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UCC3751DTRG4

Texas Instruments

UCC3751DTRG4 by Texas Instruments

UCC3751DTRG4 by Texas Instruments is a BICMOS technology telecom IC with 16 terminals in a small outline package. It operates b/w 0°C to 70°C, with a nominal voltage of 12V. Ideal for telecom circuits, it features gull wing terminal form and is surface mountable.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,444 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,444

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Digiode

USA . 1,972 parts In-Stock

1+ parts

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1,972

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 547 parts In-Stock

1+ parts

$8.249

100+ parts

-

1k+ parts

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547

$8.249

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Parana Technologies

USA . 484 parts In-Stock

1+ parts

$10.587

100+ parts

-

1k+ parts

$11.087

10k+ parts

-

484

$10.587

-

$11.087

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ChromeModa Solutions

Germany . 3,530 parts In-Stock

1+ parts

$11.896

100+ parts

$9.755

1k+ parts

-

10k+ parts

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3,530

$11.896

$9.755

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IDEA Electronic Components Group

UK . 2,175 parts In-Stock

1+ parts

$11.896

100+ parts

$11.301

1k+ parts

$10.706

10k+ parts

-

2,175

$11.896

$11.301

$10.706

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One Stop Electronics

USA . 703 parts In-Stock

1+ parts

$697.000

100+ parts

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1k+ parts

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703

$697.000

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Corphita

USA . 3,842 parts In-Stock

1+ parts

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3,842

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DigiPath Technology Company

USA . 2,038 parts In-Stock

1+ parts

-

100+ parts

$10.725

1k+ parts

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10k+ parts

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2,038

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$10.725

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Overview

Unlock the power of seamless communication with the UCC3751DTRG4 by Texas Instruments. Manufactured with precision and quality, this telecom interface IC offers unmatched reliability and performance. Ideal for a wide range of applications, this product is designed to meet your needs with ease. Experience the value and benefits of this innovative technology, providing customers with a competitive edge in today's fast-paced market. Trust in Texas Instruments to deliver cutting-edge solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is lightweight and cost-effective, making the product easy to handle and affordable.

Surface Mount: YES

Surface mount technology allows for easy installation and compact design, saving space on the PCB.

Power Supplies (V): 12

Operating at 12V provides sufficient power for the telecom interface IC to function effectively.

No. of Terminals: 16

Having 16 terminals allows for multiple connections, enhancing the functionality and versatility of the product.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand high temperature environments without compromising performance.

Minimum Operating Temperature: 0 °C

The ability to operate at 0°C ensures the product can function in a wide range of temperature conditions.

Technology: BICMOS

Utilizing BICMOS technology provides a combination of bipolar and CMOS benefits, offering high performance and low power consumption.

Nominal Supply Voltage: 12 V

Having a nominal supply voltage of 12V ensures stable power supply for consistent performance.

Technical Specifications

Other Function Telecom Interface ICs UCC3751DTRG4 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Telephone Circuits

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

UCC3751DTRG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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