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UC1903J

Texas Instruments

UC1903J by Texas Instruments

UC1903J by Texas Instruments is a Power Management IC with 18 terminals, operating b/w -55 to 125 °C. It has a supply voltage range of 8-40 V and supports 4 channels. Ideal for military-grade applications requiring adjustable threshold voltage control in compact spaces.

Median Price

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Lifecycle Status

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Vyrian

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Digiode

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Legend Electronics Inc.

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Electronic Expediters

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Resion

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MISTER SPROCKETS

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ComSIT Distribution GmbH

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Corel Iberica Componentes, S.L.

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ECAB

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Inland Empire Components Inc.

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PC Components Company LLC

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Bristol Electronics

USA . 2 parts In-Stock

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R&J Components

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ACDS - Activité Composants Distribution Service

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One Stop Electronics

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Parana Technologies

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DigiPath Technology Company

USA . 942 parts In-Stock

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ChromeModa Solutions

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IDEA Electronic Components Group

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AZTECH Wire

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Microchip USA

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Cyclops Electronics Ltd (Excess)

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Overview

Unlock the power of reliable and efficient power management with the UC1903J by Texas Instruments. Crafted from high-quality ceramic, this rectangular package houses a state-of-the-art power supply support circuit that ensures optimal performance in a wide range of applications. With 4 channels, a military-grade temperature rating, and adjustable threshold voltage, this IC offers unparalleled value and benefits to customers looking for top-notch power management solutions. Trust Texas Instruments for cutting-edge technology that delivers unmatched quality and reliability.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Ceramic and glass-sealed package body materials provide durability and protection for the internal components, ensuring reliability in various operating conditions.

Nominal Supply Voltage (Vsup): 15 V

A desirable nominal supply voltage of 15V offers stable power delivery for the connected devices, making it a versatile choice for different applications.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this power management IC can withstand high heat environments, enhancing its longevity and performance.

Technology: BIPOLAR

The bipolar technology used in this IC ensures efficient power regulation and management, making it suitable for demanding power supply circuitry.

Temperature Grade: MILITARY

Designed to meet military-grade specifications, this power management IC offers superior quality and reliability, making it a robust choice for critical applications.

Technical Specifications

Power Management ICs UC1903J attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-GDIP-T18

JESD-609 Code:

e0

Length:

22.606 mm

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

18

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP18,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

15 mA

Maximum Supply Voltage (Vsup):

40 V

Minimum Supply Voltage (Vsup):

8 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

1.8

Width (mm):

7.62 mm

Trade Compliance

UC1903J Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-244-4817, 5962012444817, 5962-01-549-0776, 5962015490776, 5962-99-430-2001, 5962994302001

NIIN

012444817, 015490776, 994302001

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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