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UCC3750N

Texas Instruments

UCC3750N by Texas Instruments

UCC3750N by Texas Instruments is a BICMOS technology telecom IC with 28 terminals in an IN-LINE package. It operates b/w 0-70°C, has a nominal voltage of 5V, and features NICKEL PALLADIUM GOLD terminal finish. Ideal for telecom circuits due to its compact size and commercial temperature grade suitability.

Median Price

$11.092

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 7,701 parts In-Stock

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-

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$9.860

1k+ parts

$8.820

10k+ parts

$8.300

7,701

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$9.860

$8.820

$8.300

Verical

USA . 4,219 parts In-Stock

1+ parts

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$12.325

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$11.025

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$10.375

4,219

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$12.325

$11.025

$10.375

Distributors (In-Stock)

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Digiode

USA . 4,136 parts In-Stock

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$10.412

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$10.412

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Vyrian

USA . 2,191 parts In-Stock

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$10.960

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DigiKey Marketplace

USA . 8,077 parts In-Stock

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R&J Components

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ComSIT Distribution GmbH

Germany . 26 parts In-Stock

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ComSIT USA

USA . 26 parts In-Stock

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LWI Electronics Inc

India . 4 parts In-Stock

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Parana Technologies

USA . 1,837 parts In-Stock

1+ parts

$9.273

100+ parts

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1k+ parts

$9.906

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1,837

$9.273

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$9.906

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Corphita

USA . 3,077 parts In-Stock

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$9.864

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DigiPath Technology Company

USA . 1,407 parts In-Stock

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$10.211

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$9.394

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$10.211

$9.394

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ChromeModa Solutions

Germany . 1,243 parts In-Stock

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$10.419

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$8.544

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1,243

$10.419

$8.544

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IDEA Electronic Components Group

UK . 49 parts In-Stock

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$10.419

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$9.898

1k+ parts

$9.377

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49

$10.419

$9.898

$9.377

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QUARKTWIN TECHNOLOGY LTD

USA . 8,377 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,833 parts In-Stock

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Metaverse IC Inc.

Canada . 898 parts In-Stock

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Microchip USA

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374

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Perfect Parts

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Overview

Enhance your telecom interface applications with the UCC3750N by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge technology that meets the highest industry standards. This versatile IC is designed to optimize performance and functionality, offering customers unmatched value and benefits. From telecom circuits to other functions, the UCC3750N provides the perfect solution for your electronic needs. Experience the advantages of Texas Instruments with this innovative product today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the internal components, ensuring a reliable performance.

No. of Terminals: 28

Having a high number of terminals allows for multiple connections and functionalities, making this product versatile for various telecom interface applications.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70°C, this product can withstand elevated temperatures without compromising its functionality, making it suitable for diverse operating environments.

Technology: BICMOS

The BICMOS technology used in this product combines the benefits of both bipolar and CMOS technologies, providing high-speed performance and low power consumption, making it an efficient choice for telecom interface applications.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V, this product can be easily integrated into existing systems and power supplies, offering compatibility and ease of use.

Technical Specifications

Other Function Telecom Interface ICs UCC3750N attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T28

JESD-609 Code:

e4

Length:

36.32 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

UCC3750N Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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