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UC1907DWTR

Texas Instruments

UC1907DWTR by Texas Instruments

The Texas Instruments UC1907DWTR is a Power Management IC with 16 terminals and a supply voltage range of 4.5V to 35V. It features an adjustable threshold, operates in temperatures from -55°C to 125°C, and is suitable for power supply support circuits in military-grade applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,003 parts In-Stock

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6,003

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Digiode

USA . 3,670 parts In-Stock

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3,670

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Distributors (Availability)

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Semicontronic

India . 1,554 parts In-Stock

1+ parts

$1.500

100+ parts

$1.462

1k+ parts

$1.455

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1,554

$1.500

$1.462

$1.455

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One Stop Electronics

USA . 1,457 parts In-Stock

1+ parts

$5.500

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1,457

$5.500

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Ampacity Inc.

Singapore . 684 parts In-Stock

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$7.500

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684

$7.500

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AZTECH Wire

Italy . 787 parts In-Stock

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$14.138

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787

$14.138

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Parana Technologies

USA . 2,354 parts In-Stock

1+ parts

$16.970

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$17.196

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2,354

$16.970

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$17.196

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ChromeModa Solutions

Germany . 3,484 parts In-Stock

1+ parts

$19.067

100+ parts

$15.635

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3,484

$19.067

$15.635

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IDEA Electronic Components Group

UK . 988 parts In-Stock

1+ parts

$19.067

100+ parts

$18.114

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$17.160

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988

$19.067

$18.114

$17.160

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DigiPath Technology Company

USA . 364 parts In-Stock

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$17.191

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364

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Corohmni

South Africa . 357 parts In-Stock

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357

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Corphita

USA . 125 parts In-Stock

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Overview

Enhance your power management solutions with the UC1907DWTR by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality power management ICs that guarantee reliability and efficiency. Perfect for a wide range of applications, this product offers unparalleled value to customers seeking optimal performance and seamless integration. Trust Texas Instruments to provide you with the tools you need to power your innovations and stay ahead of the curve. Choose the UC1907DWTR for superior quality and unmatched advantages in power management technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability to the product, ensuring long-lasting performance.

Surface Mount: YES

Surface mount capability makes it easy to integrate the IC into various electronic designs, saving space and simplifying manufacturing processes.

Nominal Supply Voltage (Vsup): 15 V

Suitable for applications that require a stable supply voltage of 15 V, providing consistent power to connected devices.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows for reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -55 °C

Wide range of operating temperatures ensures the IC can function effectively in both extreme hot and cold environments.

No. of Terminals: 16

Sufficient number of terminals for connecting to various components and circuits, offering flexibility in design and connectivity options.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the circuit board, making it ideal for compact electronic devices.

Adjustable Threshold: YES

Ability to adjust the threshold allows for customization and fine-tuning of the power supply support circuit to meet specific requirements.

Technical Specifications

Power Management ICs UC1907DWTR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G16

Length:

10.365 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.64 mm

Maximum Supply Voltage (Vsup):

35 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

7.5 mm

Trade Compliance

UC1907DWTR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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