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UC1907L

Texas Instruments

UC1907L by Texas Instruments

UC1907L by Texas Instruments is a Power Management IC with 20 terminals, operating at -55 to 125 °C. It has a supply voltage range of 4.5V to 35V and supports power supplies up to 15V. Ideal for military applications due to its ceramic-metal package and adjustable threshold feature.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,997 parts In-Stock

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Digiode

USA . 1,503 parts In-Stock

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1,503

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,544 parts In-Stock

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$0.500

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1,544

$0.500

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Semicontronic

India . 1,364 parts In-Stock

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$0.500

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$0.488

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$0.485

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1,364

$0.500

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One Stop Electronics

USA . 789 parts In-Stock

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$4.500

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789

$4.500

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AZTECH Wire

Italy . 262 parts In-Stock

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$10.701

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262

$10.701

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Parana Technologies

USA . 2,105 parts In-Stock

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$20.495

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$20.560

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$20.495

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DigiPath Technology Company

USA . 2,075 parts In-Stock

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$22.567

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$20.762

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2,075

$22.567

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ChromeModa Solutions

Germany . 2,975 parts In-Stock

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$23.028

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$18.883

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$23.028

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IDEA Electronic Components Group

UK . 2,016 parts In-Stock

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$23.028

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$21.877

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$20.725

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2,016

$23.028

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$20.725

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Corphita

USA . 1,680 parts In-Stock

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1,680

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Corohmni

South Africa . 198 parts In-Stock

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Overview

Experience superior power management with the UC1907L by Texas Instruments. Engineered with top-quality materials and cutting-edge technology, this power management IC is perfect for a wide range of applications. Whether you're looking to optimize energy efficiency or enhance system performance, the UC1907L delivers unmatched reliability and precision. With its military-grade temperature grade and adjustable threshold feature, this chip carrier package offers exceptional value and benefits to customers seeking high-performance solutions. Trust Texas Instruments for quality, trust the UC1907L for excellence.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides excellent durability and reliability, making the product suitable for long-term use in various applications.

Surface Mount: YES

Enables easy and efficient PCB assembly, saving time and effort during manufacturing.

Nominal Supply Voltage (Vsup): 15 V

Ideal voltage level for powering various electronic devices efficiently.

No. of Terminals: 20

Sufficient number of terminals for connecting to multiple components, ensuring versatile use.

Maximum Operating Temperature: 125 °C

Can operate at high temperatures without compromising performance, ideal for demanding environments.

Minimum Operating Temperature: -55 °C

Suitable for use in extreme cold conditions, making it versatile for a wide range of applications.

Width (mm): 8.89 mm

Compact size allows for space-efficient integration into electronic devices.

Technology: BIPOLAR

Utilizes bipolar technology for efficient power management, ensuring stable and reliable operation.

Maximum Supply Voltage (Vsup): 35 V

Supports a wide range of supply voltages, making it compatible with various power sources.

Adjustable Threshold: YES

Allows for customization of voltage thresholds, providing flexibility in power management settings.

Technical Specifications

Power Management ICs UC1907L attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-CQCC-N20

Length:

8.89 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

15

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

10 mA

Maximum Supply Voltage (Vsup):

35 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

8.89 mm

Trade Compliance

UC1907L Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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