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TMX320F2806GGMA

Texas Instruments

TMX320F2806GGMA by Texas Instruments

TMX320F2806GGMA by Texas Instruments is a 32-bit DSP with 10240 RAM words, operating at up to 100 MHz. Ideal for industrial applications, it features low power mode, boundary scan support, and operates b/w -40°C to 85°C temperature range.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,331 parts In-Stock

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Digiode

USA . 2,140 parts In-Stock

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2,140

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Distributors (Availability)

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One Stop Electronics

USA . 1,646 parts In-Stock

1+ parts

$1.000

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1,646

$1.000

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AZTECH Wire

Italy . 622 parts In-Stock

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$9.225

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622

$9.225

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Corohmni

South Africa . 317 parts In-Stock

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$27.971

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317

$27.971

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Parana Technologies

USA . 1,937 parts In-Stock

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$56.760

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1,937

$56.760

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DigiPath Technology Company

USA . 624 parts In-Stock

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$62.500

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624

$62.500

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ChromeModa Solutions

Germany . 6,114 parts In-Stock

1+ parts

$63.775

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$52.296

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6,114

$63.775

$52.296

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IDEA Electronic Components Group

UK . 1,619 parts In-Stock

1+ parts

$63.775

100+ parts

$60.586

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$57.398

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1,619

$63.775

$60.586

$57.398

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Corphita

USA . 814 parts In-Stock

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Microchip USA

USA . 175 parts In-Stock

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Overview

Experience the power and precision of the TMX320F2806GGMA by Texas Instruments, a top-of-the-line Digital Signal Processor that delivers unmatched performance in a compact package. With cutting-edge technology and a reputation for excellence, Texas Instruments ensures that this DSP meets the highest standards of quality and reliability. Ideal for a wide range of applications, from industrial automation to telecommunications, this product offers customers exceptional value with its low power consumption, high clock frequency, and extensive RAM capacity. Unlock new possibilities and elevate your projects with the TMX320F2806GGMA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and durable, making the DSP product more affordable and long-lasting.

Surface Mount: YES

Surface mount technology makes the product easier to assemble and saves space on the PCB, improving overall efficiency.

Maximum Supply Voltage: 1.89 V

The high maximum supply voltage allows for flexibility in powering the DSP and enables compatibility with a wide range of systems.

Package Shape: SQUARE

The square shape is efficient for PCB layout and helps in maximizing space utilization within the system.

Bit Size: 32

A 32-bit architecture offers higher computational power and precision, making the DSP suitable for complex signal processing tasks.

Power Supplies (V): 1.8,3.3

Support for multiple power supplies allows for versatility in different applications and system configurations.

No. of Terminals: 100

Having a higher number of terminals provides more connectivity options and potential for interfacing with other components.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array package style with low profile and fine pitch design enhances signal integrity, reduces noise, and improves thermal performance.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage ensures efficient power consumption and operation in low-power scenarios.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the DSP can perform reliably in harsh environmental conditions without overheating.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows the DSP to function effectively in both extreme cold and hot temperatures.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout, optimizes signal routing, and enhances thermal management.

Maximum Seated Height: 1.4 mm

The low seated height enables compact system designs and facilitates efficient heat dissipation.

RAM Words: 10240

Having a large RAM capacity allows for storing and processing a significant amount of data, enhancing the DSP's capabilities.

Width: 10 mm

The compact width dimension makes the DSP suitable for space-constrained applications and integration into small form factor devices.

Boundary Scan: YES

Boundary scan capability simplifies testing and troubleshooting during manufacturing, ensuring high product quality and reliability.

Maximum Clock Frequency: 100 MHz

A high maximum clock frequency enables fast signal processing and real-time operation, making the DSP efficient for time-critical applications.

Internal Bus Architecture: MULTIPLE

Having multiple internal bus architectures allows for parallel processing and efficient data transfer within the DSP, enhancing performance.

Length: 10 mm

The compact length dimension contributes to a smaller footprint on the PCB and facilitates compact system designs.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature environments, the DSP can operate reliably in rugged industrial settings without compromising performance.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Support for various types of peripheral ICs extends the connectivity and functionality of the DSP, making it versatile for diverse applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speed, making the DSP energy-efficient and reliable.

Terminal Form: BALL

Ball terminal form provides robust electrical connections, simplifies PCB assembly, and enhances reliability in demanding operational conditions.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage ensures stable and consistent power delivery to the DSP, optimizing performance and reliability.

Terminal Pitch: 0.8 mm

With a fine terminal pitch, the DSP allows for high-density mounting, precise connections, and efficient signal routing on the PCB.

Format: FIXED POINT

Utilizing fixed-point format simplifies arithmetic operations and accelerates computational tasks, making the DSP efficient for real-time processing.

Low Power Mode: YES

The low power mode feature enables power-saving operation, prolongs battery life, and reduces heat generation, enhancing energy efficiency.

Technical Specifications

Digital Signal Processors (DSPs) TMX320F2806GGMA attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

0

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B100

Length:

10 mm

Low Power Mode:

YES

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Words:

10240

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

10 mm

Peripheral IC Type:

Trade Compliance

TMX320F2806GGMA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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