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UC1904J

Texas Instruments

UC1904J by Texas Instruments

UC1904J by Texas Instruments is a Power Management IC with 18 terminals, operating b/w -55 to 125 °C. It supports 4 channels and has an adjustable threshold with a supply voltage range of 4.75V to 18V. Ideal for military-grade applications requiring precise power supply support circuits in compact spaces.

Median Price

$87.610

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

American Microsemiconductor Inc.

USA . 32 parts In-Stock

1+ parts

$87.610

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32

$87.610

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Vyrian

USA . 2,669 parts In-Stock

1+ parts

-

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2,669

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Digiode

USA . 1,328 parts In-Stock

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1,328

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Sunrise Surplus Inc.

USA . 2 parts In-Stock

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 421 parts In-Stock

1+ parts

$6.500

100+ parts

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421

$6.500

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Parana Technologies

USA . 1,662 parts In-Stock

1+ parts

$13.743

100+ parts

-

1k+ parts

$14.232

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1,662

$13.743

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$14.232

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AZTECH Wire

Italy . 481 parts In-Stock

1+ parts

$14.249

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481

$14.249

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DigiPath Technology Company

USA . 994 parts In-Stock

1+ parts

$15.133

100+ parts

$13.923

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994

$15.133

$13.923

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ChromeModa Solutions

Germany . 2,791 parts In-Stock

1+ parts

$15.442

100+ parts

$12.662

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2,791

$15.442

$12.662

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IDEA Electronic Components Group

UK . 1,276 parts In-Stock

1+ parts

$15.442

100+ parts

$14.670

1k+ parts

$13.898

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1,276

$15.442

$14.670

$13.898

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Corphita

USA . 3,735 parts In-Stock

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3,735

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Overview

Enhance your power management solutions with the UC1904J from Texas Instruments, a top-tier manufacturer known for its high-quality components. This power management IC offers unmatched reliability and performance, making it the ideal choice for a wide range of applications. With its advanced technology and military-grade temperature grade, this product ensures optimal functionality in even the harshest environments. Upgrade your systems today with the UC1904J and experience the superior value and benefits it brings to your projects.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed package body material provides durability and protection for the internal components of the IC, ensuring reliable performance over time.

Nominal Supply Voltage (Vsup): 15 V

With a nominal supply voltage of 15V, this IC is suitable for applications requiring higher power handling capacity.

No. of Channels: 4

Having 4 channels allows for multiple power management functions to be performed simultaneously, making this IC versatile and efficient.

Technology: BIPOLAR

The bipolar technology used in this IC offers high power efficiency and fast switching speeds, making it ideal for power management applications.

Minimum Operating Temperature: -55 °C

The wide temperature range of -55°C ensures that this IC can operate effectively in extreme environmental conditions, making it suitable for a variety of applications.

Technical Specifications

Power Management ICs UC1904J attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-GDIP-T18

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

18

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP18,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Power Management Circuits

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

7.62 mm

Trade Compliance

UC1904J Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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