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TMX320F28069PZA

Texas Instruments

TMX320F28069PZA by Texas Instruments

TMX320F28069PZA by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 51200 RAM bytes. It operates at a max clock frequency of 80 MHz, suitable for industrial applications requiring high-speed processing. With ADC, DAC, and PWM channels, it offers versatile functionality in a compact FLATPACK package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,400 parts In-Stock

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4,400

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Vyrian

USA . 4,245 parts In-Stock

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Pegasus Components GmbH

Germany . 300 parts In-Stock

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300

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Distributors (Availability)

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AZTECH Wire

Italy . 358 parts In-Stock

1+ parts

$13.735

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358

$13.735

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One Stop Electronics

USA . 1,041 parts In-Stock

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$35.000

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1,041

$35.000

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Parana Technologies

USA . 680 parts In-Stock

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$55.326

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680

$55.326

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DigiPath Technology Company

USA . 862 parts In-Stock

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$60.921

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$56.047

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862

$60.921

$56.047

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ChromeModa Solutions

Germany . 2,618 parts In-Stock

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$62.164

100+ parts

$50.974

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2,618

$62.164

$50.974

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IDEA Electronic Components Group

UK . 1,402 parts In-Stock

1+ parts

$62.164

100+ parts

$59.056

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$55.948

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1,402

$62.164

$59.056

$55.948

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QUARKTWIN TECHNOLOGY LTD

USA . 11,027 parts In-Stock

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Lixinc

USA . 5,152 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Microchip USA

USA . 3,266 parts In-Stock

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Corphita

USA . 3,153 parts In-Stock

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Kepictronics

USA . 71 parts In-Stock

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Overview

Enhance your projects with the TMX320F28069PZA microcontroller by Texas Instruments, a top-quality device known for its reliability and performance. Designed for a wide range of applications, this microcontroller offers versatile features and capabilities that provide immense value to customers. With advanced technology and exceptional functionality, the TMX320F28069PZA delivers unparalleled benefits, making it the ideal choice for all your embedded system needs. Trust Texas Instruments to deliver cutting-edge solutions that meet and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and protection for the microcontroller, making it suitable for a variety of environments.

Surface Mount: YES

This feature allows for easy and convenient installation of the microcontroller on a circuit board, saving time and effort during assembly.

Maximum Supply Voltage: 1.995 V

The high maximum supply voltage ensures stable operation and flexibility in powering the microcontroller.

Package Shape: SQUARE

The square shape provides a compact form factor, saving space on the PCB and allowing for efficient design layouts.

Bit Size: 32

With a 32-bit architecture, this microcontroller offers high computational capabilities and precision for demanding applications.

DAC Channels: YES

The presence of DAC channels enables the microcontroller to interface with analog devices, expanding its versatility in controlling various systems.

Power Supplies (V): 1.8,3.3

Having multiple power supply options allows for compatibility with different voltage requirements, enhancing the microcontroller's usability in diverse projects.

No. of Terminals: 100

The high number of terminals offers ample connectivity options for interfacing with external components, enhancing the microcontroller's functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style provides a combination of compact size, low profile design, and precise terminal spacing for efficient PCB integration and high-density layouts.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage ensures that the microcontroller can operate reliably even in low-power conditions, making it suitable for energy-efficient applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range allows the microcontroller to function in harsh environmental conditions without compromising performance.

CPU Family: TMS320

Belonging to the TMS320 family signifies a pedigree of high-performance and reliable microcontrollers with established industry support and compatibility.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the microcontroller's operation in extreme cold environments, making it suitable for a wide range of applications.

ADC Channels: YES

Having ADC channels enables the microcontroller to convert analog signals into digital data, expanding its capability to interface with sensors and other analog devices.

DMA Channels: YES

The presence of DMA channels allows for efficient data transfer and processing, reducing the CPU workload and enhancing overall system performance.

Terminal Position: QUAD

The quad terminal position offers standardized connectivity and layout, simplifying the integration of the microcontroller into various applications.

ROM Words: 131072

With a large ROM capacity, the microcontroller can store significant amounts of program data, enabling complex algorithms and applications to run smoothly.

Maximum Seated Height: 1.6 mm

The low maximum seated height allows for slim and compact designs, ideal for space-constrained applications and PCB layouts.

Width: 14 mm

The compact width dimension ensures the microcontroller can fit into tight spaces on a PCB, facilitating efficient circuit board designs.

Maximum Clock Frequency: 80 MHz

The high maximum clock frequency provides fast processing speed and real-time responsiveness, making the microcontroller suitable for high-speed applications.

Length: 14 mm

The compact length dimension contributes to space-saving designs and allows for versatile placement options on a PCB.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature ranges ensures the microcontroller's reliability and performance in demanding industrial environments.

Peripheral IC Type: MICROCONTROLLER

Designed as a microcontroller, this product offers a comprehensive set of integrated peripherals and features tailored for embedded control applications.

RAM Bytes: 51200

With a large RAM capacity, the microcontroller can efficiently handle data processing and storage requirements for complex applications and multitasking.

Technology: CMOS

Utilizing CMOS technology provides low power consumption, high noise immunity, and efficient operation for the microcontroller in various applications.

Terminal Form: GULL WING

The gull-wing terminal form offers robust solder connections and easy PCB mounting, ensuring reliable electrical connectivity and mechanical stability.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage provides a standard operating level for the microcontroller, ensuring compatibility with common power sources and accessories.

PWM Channels: YES

Having PWM channels enables the microcontroller to generate precise analog outputs, making it suitable for controlling motors, LEDs, and other devices requiring variable voltage levels.

ROM Programmability: FLASH

Featuring flash ROM programmability allows for easy and flexible firmware updates, enabling the microcontroller to adapt to evolving requirements and applications.

Terminal Pitch: 0.5 mm

The fine terminal pitch provides high-density connections on the PCB, allowing for compact designs and efficient use of space.

Speed: 80 rpm

With a speed rating of 80 rpm, this microcontroller offers quick data processing and high operational efficiency for time-critical applications.

No. of I/O Lines: 54

Having 54 I/O lines allows for versatile interfacing with external devices and peripherals, making the microcontroller suitable for a wide range of applications.

Technical Specifications

Microcontrollers TMX320F28069PZA attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

TMS320

Maximum Clock Frequency:

80 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

54

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

51200

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

TMX320F28069PZA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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