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TUSB4041IPAPRQ1

Texas Instruments

TUSB4041IPAPRQ1 by Texas Instruments

TUSB4041IPAPRQ1 by Texas Instruments is a Power Management IC with 64 terminals, operating at -40 to 85°C. It has a supply voltage range of 0.99V to 1.26V and is suitable for industrial applications requiring power supply support circuits in a compact square package.

Median Price

$9.200

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 536 parts In-Stock

1+ parts

$9.200

100+ parts

$6.074

1k+ parts

$5.511

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536

$9.200

$6.074

$5.511

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Nova Conductors

Japan . 10 parts In-Stock

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$5.079

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$5.079

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Digiode

USA . 2,942 parts In-Stock

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$7.476

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Chip Stock

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Vyrian

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Rebound Electronics

UK . 287 parts In-Stock

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Dark Horse Electronics

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Diverse Electronics

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Distributors (Availability)

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Parana Technologies

USA . 1,983 parts In-Stock

1+ parts

$2.220

100+ parts

-

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$2.726

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1,983

$2.220

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$2.726

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DigiPath Technology Company

USA . 1,648 parts In-Stock

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$2.444

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$2.249

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IDEA Electronic Components Group

UK . 1,784 parts In-Stock

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$2.494

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$2.245

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ChromeModa Solutions

Germany . 374 parts In-Stock

1+ parts

$2.494

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$2.045

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374

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Continental Prestige Electronics

USA . 502 parts In-Stock

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$5.079

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$4.977

502

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$4.977

Modulus Dynamics

Lithuania . 550 parts In-Stock

1+ parts

$5.638

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$5.581

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$5.412

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$5.638

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$5.412

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Ampacity Inc.

Singapore . 1,728 parts In-Stock

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$6.690

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Semicontronic

India . 1,668 parts In-Stock

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$6.690

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$6.523

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$6.489

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Corphita

USA . 4,818 parts In-Stock

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$7.083

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Corohmni

South Africa . 238 parts In-Stock

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$8.720

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Advanced Electronics

New Zealand . 202 parts In-Stock

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$11.900

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$11.305

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$11.305

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$11.900

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Authorized Procurement Solutions

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Lixinc

USA . 8,122 parts In-Stock

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Kepictronics

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Argo Parts USA

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Robosynatics

Brazil . 2,000 parts In-Stock

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Lucentia Tech

USA . 2,000 parts In-Stock

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$51.716

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$51.716

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$51.716

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A-Z Elektronik GmbH

Germany . 1,599 parts In-Stock

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Infinite Electronics LLP (Excess)

. 887 parts In-Stock

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Bastille Electronics

Australia . 50 parts In-Stock

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Overview

Enhance your power management systems with the TUSB4041IPAPRQ1 by Texas Instruments, a premium quality Power Management IC that delivers unmatched performance and reliability. Manufactured by industry leader Texas Instruments, this product offers exceptional value and benefits to customers looking for top-notch power supply support circuits. With its versatile applications in various industries, the TUSB4041IPAPRQ1 is designed to optimize efficiency and enhance overall system performance. Upgrade to Texas Instruments for superior power management solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the components inside, making this product a reliable choice.

Surface Mount: YES

With surface mounting capability, this product offers ease of installation and compact design for space-saving applications.

Package Shape: SQUARE

The square package shape allows for efficient use of board space and facilitates easier routing of traces, making this product ideal for compact designs.

Nominal Supply Voltage (Vsup): 1.1 V

The nominal supply voltage of 1.1 V ensures stable and efficient power delivery, making this product suitable for low-power applications.

No. of Terminals: 64

With 64 terminals, this product offers increased connectivity options and flexibility for a wide range of power management applications.

Package Style: FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

The various package styles provide versatility and compatibility with different PCB layouts, making this product adaptable to various design requirements.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures the reliability and performance of this product in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows this product to function effectively in extreme temperature conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish offers excellent conductivity and corrosion resistance, ensuring long-term reliability and performance of this product.

Terminal Position: QUAD

The quad terminal position provides stable connection points and ease of soldering, enhancing the overall reliability and durability of this product.

Technical Specifications

Power Management ICs TUSB4041IPAPRQ1 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRE SUPPLY VOLTAGE 3V TO 3.6V

Adjustable Threshold:

NO

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

1.26 V

Minimum Supply Voltage (Vsup):

.99 V

Nominal Supply Voltage (Vsup):

1.1 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

10 mm

Trade Compliance

TUSB4041IPAPRQ1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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