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UC1914N

Texas Instruments

UC1914N by Texas Instruments

The Texas Instruments UC1914N is a Power Management IC with 18 terminals, operating at temperatures from -55 to 125°C. It supports supply voltages ranging from 5V to 35V and has a max supply current of 20mA. Ideal for military-grade applications requiring precise power supply support circuits in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,883 parts In-Stock

1+ parts

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4,883

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Digiode

USA . 1,395 parts In-Stock

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1,395

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,625 parts In-Stock

1+ parts

$0.500

100+ parts

$0.488

1k+ parts

$0.485

10k+ parts

-

1,625

$0.500

$0.488

$0.485

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One Stop Electronics

USA . 632 parts In-Stock

1+ parts

$2.500

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632

$2.500

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Ampacity Inc.

Singapore . 610 parts In-Stock

1+ parts

$4.500

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610

$4.500

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Parana Technologies

USA . 1,633 parts In-Stock

1+ parts

$12.706

100+ parts

-

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$13.174

10k+ parts

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1,633

$12.706

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$13.174

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DigiPath Technology Company

USA . 136 parts In-Stock

1+ parts

$13.990

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136

$13.990

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ChromeModa Solutions

Germany . 3,269 parts In-Stock

1+ parts

$14.276

100+ parts

$11.706

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3,269

$14.276

$11.706

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IDEA Electronic Components Group

UK . 1,194 parts In-Stock

1+ parts

$14.276

100+ parts

$13.562

1k+ parts

$12.848

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1,194

$14.276

$13.562

$12.848

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AZTECH Wire

Italy . 466 parts In-Stock

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$19.451

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466

$19.451

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Corphita

USA . 1,599 parts In-Stock

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1,599

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Corohmni

South Africa . 437 parts In-Stock

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437

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Overview

Unlock the power of your devices with the UC1914N by Texas Instruments. With a reputation for quality and reliability, Texas Instruments delivers cutting-edge Power Management ICs that are essential for a wide range of applications. The UC1914N offers unparalleled value with its high performance and efficiency, providing customers with optimal power supply support. Trust in Texas Instruments to enhance your products with top-of-the-line technology and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and helps in reducing the overall weight of the product.

Nominal Supply Voltage (Vsup): 12 V

The nominal supply voltage of 12 V allows compatibility with a wide range of electronic devices, making this power management IC versatile.

No. of Terminals: 18

Having 18 terminals provides flexibility in connecting various components and peripherals, enhancing the product's utility.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this power management IC can withstand harsh environmental conditions and operate reliably.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C ensures that the IC can function effectively in cold environments without any performance degradation.

Technology: BIPOLAR

The use of bipolar technology in the IC ensures stable and efficient power management, making it a reliable choice for various applications.

Technical Specifications

Power Management ICs UC1914N attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDIP-T18

Length:

23 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

18

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP18,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5/35

Qualification:

Not Qualified

Maximum Seated Height:

5.33 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

20 mA

Maximum Supply Voltage (Vsup):

35 V

Minimum Supply Voltage (Vsup):

5 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

UC1914N Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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