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UC1907QTR

Texas Instruments

UC1907QTR by Texas Instruments

The Texas Instruments UC1907QTR is a Power Management IC with 20 terminals in a square chip carrier package. It operates b/w -55°C to 125°C, supporting supply voltages from 4.5V to 35V. Ideal for military-grade applications requiring adjustable threshold power supply support circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,168 parts In-Stock

1+ parts

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7,168

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Digiode

USA . 3,256 parts In-Stock

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3,256

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,129 parts In-Stock

1+ parts

$0.500

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-

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1,129

$0.500

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Parana Technologies

USA . 2,013 parts In-Stock

1+ parts

$4.890

100+ parts

$454.079

1k+ parts

$4.401

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2,013

$4.890

$454.079

$4.401

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DigiPath Technology Company

USA . 31 parts In-Stock

1+ parts

$5.384

100+ parts

$4.953

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-

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31

$5.384

$4.953

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ChromeModa Solutions

Germany . 3,250 parts In-Stock

1+ parts

$5.494

100+ parts

$4.505

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-

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3,250

$5.494

$4.505

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IDEA Electronic Components Group

UK . 1,757 parts In-Stock

1+ parts

$5.494

100+ parts

-

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$4.945

10k+ parts

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1,757

$5.494

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$4.945

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Semicontronic

India . 837 parts In-Stock

1+ parts

$5.500

100+ parts

$5.362

1k+ parts

$5.335

10k+ parts

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837

$5.500

$5.362

$5.335

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Ampacity Inc.

Singapore . 1,572 parts In-Stock

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$6.500

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1,572

$6.500

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AZTECH Wire

Italy . 669 parts In-Stock

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$9.156

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669

$9.156

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Corphita

USA . 679 parts In-Stock

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679

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Corohmni

South Africa . 465 parts In-Stock

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Overview

Experience unparalleled power management with the UC1907QTR by Texas Instruments. Crafted with precision and expertise, this power management IC offers unrivaled quality and reliability. Perfect for a wide range of applications, this chip carrier package delivers exceptional performance in a compact form factor. With adjustable threshold and a wide operating temperature range, the UC1907QTR ensures optimal functionality even in challenging environments. Elevate your projects with the superior value and benefits that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for a variety of applications while ensuring longevity.

Nominal Supply Voltage (Vsup): 15 V

The product can efficiently operate at a 15V supply voltage, making it compatible with a wide range of systems.

No. of Terminals: 20

With 20 terminals, this product offers flexibility in connecting various components and peripherals, enhancing its functionality.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliable performance even in demanding thermal conditions.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C allows the product to function effectively even in extreme cold environments.

Adjustable Threshold: YES

The ability to adjust the threshold allows for customization and fine-tuning of the product's performance to suit specific requirements.

Technical Specifications

Power Management ICs UC1907QTR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-J20

Length:

8.965 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage (Vsup):

35 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width (mm):

8.965 mm

Trade Compliance

UC1907QTR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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