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UC19432D

Texas Instruments

UC19432D by Texas Instruments

The Texas Instruments UC19432D is a Power Management IC with 2.4/36V power supplies, MILITARY grade temperature range (-55 to 125°C), and 8 terminals in a SMALL OUTLINE package. It is ideal for applications requiring high reliability in harsh environments, such as military and aerospace systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,489 parts In-Stock

1+ parts

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6,489

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Digiode

USA . 2,373 parts In-Stock

1+ parts

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2,373

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,203 parts In-Stock

1+ parts

$1.500

100+ parts

$1.462

1k+ parts

$1.455

10k+ parts

-

1,203

$1.500

$1.462

$1.455

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One Stop Electronics

USA . 1,262 parts In-Stock

1+ parts

$2.500

100+ parts

-

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1,262

$2.500

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Ampacity Inc.

Singapore . 1,153 parts In-Stock

1+ parts

$7.500

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1,153

$7.500

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Parana Technologies

USA . 2,265 parts In-Stock

1+ parts

$9.106

100+ parts

$845.592

1k+ parts

$8.195

10k+ parts

-

2,265

$9.106

$845.592

$8.195

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DigiPath Technology Company

USA . 1,615 parts In-Stock

1+ parts

$10.026

100+ parts

$9.224

1k+ parts

-

10k+ parts

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1,615

$10.026

$9.224

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ChromeModa Solutions

Germany . 5,727 parts In-Stock

1+ parts

$10.231

100+ parts

$8.389

1k+ parts

-

10k+ parts

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5,727

$10.231

$8.389

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IDEA Electronic Components Group

UK . 431 parts In-Stock

1+ parts

$10.231

100+ parts

$9.719

1k+ parts

$9.208

10k+ parts

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431

$10.231

$9.719

$9.208

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AZTECH Wire

Italy . 559 parts In-Stock

1+ parts

$12.409

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559

$12.409

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Corphita

USA . 567 parts In-Stock

1+ parts

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567

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Corohmni

South Africa . 258 parts In-Stock

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258

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Overview

Experience the next level of power management with the UC19432D by Texas Instruments. Renowned for their high-quality components, Texas Instruments delivers top-notch performance in their Power Management ICs. This versatile device is perfect for a wide range of applications, offering customers reliability and efficiency like never before. Say goodbye to power concerns and hello to seamless operations with the UC19432D.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good thermal conductivity and electrical insulation, making the product reliable and durable.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and cost in production.

Power Supplies (V): 2.4/36

Wide voltage range of 2.4V to 36V allows for versatile applications and compatibility with various power sources.

No. of Terminals: 8

Having 8 terminals provides flexibility for connecting to other components, enabling complex power management functions.

Package Style: SMALL OUTLINE

Small outline package style saves space on the circuit board, allowing for compact and efficient designs.

Maximum Operating Temperature: 125 °C

High maximum operating temperature of 125°C ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature of -55°C allows for usage in cold environments without compromising functionality.

Temperature Grade: MILITARY

Military-grade temperature grade ensures high reliability and performance in rugged and demanding applications.

Technology: BIPOLAR

Bipolar technology offers high precision and efficiency in power management, making the product suitable for critical applications.

Terminal Form: GULL WING

Gull wing terminal form allows for easy soldering and secure connection, enhancing the product's durability and reliability.

Terminal Pitch: 1.27 mm

Terminal pitch of 1.27mm provides good spacing for connections, reducing the risk of short circuits and improving overall system stability.

Technical Specifications

Power Management ICs UC19432D attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G8

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

2.4/36

Qualification:

Not Qualified

Sub-Category:

Power Management Circuits

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

UC19432D Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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