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UCC3752DG4

Texas Instruments

UCC3752DG4 by Texas Instruments

UCC3752DG4 by Texas Instruments is a BICMOS technology telecom IC with 16 terminals in a small outline package. It operates at temperatures from 0 to 70°C, with a nominal voltage of 12V and max supply current of 0.003mA. Ideal for telecom circuits, this IC is designed for applications requiring low power consumption and compact size.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,266 parts In-Stock

1+ parts

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3,266

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Vyrian

USA . 3,010 parts In-Stock

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3,010

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 414 parts In-Stock

1+ parts

$9.661

100+ parts

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414

$9.661

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Parana Technologies

USA . 786 parts In-Stock

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$14.587

100+ parts

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$15.025

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786

$14.587

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$15.025

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ChromeModa Solutions

Germany . 3,473 parts In-Stock

1+ parts

$16.390

100+ parts

$13.440

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3,473

$16.390

$13.440

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IDEA Electronic Components Group

UK . 2,255 parts In-Stock

1+ parts

$16.390

100+ parts

$15.570

1k+ parts

$14.751

10k+ parts

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2,255

$16.390

$15.570

$14.751

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One Stop Electronics

USA . 381 parts In-Stock

1+ parts

$405.000

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381

$405.000

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QUARKTWIN TECHNOLOGY LTD

USA . 10,524 parts In-Stock

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10,524

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Microchip USA

USA . 4,882 parts In-Stock

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4,882

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Corphita

USA . 2,460 parts In-Stock

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2,460

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DigiPath Technology Company

USA . 1,787 parts In-Stock

1+ parts

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100+ parts

$14.777

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1,787

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$14.777

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Overview

Unlock the potential of your telecom applications with the UCC3752DG4 by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers cutting-edge solutions to meet the demands of today's technology-driven world. The UCC3752DG4 is a versatile and efficient telecom interface IC that offers unparalleled performance and functionality. With a focus on value and customer satisfaction, this product provides benefits such as enhanced connectivity, optimized power management, and improved overall system efficiency. Trust Texas Instruments to provide you with the tools you need to stay ahead in the competitive telecom industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and lightweight, making the product suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy installation and space-saving on PCBs.

Package Shape: RECTANGULAR

Rectangular package shape is common and easy to integrate into existing designs.

Power Supplies (V): 12

Operating at 12V allows for compatibility with standard power sources.

Maximum Operating Temperature: 70 °C

High maximum operating temperature range ensures reliability in various environmental conditions.

Width: 3.9 mm

Compact width size makes the product suitable for applications with limited space constraints.

Technology: BICMOS

Utilizing BICMOS technology offers a combination of high-speed operation and low power consumption.

Technical Specifications

Other Function Telecom Interface ICs UCC3752DG4 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Telephone Circuits

Maximum Supply Current:

.003 mA

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

UCC3752DG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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