Loading...

UCC3750NG4

Texas Instruments

UCC3750NG4 by Texas Instruments

UCC3750NG4 by Texas Instruments is a BICMOS technology Telecom IC with 28 terminals in RECTANGULAR package. It operates b/w 0-70 °C and has a nominal voltage of 5V. Ideal for TELECOM CIRCUIT applications due to its NICKEL PALLADIUM GOLD finish and DUAL terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,503 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,503

-

-

-

-

Vyrian

USA . 2,897 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,897

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,489 parts In-Stock

1+ parts

$8.985

100+ parts

-

1k+ parts

$9.655

10k+ parts

-

1,489

$8.985

-

$9.655

-

AZTECH Wire

Italy . 229 parts In-Stock

1+ parts

$9.152

100+ parts

-

1k+ parts

-

10k+ parts

-

229

$9.152

-

-

-

ChromeModa Solutions

Germany . 2,587 parts In-Stock

1+ parts

$10.096

100+ parts

$8.279

1k+ parts

-

10k+ parts

-

2,587

$10.096

$8.279

-

-

IDEA Electronic Components Group

UK . 459 parts In-Stock

1+ parts

$10.096

100+ parts

$9.591

1k+ parts

$9.086

10k+ parts

-

459

$10.096

$9.591

$9.086

-

One Stop Electronics

USA . 1,526 parts In-Stock

1+ parts

$143.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,526

$143.000

-

-

-

Semicontronic

India . 521 parts In-Stock

1+ parts

$389.000

100+ parts

$379.275

1k+ parts

$377.330

10k+ parts

-

521

$389.000

$379.275

$377.330

-

Corphita

USA . 1,576 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,576

-

-

-

-

DigiPath Technology Company

USA . 1,406 parts In-Stock

1+ parts

-

100+ parts

$9.103

1k+ parts

-

10k+ parts

-

1,406

-

$9.103

-

-

Corohmni

South Africa . 263 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

263

-

-

-

-

Overview

Experience the superior quality and reliability of Texas Instruments with the UCC3750NG4. This telecom interface IC offers unmatched performance and versatility in a compact and durable package. Ideal for a wide range of applications, this product provides customers with exceptional value and benefits. Trust in Texas Instruments to deliver innovative solutions that meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and resistance to heat, making the product suitable for various environments.

No. of Terminals: 28

Having 28 terminals allows for versatility and connectivity options, making it suitable for complex telecom interfaces.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can function effectively even in high-temperature environments.

Technology: BICMOS

Utilizing BICMOS technology ensures a good balance between speed and power consumption, making the product efficient and high-performing.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5 volts makes the product compatible with standard power sources, simplifying integration into existing systems.

Technical Specifications

Other Function Telecom Interface ICs UCC3750NG4 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T28

JESD-609 Code:

e4

Length:

36.32 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

UCC3750NG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20