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UCC3751N

Texas Instruments

UCC3751N by Texas Instruments

UCC3751N by Texas Instruments is a BICMOS technology telecom IC with 16 terminals, operating at 0-70°C. It has a 12V supply voltage and comes in an in-line package style. Ideal for telecom circuits, it offers a compact design with dimensions of 7.62mm x 19.305mm x 5.08mm for various interface applications.

Median Price

$3.680

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 7,175 parts In-Stock

1+ parts

$3.540

100+ parts

$3.330

1k+ parts

$3.010

10k+ parts

-

7,175

$3.540

$3.330

$3.010

-

DigiKey

USA . 7,175 parts In-Stock

1+ parts

-

100+ parts

$3.680

1k+ parts

-

10k+ parts

-

7,175

-

$3.680

-

-

Verical

USA . 3,650 parts In-Stock

1+ parts

-

100+ parts

$4.162

1k+ parts

$3.763

10k+ parts

-

3,650

-

$4.162

$3.763

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,960 parts In-Stock

1+ parts

$3.363

100+ parts

-

1k+ parts

-

10k+ parts

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3,960

$3.363

-

-

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Vyrian

USA . 1,113 parts In-Stock

1+ parts

$3.540

100+ parts

-

1k+ parts

-

10k+ parts

-

1,113

$3.540

-

-

-

DigiKey Marketplace

USA . 7,175 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,175

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,959 parts In-Stock

1+ parts

$3.186

100+ parts

-

1k+ parts

-

10k+ parts

-

4,959

$3.186

-

-

-

Parana Technologies

USA . 1,887 parts In-Stock

1+ parts

$8.422

100+ parts

-

1k+ parts

$9.059

10k+ parts

-

1,887

$8.422

-

$9.059

-

DigiPath Technology Company

USA . 611 parts In-Stock

1+ parts

$9.274

100+ parts

$8.532

1k+ parts

-

10k+ parts

-

611

$9.274

$8.532

-

-

ChromeModa Solutions

Germany . 4,653 parts In-Stock

1+ parts

$9.463

100+ parts

$7.760

1k+ parts

-

10k+ parts

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4,653

$9.463

$7.760

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IDEA Electronic Components Group

UK . 1,576 parts In-Stock

1+ parts

$9.463

100+ parts

$8.990

1k+ parts

$8.517

10k+ parts

-

1,576

$9.463

$8.990

$8.517

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Microchip USA

USA . 188 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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188

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Overview

Unlock the power of seamless telecom interface integration with the UCC3751N by Texas Instruments. Crafted with precision and expertise, this high-quality IC boasts unparalleled reliability and performance. Ideal for a wide range of applications in the telecom industry, the UCC3751N promises to streamline operations and enhance functionality. Trust in Texas Instruments for cutting-edge technology that delivers value, benefits, and advantages to customers seeking top-notch solutions for their projects. Experience the difference with the UCC3751N today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY package body material provides durability and protection to the internal components of the IC, ensuring a longer lifespan.

Power Supplies (V): 12

Operating at 12V allows for efficient power consumption while still providing enough voltage for the IC to function effectively.

No. of Terminals: 16

Having 16 terminals allows for the IC to accommodate multiple connections, making it versatile for various telecom interface applications.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this IC can withstand higher temperatures, ensuring reliable performance in different environments.

Terminal Position: DUAL

Dual terminal position provides flexibility in connecting the IC to different devices or components, enhancing its compatibility and usability.

Width: 7.62 mm

With a compact width of 7.62mm, this IC can fit into tight spaces or crowded circuit boards, making it suitable for applications with limited space.

Technology: BICMOS

Utilizing BICMOS technology combines the benefits of both bipolar and CMOS technologies, resulting in improved performance in terms of speed, power consumption, and noise immunity.

Technical Specifications

Other Function Telecom Interface ICs UCC3751N attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T16

Length:

19.305 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Telephone Circuits

Nominal Supply Voltage:

12 V

Surface Mount:

NO

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

UCC3751N Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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