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TMX320F28335PGFA

Texas Instruments

TMX320F28335PGFA by Texas Instruments

Texas Instruments TMX320F28335PGFA is a 32-bit DSP with 20-bit address bus, operating at max 150 MHz. Ideal for industrial applications, it features low power mode, floating point format, and boundary scan capability. With a package style of flatpack and fine pitch, it offers multiple internal bus architecture for efficient processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,806 parts In-Stock

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8,806

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Digiode

USA . 3,371 parts In-Stock

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3,371

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Infinite Electronics LLP

India . 2 parts In-Stock

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2

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Distributors (Availability)

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AZTECH Wire

Italy . 272 parts In-Stock

1+ parts

$15.079

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272

$15.079

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One Stop Electronics

USA . 1,192 parts In-Stock

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$23.000

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1,192

$23.000

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Parana Technologies

USA . 1,606 parts In-Stock

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$31.317

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$77.177

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1,606

$31.317

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$77.177

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ChromeModa Solutions

Germany . 6,799 parts In-Stock

1+ parts

$35.188

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$28.854

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6,799

$35.188

$28.854

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IDEA Electronic Components Group

UK . 397 parts In-Stock

1+ parts

$35.188

100+ parts

$33.429

1k+ parts

$31.669

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397

$35.188

$33.429

$31.669

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Corohmni

South Africa . 200 parts In-Stock

1+ parts

$54.005

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200

$54.005

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Component Stockers USA

USA . 707 parts In-Stock

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$99.990

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707

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 4,706 parts In-Stock

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Corphita

USA . 4,142 parts In-Stock

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Microchip USA

USA . 350 parts In-Stock

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350

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DigiPath Technology Company

USA . 322 parts In-Stock

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$31.726

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322

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$31.726

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Overview

Experience top-notch performance and reliability with the TMX320F28335PGFA by Texas Instruments, a leading manufacturer in the industry. This digital signal processor (DSP) is perfect for a wide range of applications, offering customers unparalleled value and benefits. With advanced features and cutting-edge technology, this product provides users with the advantage they need to stay ahead of the curve. Trust Texas Instruments to deliver quality and innovation in every aspect of their products, making the TMX320F28335PGFA the ideal choice for all your DSP needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and helps in reducing the overall weight of the product.

Surface Mount: YES

Allows for easy installation and integration into different electronic systems.

Maximum Supply Voltage: 1.995 V

Provides a stable power source for optimal performance.

Address Bus Width: 20

Wide address bus enables efficient data transfer and processing capabilities.

Package Shape: SQUARE

Square shape allows for easy placement and layout in circuit boards.

Bit Size: 32

Higher bit size allows for more complex calculations and processing tasks.

Power Supplies (V): 1.9,3.3

Provides flexibility in power input options for various applications.

No. of Terminals: 176

Sufficient number of terminals for connecting to external components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Offers different package styles for flexible mounting and space-saving designs.

Minimum Supply Voltage: 1.805 V

Ensures operational reliability even at lower supply voltages.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures in industrial environments.

Minimum Operating Temperature: -40 °C

Ability to operate in extremely cold conditions for diverse applications.

Terminal Position: QUAD

Quad terminal position provides efficient connectivity and reduces signal interference.

Maximum Seated Height: 1.6 mm

Low seated height allows for compact designs and space-saving installations.

RAM Words: 34816

Large RAM capacity for storing and processing data efficiently.

Width: 24 mm

Compact width for easy integration into different electronic systems.

Boundary Scan: YES

Boundary scan feature assists in testing and debugging the product during development.

External Data Bus Width: 32

Wide external data bus enables faster data transfer speeds.

Maximum Clock Frequency: 150 MHz

High clock frequency for fast processing of data and instructions.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data communication speed and efficiency.

Length: 24 mm

Compact length for space-efficient designs and installations.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in harsh environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral IC type for diverse application requirements.

Technology: CMOS

CMOS technology ensures low power consumption and high-speed operation.

Terminal Form: GULL WING

Gull wing terminal form for easy soldering and robust connections.

Maximum Supply Current: 40 mA

Low supply current consumption for energy-efficient operation.

Nominal Supply Voltage: 1.9 V

Stable nominal supply voltage for consistent performance.

Terminal Pitch: 0.5 mm

Narrow terminal pitch for high-density mounting and connectivity.

Format: FLOATING POINT

Floating-point format for precise mathematical calculations and high accuracy.

Low Power Mode: YES

Low power mode option for energy-saving operation and extended battery life.

Technical Specifications

Digital Signal Processors (DSPs) TMX320F28335PGFA attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 3.3V SUPPLY

Address Bus Width:

20

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

150 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G176

Length:

24 mm

Low Power Mode:

YES

No. of Terminals:

176

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.9,3.3

Qualification:

Not Qualified

RAM Words:

34816

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

40 mA

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.805 V

Nominal Supply Voltage:

1.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMX320F28335PGFA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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