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UC1907N

Texas Instruments

UC1907N by Texas Instruments

The Texas Instruments UC1907N is a Power Management IC with 16 terminals, operating voltage range of 4.5V to 35V, and adjustable threshold feature. It is designed for military-grade applications with temperature range from -55°C to 125°C, making it suitable for power supply support circuits in harsh environments. The package style is in-line rectangular shape made of plastic/epoxy material.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,838 parts In-Stock

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8,838

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Digiode

USA . 2,404 parts In-Stock

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2,404

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Distributors (Availability)

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Semicontronic

India . 646 parts In-Stock

1+ parts

$0.500

100+ parts

$0.488

1k+ parts

$0.485

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-

646

$0.500

$0.488

$0.485

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One Stop Electronics

USA . 1,233 parts In-Stock

1+ parts

$3.500

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1,233

$3.500

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Parana Technologies

USA . 2,162 parts In-Stock

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$6.938

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$7.529

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2,162

$6.938

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$7.529

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DigiPath Technology Company

USA . 2,192 parts In-Stock

1+ parts

$7.640

100+ parts

$7.029

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2,192

$7.640

$7.029

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ChromeModa Solutions

Germany . 5,715 parts In-Stock

1+ parts

$7.796

100+ parts

$6.393

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5,715

$7.796

$6.393

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IDEA Electronic Components Group

UK . 1,579 parts In-Stock

1+ parts

$7.796

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$7.016

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1,579

$7.796

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$7.016

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AZTECH Wire

Italy . 717 parts In-Stock

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$18.837

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717

$18.837

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Corphita

USA . 539 parts In-Stock

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539

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Corohmni

South Africa . 136 parts In-Stock

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Overview

Experience unparalleled quality and reliability with the Texas Instruments UC1907N Power Management IC. Designed for military-grade applications, this IC boasts a wide supply voltage range and adjustable threshold for maximum flexibility. With 16 terminals in an in-line package style, the UC1907N offers superior performance in power supply support circuits. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations and provides unmatched value to customers in need of top-tier power management solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in power management ICs for its durability, cost-effectiveness, and reliability.

Nominal Supply Voltage (Vsup): 15 V

Operating at 15V allows for compatibility with a wide range of electronic systems and devices.

No. of Terminals: 16

Having 16 terminals provides flexibility in connections and functionality for various applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this IC can withstand demanding environments and maintain optimal performance.

Temperature Grade: MILITARY

Being designed for military-grade applications ensures reliability and durability in harsh conditions.

Adjustable Threshold: YES

The ability to adjust the threshold allows for customization and optimization of the IC's performance to meet specific requirements.

Technical Specifications

Power Management ICs UC1907N attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDIP-T16

Length:

19.3 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.33 mm

Maximum Supply Voltage (Vsup):

35 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

NO

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

UC1907N Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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