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UCC3752D

Texas Instruments

UCC3752D by Texas Instruments

UCC3752D by Texas Instruments is a BICMOS technology telecom IC with 16 terminals in a small outline package. It operates at temperatures from 0 to 70°C, with a nominal voltage of 12V and max supply current of 0.003mA. Ideal for telecom circuits, it features gull wing terminal form and rectangular package shape.

Median Price

$3.680

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 17,879 parts In-Stock

1+ parts

-

100+ parts

$3.680

1k+ parts

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10k+ parts

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17,879

-

$3.680

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Rochester

USA . 11,079 parts In-Stock

1+ parts

-

100+ parts

$3.190

1k+ parts

$2.860

10k+ parts

$2.690

11,079

-

$3.190

$2.860

$2.690

Verical

USA . 10,799 parts In-Stock

1+ parts

-

100+ parts

$3.987

1k+ parts

$3.575

10k+ parts

$3.362

10,799

-

$3.987

$3.575

$3.362

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 973 parts In-Stock

1+ parts

$3.363

100+ parts

-

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973

$3.363

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Vyrian

USA . 2,701 parts In-Stock

1+ parts

$3.540

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2,701

$3.540

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DigiKey Marketplace

USA . 17,879 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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17,879

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Sogenti Electronics

Canada . 21 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,245 parts In-Stock

1+ parts

$3.186

100+ parts

-

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4,245

$3.186

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-

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Parana Technologies

USA . 1,791 parts In-Stock

1+ parts

$12.866

100+ parts

-

1k+ parts

$13.346

10k+ parts

-

1,791

$12.866

-

$13.346

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DigiPath Technology Company

USA . 2,105 parts In-Stock

1+ parts

$14.167

100+ parts

$13.034

1k+ parts

-

10k+ parts

-

2,105

$14.167

$13.034

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ChromeModa Solutions

Germany . 5,549 parts In-Stock

1+ parts

$14.456

100+ parts

$11.854

1k+ parts

-

10k+ parts

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5,549

$14.456

$11.854

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IDEA Electronic Components Group

UK . 556 parts In-Stock

1+ parts

$14.456

100+ parts

$13.733

1k+ parts

$13.010

10k+ parts

-

556

$14.456

$13.733

$13.010

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Microchip USA

USA . 381 parts In-Stock

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381

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Kepictronics

USA . 73 parts In-Stock

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73

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Overview

Unlock the power of seamless communication with the UCC3752D by Texas Instruments. This innovative telecom interface IC, crafted with top-notch quality and expertise from a renowned manufacturer, offers unparalleled value and benefits to customers across various applications. Experience reliable performance and efficiency in a compact package, making it ideal for telecommunications circuits that require precision and stability. Trust in Texas Instruments to deliver cutting-edge solutions that elevate your connectivity experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers durability and protection for the internal components of the IC, ensuring long-term reliability and performance.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving space and simplifying assembly processes.

Package Shape: RECTANGULAR

Rectangular shape provides compatibility with standard PCB layouts and allows for easy integration into existing designs.

Power Supplies (V): 12

Operating at 12V supply voltage enables compatibility with common power sources, making integration into various systems more convenient.

No. of Terminals: 16

Having 16 terminals allows for multiple connections and functionalities, increasing the versatility and capabilities of the IC.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this IC can withstand high-temperature environments, ensuring stable performance under various conditions.

Minimum Operating Temperature: 0 °C

The ability to operate at temperatures as low as 0°C makes this IC suitable for use in a wide range of temperature environments.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures compatibility with standard operating conditions, making it suitable for various commercial applications.

Technology: BICMOS

Utilizing BiCMOS technology combines the advantages of both bipolar and CMOS technologies, providing high performance and low power consumption.

Maximum Supply Current: 0.003 mA

Low maximum supply current of 0.003 mA indicates energy efficiency, reducing power consumption and prolonging operational lifespan.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, this IC offers specialized features and functions tailored to meet the requirements of telecommunications systems.

Nominal Supply Voltage: 12 V

Operating at a nominal supply voltage of 12V ensures compatibility with standard power sources, facilitating integration into various telecom systems.

Terminal Pitch: 1.27 mm

Having a terminal pitch of 1.27mm enables precise and secure connections on PCBs, ensuring reliable performance in telecom applications.

Technical Specifications

Other Function Telecom Interface ICs UCC3752D attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Telephone Circuits

Maximum Supply Current:

.003 mA

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

UCC3752D Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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