Boundary Scan: YES

Boundary scan feature helps in debugging and testing the microprocessor during manufacturing and maintenance.

External Data Bus Width: 32

Wide external data bus width of 32 bits enhances data transfer speed and efficiency.

Maximum Clock Frequency: 38.4 MHz

High maximum clock frequency of 38.4 MHz ensures fast processing and data handling capabilities.

Length: 14 mm

Compact length of 14mm complements the width, allowing for a space-efficient design.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC architecture in the microprocessor enhances performance and efficiency in handling complex tasks.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, making the microprocessor energy-efficient.

Terminal Form: BALL

Ball terminal form ensures secure and reliable connectivity for seamless operation.

Nominal Supply Voltage: 1.15 V

Low nominal supply voltage of 1.15V reduces power consumption, contributing to energy efficiency.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables high density mounting and compact design in electronic devices.

Format: FLOATING POINT

Floating point format enhances numerical accuracy and precision in calculations and data processing.

Speed: 600 rpm

High speed of 600 rpm ensures quick response and efficient performance in processing tasks.

Low Power Mode: YES

Low power mode option allows for energy-saving operation, extending battery life in portable devices.

Technical Specifications

Microprocessors XOMAP3530FCBCD attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

15

Boundary Scan:

YES

Maximum Clock Frequency:

38.4 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B515

Length:

14 mm

Low Power Mode:

YES

No. of Terminals:

515

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

1 mm

Speed:

600 rpm

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

14 mm

Peripheral IC Type:

Trade Compliance

XOMAP3530FCBCD Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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