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UCC3750DWP

Texas Instruments

UCC3750DWP by Texas Instruments

UCC3750DWP by Texas Instruments is a BICMOS technology Telecom IC with 28 terminals in a small outline package. It features gull wing terminal form and is surface mountable. Ideal for telecom circuits, this IC offers high performance in a rectangular plastic/epoxy package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,441 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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8,441

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-

-

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Digiode

USA . 4,789 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,789

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 491 parts In-Stock

1+ parts

$7.265

100+ parts

-

1k+ parts

-

10k+ parts

-

491

$7.265

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-

-

Parana Technologies

USA . 483 parts In-Stock

1+ parts

$10.029

100+ parts

-

1k+ parts

$10.588

10k+ parts

-

483

$10.029

-

$10.588

-

ChromeModa Solutions

Germany . 2,692 parts In-Stock

1+ parts

$11.269

100+ parts

$9.241

1k+ parts

-

10k+ parts

-

2,692

$11.269

$9.241

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IDEA Electronic Components Group

UK . 1,180 parts In-Stock

1+ parts

$11.269

100+ parts

$10.706

1k+ parts

$10.142

10k+ parts

-

1,180

$11.269

$10.706

$10.142

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One Stop Electronics

USA . 1,085 parts In-Stock

1+ parts

$459.000

100+ parts

-

1k+ parts

-

10k+ parts

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1,085

$459.000

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Corphita

USA . 2,380 parts In-Stock

1+ parts

-

100+ parts

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2,380

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DigiPath Technology Company

USA . 1,231 parts In-Stock

1+ parts

-

100+ parts

$10.160

1k+ parts

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10k+ parts

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1,231

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$10.160

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Overview

Unlock the power of seamless communication with the UCC3750DWP by Texas Instruments. Crafted with precision and reliability in mind, this telecom interface IC offers unparalleled performance in various applications. From enhancing connectivity to streamlining operations, this product is designed to exceed expectations. Embrace innovation and efficiency with Texas Instruments, a trusted name in the industry. Elevate your projects with the UCC3750DWP and experience the value it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes this product lightweight and durable, ideal for applications where weight and durability are important factors.

Surface Mount: YES

The surface mount capability allows for easy and convenient installation on PCBs, saving time and effort during the assembly process.

Package Shape: RECTANGULAR

The rectangular package shape is space-efficient and allows for easy integration into compact electronic devices or systems.

No. of Terminals: 28

With 28 terminals, this product provides ample connectivity options for interfacing with other components or devices in a telecom system.

Package Style (Meter): SMALL OUTLINE

The small outline package style further enhances space efficiency and allows for high-density mounting, making it suitable for applications with limited space constraints.

Terminal Position: DUAL

The dual terminal position offers flexibility in circuit design and layout, allowing for various connection configurations to accommodate different system requirements.

Technology: BICMOS

The use of BiCMOS technology combines the advantages of both bipolar and CMOS technologies, providing high-speed performance, low power consumption, and excellent noise immunity.

Terminal Form: GULL WING

The gull wing terminal form is well-suited for surface mount applications, providing reliable electrical connections and mechanical strength for secure PCB mounting.

Telecom IC Type: TELECOM CIRCUIT

As a telecom circuit IC, this product is specifically designed for telecommunications applications, ensuring optimal performance, compatibility, and reliability in telecom systems.

Technical Specifications

Other Function Telecom Interface ICs UCC3750DWP attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G28

No. of Functions:

1

No. of Terminals:

28

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

UCC3750DWP Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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