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UCC3750Q

Texas Instruments

UCC3750Q by Texas Instruments

UCC3750Q by Texas Instruments is a BICMOS technology IC with 28 terminals in a square chip carrier package. It operates b/w 0-70°C, suitable for telecom circuits with a nominal voltage of 3V. Its compact size (11.505mm x 11.505mm) and J bend terminals make it ideal for telecom interface applications requiring surface mount installation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,098 parts In-Stock

1+ parts

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8,098

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Digiode

USA . 279 parts In-Stock

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279

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 637 parts In-Stock

1+ parts

$7.957

100+ parts

-

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637

$7.957

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Parana Technologies

USA . 1,317 parts In-Stock

1+ parts

$15.052

100+ parts

-

1k+ parts

$15.466

10k+ parts

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1,317

$15.052

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$15.466

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DigiPath Technology Company

USA . 858 parts In-Stock

1+ parts

$16.574

100+ parts

$15.248

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858

$16.574

$15.248

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IDEA Electronic Components Group

UK . 1,411 parts In-Stock

1+ parts

$16.912

100+ parts

$16.066

1k+ parts

$15.221

10k+ parts

-

1,411

$16.912

$16.066

$15.221

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ChromeModa Solutions

Germany . 1,156 parts In-Stock

1+ parts

$16.912

100+ parts

$13.868

1k+ parts

-

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1,156

$16.912

$13.868

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One Stop Electronics

USA . 468 parts In-Stock

1+ parts

$597.000

100+ parts

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468

$597.000

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Corphita

USA . 4,063 parts In-Stock

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4,063

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Overview

Elevate your telecom interface systems with the UCC3750Q by Texas Instruments. Known for their high-quality products, Texas Instruments delivers reliable solutions for various applications. The UCC3750Q offers unmatched value and benefits to customers seeking top-notch performance and efficiency in their telecom circuits. With advanced technology and a commercial temperature grade, this chip carrier package ensures optimal operation in a compact design. Upgrade your telecom interface experience with the UCC3750Q today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective.

Surface Mount: YES

Surface mount technology allows for easy installation onto circuit boards, saving space and making the assembly process more efficient.

Package Shape: SQUARE

Square package shape provides a compact footprint, ideal for applications where space is limited.

No. of Terminals: 28

Having 28 terminals allows for connectivity to multiple devices or components, enhancing the functionality of this product.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers good thermal performance and efficient power dissipation, making it suitable for telecom applications.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can function reliably in various environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures stability and performance even in cold environments.

Terminal Position: QUAD

Quad terminal position enables easy soldering and connection to the circuit board, improving assembly efficiency.

Maximum Seated Height: 4.57 mm

The maximum seated height of 4.57 mm allows for a compact design, making it suitable for space-constrained applications.

Width: 11.505 mm

The narrow width of 11.505 mm enables easy integration into existing systems or designs.

Length: 11.505 mm

The compact length of 11.505 mm further contributes to the space-saving design of this product.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures compatibility with standard operating conditions, suitable for a wide range of commercial applications.

Technology: BICMOS

Employing BiCMOS technology offers a balance between high-speed performance and low power consumption, making it an efficient choice for telecom interface ICs.

Terminal Form: J BEND

J bend terminal form provides mechanical strength and reliability during the installation process, ensuring a secure connection.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, this IC type offers the necessary features and functions required for efficient communication systems.

Nominal Supply Voltage: 3 V

Operating at a nominal supply voltage of 3 V, this product is compatible with standard power sources, enhancing its usability in various applications.

Terminal Pitch: 1.27 mm

The small terminal pitch of 1.27 mm enables high-density mounting on circuit boards, maximizing space efficiency in the overall system design.

Technical Specifications

Other Function Telecom Interface ICs UCC3750Q attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-J28

Length:

11.505 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

UCC3750Q Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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