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UCC3751D

Texas Instruments

UCC3751D by Texas Instruments

UCC3751D by Texas Instruments is a BICMOS technology Telecom IC with 16 terminals, operating at 12V. It comes in a small outline package and can withstand temperatures from 0 to 70°C. Ideal for telecom circuits, this IC is surface mountable and has a gull wing terminal form.

Median Price

$3.750

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 22 parts In-Stock

1+ parts

-

100+ parts

$3.750

1k+ parts

$3.360

10k+ parts

$3.160

22

-

$3.750

$3.360

$3.160

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,087 parts In-Stock

1+ parts

$3.962

100+ parts

-

1k+ parts

-

10k+ parts

-

2,087

$3.962

-

-

-

Vyrian

USA . 4,680 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,680

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-

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Goldney Electronics S.L.

Spain . 8 parts In-Stock

1+ parts

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-

1k+ parts

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8

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,105 parts In-Stock

1+ parts

$3.753

100+ parts

-

1k+ parts

-

10k+ parts

-

4,105

$3.753

-

-

-

Parana Technologies

USA . 2,079 parts In-Stock

1+ parts

$8.999

100+ parts

-

1k+ parts

$9.667

10k+ parts

-

2,079

$8.999

-

$9.667

-

ChromeModa Solutions

Germany . 4,308 parts In-Stock

1+ parts

$10.111

100+ parts

$8.291

1k+ parts

-

10k+ parts

-

4,308

$10.111

$8.291

-

-

IDEA Electronic Components Group

UK . 884 parts In-Stock

1+ parts

$10.111

100+ parts

$9.605

1k+ parts

$9.100

10k+ parts

-

884

$10.111

$9.605

$9.100

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QUARKTWIN TECHNOLOGY LTD

USA . 23,451 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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23,451

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DigiPath Technology Company

USA . 899 parts In-Stock

1+ parts

-

100+ parts

$9.116

1k+ parts

-

10k+ parts

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899

-

$9.116

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Microchip USA

USA . 389 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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389

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Overview

Discover the cutting-edge UCC3751D by Texas Instruments, a top-tier manufacturer known for its exceptional quality and reliability. This telecom interface IC offers unparalleled performance and versatility in a compact package, making it ideal for a wide range of applications. With a nominal supply voltage of 12V and advanced BICMOS technology, this product delivers superior efficiency and functionality. Experience the value and benefits of the UCC3751D, from its robust construction to its ease of use, providing customers with a reliable solution for their telecommunications needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are commonly used for packaging ICs as they provide good insulation and protection for the components inside, ensuring durability and reliability.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, making the product suitable for mass production and automation.

Power Supplies (V): 12

Operating at a 12V power supply is a common standard in many telecom applications, providing compatibility with existing systems and reducing the need for additional power conversion circuits.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand high temperature environments, ensuring stable performance in various operating conditions.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high-speed performance and low power consumption, making it a suitable choice for telecom interface applications.

Technical Specifications

Other Function Telecom Interface ICs UCC3751D attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Telephone Circuits

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

UCC3751D Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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