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UC1903L

Texas Instruments

UC1903L by Texas Instruments

UC1903L by Texas Instruments is a Power Management IC with 4 channels, operating voltage range of 8-40V. It features adjustable threshold voltage (1.8V), military-grade temperature rating (-55 to 125°C), and surface-mount package for power supply support circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,741 parts In-Stock

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Vyrian

USA . 1,287 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Holdelec - ElecDif-Pro

France . 1 parts In-Stock

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One Stop Electronics

USA . 1,134 parts In-Stock

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$2.500

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AZTECH Wire

Italy . 638 parts In-Stock

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$4.982

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638

$4.982

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Parana Technologies

USA . 2,174 parts In-Stock

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$5.334

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$5.992

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$5.334

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DigiPath Technology Company

USA . 1,014 parts In-Stock

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$5.873

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$5.403

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$5.873

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ChromeModa Solutions

Germany . 1,690 parts In-Stock

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$5.993

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$4.914

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IDEA Electronic Components Group

UK . 438 parts In-Stock

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$5.993

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$5.394

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438

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$20.570

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$18.719

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$16.867

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Corphita

USA . 3,432 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Microchip USA

USA . 1,561 parts In-Stock

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Overview

Elevate your power management capabilities with the UC1903L by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge Power Management ICs that are perfect for a wide range of applications. The UC1903L offers unmatched value and benefits, providing customers with efficient power supply support circuitry in a compact and durable package. Say goodbye to unreliable power management solutions and experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This package body material provides excellent durability and reliability, ensuring the Power Management ICs can withstand harsh environmental conditions.

Surface Mount: YES

Being surface mountable makes installation and integration of these Power Management ICs easier and more efficient.

Nominal Supply Voltage (Vsup): 15 V

With a nominal supply voltage of 15V, these ICs can effectively manage power and voltage levels within systems that require such specifications.

No. of Terminals: 20

Having 20 terminals provides sufficient connectivity options for various input and output connections, allowing for versatile applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliable performance even in demanding operating conditions.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C enables these ICs to function effectively in both extreme hot and cold environments.

Terminal Finish: TIN LEAD

The tin lead terminal finish offers excellent conductivity and solderability, enhancing the performance and reliability of the Power Management ICs.

Technology: BIPOLAR

The bipolar technology used in these ICs allows for precise power management and efficient operation, making them ideal for various power supply support circuit applications.

Technical Specifications

Power Management ICs UC1903L attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

Length:

8.89 mm

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Qualification:

Not Qualified

Maximum Seated Height:

2.54 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

15 mA

Maximum Supply Voltage (Vsup):

40 V

Minimum Supply Voltage (Vsup):

8 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Nominal Threshold Voltage (V):

1.8

Width (mm):

8.89 mm

Trade Compliance

UC1903L Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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