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XOMAP3530FCBCE

Texas Instruments

XOMAP3530FCBCE by Texas Instruments

XOMAP3530FCBCE by Texas Instruments is a Microprocessor with 32-bit External Data Bus, 15-bit Address Bus, and 38.4 MHz Clock Frequency. It is used in applications requiring low power consumption and high processing speed, such as mobile devices and embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,111 parts In-Stock

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8,111

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Digiode

USA . 913 parts In-Stock

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913

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Distributors (Availability)

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AZTECH Wire

Italy . 587 parts In-Stock

1+ parts

$16.068

100+ parts

-

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587

$16.068

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One Stop Electronics

USA . 1,163 parts In-Stock

1+ parts

$32.000

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1,163

$32.000

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Parana Technologies

USA . 992 parts In-Stock

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$62.877

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992

$62.877

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DigiPath Technology Company

USA . 2,230 parts In-Stock

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$69.235

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2,230

$69.235

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ChromeModa Solutions

Germany . 1,589 parts In-Stock

1+ parts

$70.648

100+ parts

$57.931

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1,589

$70.648

$57.931

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IDEA Electronic Components Group

UK . 1,171 parts In-Stock

1+ parts

$70.648

100+ parts

$67.116

1k+ parts

$63.583

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1,171

$70.648

$67.116

$63.583

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Corphita

USA . 468 parts In-Stock

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468

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Overview

Unlock the power of cutting-edge technology with the XOMAP3530FCBCE by Texas Instruments. Manufactured with precision and expertise, this microprocessor is designed to deliver top-notch performance and efficiency. Ideal for a wide range of applications, this product offers unmatched value and benefits to customers looking for reliability and innovation. Trust in Texas Instruments to provide you with the quality and advantages you deserve in the world of microprocessors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ideal for portable devices.

Integrated Cache: YES

Integrated cache helps in improving the overall performance and speed of the microprocessor.

Surface Mount: YES

Surface mount technology makes it easier to mount the microprocessor on PCBs, saving space and simplifying assembly.

Address Bus Width: 15

Wider address bus width allows for faster data transfer and processing capabilities.

Package Shape: SQUARE

Square package shape helps in efficient utilization of space on the PCB.

No. of Terminals: 515

Higher number of terminals provide more connectivity options and flexibility for integration.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style offers high density and efficient space usage on the PCB.

Terminal Position: BOTTOM

Bottom terminal position allows for easy and secure mounting on the PCB.

Maximum Seated Height: 1 mm

Low seated height makes it suitable for slim devices and compact designs.

Width: 14 mm

Compact width makes it suitable for small form factor devices.

Boundary Scan: YES

Boundary scan feature helps in testing and debugging the microprocessor easily.

External Data Bus Width: 32

Wider external data bus width allows for faster data transfer between the microprocessor and other components.

Maximum Clock Frequency: 38.4 MHz

High clock frequency enables faster processing speed and performance.

Length: 14 mm

Compact length makes it suitable for space-constrained applications.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC architecture offers efficient and optimized processing capabilities for high performance.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation for energy-efficient devices.

Terminal Form: BALL

Ball terminal form provides secure and reliable connections for stable operation.

Nominal Supply Voltage: 1.15 V

Low supply voltage helps in reducing power consumption and heat generation.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for higher density and more compact PCB designs.

Format: FLOATING POINT

Floating point format enables efficient handling of decimal numbers and complex calculations.

Speed: 600 rpm

High rotational speed allows for quick data access and processing.

Low Power Mode: YES

Low power mode feature helps in conserving energy and extending battery life in portable devices.

Technical Specifications

Microprocessors XOMAP3530FCBCE attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

15

Boundary Scan:

YES

Maximum Clock Frequency:

38.4 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B515

Length:

14 mm

Low Power Mode:

YES

No. of Terminals:

515

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

1 mm

Speed:

600 rpm

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

14 mm

Peripheral IC Type:

Trade Compliance

XOMAP3530FCBCE Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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