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UC1903J883B

Texas Instruments

UC1903J883B by Texas Instruments

UC1903J883B by Texas Instruments is a MIL-STD-883 Class B Power Management IC with 18 terminals, operating b/w -55 to 125 °C. It supports 4 channels, has an adjustable threshold of 1.8V, and is ideal for military-grade power supply applications.

Median Price

$19.713

Lifecycle Status

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One Stop Electronics

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Parana Technologies

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ChromeModa Solutions

Germany . 5,538 parts In-Stock

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IDEA Electronic Components Group

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AZTECH Wire

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Overview

Elevate your power management game with the UC1903J883B by Texas Instruments. Crafted with precision and quality, this military-grade Power Management IC offers unrivaled reliability and performance. With 4 channels and a wide operating temperature range, this IC is perfect for applications in demanding environments. Say goodbye to power supply issues and hello to seamless operation with the UC1903J883B. Trust Texas Instruments for industry-leading solutions that deliver value and peace of mind to customers.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed package body material provides durability and reliability, making this product suitable for harsh environments.

Screening Level: MIL-STD-883 Class B

With MIL-STD-883 Class B screening level, this product ensures high quality and reliability in military applications.

Nominal Supply Voltage (Vsup): 15 V

The nominal supply voltage of 15 V offers a suitable power input for various applications.

No. of Terminals: 18

Having 18 terminals allows for multiple connections and flexibility in power management configurations.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C enables this product to withstand extreme heat conditions.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C ensures reliable performance in cold environments.

Temperature Grade: MILITARY

Being military grade indicates that this product meets stringent specifications for ruggedness and reliability.

Maximum Supply Current (Isup): 15 mA

With a maximum supply current of 15 mA, this product is energy-efficient and suitable for low-power applications.

Technology: BIPOLAR

The bipolar technology used in this product offers high performance and efficiency in power management.

Technical Specifications

Power Management ICs UC1903J883B attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-GDIP-T18

JESD-609 Code:

e0

Length:

22.606 mm

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

18

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP18,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B

Maximum Seated Height:

5.08 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

15 mA

Maximum Supply Voltage (Vsup):

40 V

Minimum Supply Voltage (Vsup):

8 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

1.8

Width (mm):

7.62 mm

Trade Compliance

UC1903J883B Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-246-7087, 5962012467087, 5962-01-231-8313, 5962012318313, 5962-01-326-7708, 5962013267708, 5962-01-384-3370, 5962013843370

NIIN

012467087, 012318313, 013267708, 013843370

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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