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TUSB216RWBT

Texas Instruments

TUSB216RWBT by Texas Instruments

TUSB216RWBT by Texas Instruments is a Power Management IC with 12 terminals, operating voltage range of 2.3V to 6.5V, and bandwidth of 240 kHz. It is used in power supply support circuits for commercial applications due to its compact square chip carrier package and adjustable threshold feature.

Median Price

$5.110

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 76,238 parts In-Stock

1+ parts

$3.691

100+ parts

$3.009

1k+ parts

$2.006

10k+ parts

-

76,238

$3.691

$3.009

$2.006

-

Chip1Stop

Japan . 170 parts In-Stock

1+ parts

$5.110

100+ parts

$3.230

1k+ parts

$2.680

10k+ parts

$2.380

170

$5.110

$3.230

$2.680

$2.380

DigiKey

USA . 310 parts In-Stock

1+ parts

$5.130

100+ parts

$3.272

1k+ parts

$2.968

10k+ parts

$2.854

310

$5.130

$3.272

$2.968

$2.854

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,531 parts In-Stock

1+ parts

$3.506

100+ parts

-

1k+ parts

-

10k+ parts

-

3,531

$3.506

-

-

-

Vyrian

USA . 4,291 parts In-Stock

1+ parts

$3.691

100+ parts

-

1k+ parts

-

10k+ parts

-

4,291

$3.691

-

-

-

Chip Stock

USA . 32,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

32,200

-

-

-

-

Speed Components Ltd

Israel . 98 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

98

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,345 parts In-Stock

1+ parts

$3.322

100+ parts

-

1k+ parts

-

10k+ parts

-

1,345

$3.322

-

-

-

Parana Technologies

USA . 1,085 parts In-Stock

1+ parts

$16.600

100+ parts

-

1k+ parts

$16.872

10k+ parts

-

1,085

$16.600

-

$16.872

-

DigiPath Technology Company

USA . 510 parts In-Stock

1+ parts

$18.279

100+ parts

$16.817

1k+ parts

-

10k+ parts

-

510

$18.279

$16.817

-

-

ChromeModa Solutions

Germany . 4,830 parts In-Stock

1+ parts

$18.652

100+ parts

$15.295

1k+ parts

-

10k+ parts

-

4,830

$18.652

$15.295

-

-

IDEA Electronic Components Group

UK . 1,642 parts In-Stock

1+ parts

$18.652

100+ parts

$17.719

1k+ parts

$16.787

10k+ parts

-

1,642

$18.652

$17.719

$16.787

-

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Overview

Discover the innovative TUSB216RWBT by Texas Instruments, a cutting-edge Power Management IC designed for optimal performance and efficiency. With a reputation for excellence, Texas Instruments delivers top-quality products that are reliable and durable. This chip carrier boasts a very thin profile and a range of applications, providing customers with a versatile solution for their power supply support circuit needs. Experience the convenience and value of the TUSB216RWBT, offering adjustable thresholds and a wide bandwidth to meet your specific requirements. Choose Texas Instruments for superior technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection, making this product suitable for various environments and applications.

Surface Mount: YES

Surface mount capability allows for easier and more efficient PCB assembly, saving time and effort during the manufacturing process.

Nominal Supply Voltage (Vsup): 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with a wide range of electronic devices and systems.

No. of Terminals: 12

Having 12 terminals provides the necessary connections for power management and support circuitry, offering flexibility in design and functionality.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this power management IC can handle high temperature environments without compromising performance.

Minimum Operating Temperature: 0 °C

Operating at temperatures as low as 0°C ensures reliability and functionality even in chilly environments.

Maximum Supply Current (Isup): 36 mA

Capable of providing a maximum supply current of 36mA, this power management IC can meet the power requirements of various devices and systems.

Adjustable Threshold: YES

Having an adjustable threshold allows for customization and optimization of power management settings, providing flexibility in meeting specific requirements.

Technical Specifications

Power Management ICs TUSB216RWBT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

Nominal Bandwidth:

240 kHz

JESD-30 Code:

S-PQCC-N12

JESD-609 Code:

e4

Length:

1.6 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC12,.06SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.4 mm

Maximum Supply Current (Isup):

36 mA

Maximum Supply Voltage (Vsup):

6.5 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.6 mm

Trade Compliance

TUSB216RWBT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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