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TMX320F28075PTPT

Texas Instruments

TMX320F28075PTPT by Texas Instruments

TMX320F28075PTPT by Texas Instruments is a 32-bit microcontroller with 176 terminals, operating at up to 100 MHz. It features 17-Ch 12-Bit ADCs, 3-Ch 12-Bit DACs, and peripherals like PWM(40) and DMA(6). Ideal for industrial applications requiring high-speed data processing and precise analog-to-digital conversion.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,657 parts In-Stock

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6,657

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Digiode

USA . 2,000 parts In-Stock

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2,000

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Distributors (Availability)

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AZTECH Wire

Italy . 586 parts In-Stock

1+ parts

$14.870

100+ parts

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586

$14.870

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One Stop Electronics

USA . 850 parts In-Stock

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$22.000

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850

$22.000

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Parana Technologies

USA . 1,492 parts In-Stock

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$49.764

100+ parts

$4,621.375

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$44.788

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1,492

$49.764

$4,621.375

$44.788

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DigiPath Technology Company

USA . 1,606 parts In-Stock

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$54.797

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1,606

$54.797

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ChromeModa Solutions

Germany . 810 parts In-Stock

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$55.915

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$45.850

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810

$55.915

$45.850

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IDEA Electronic Components Group

UK . 67 parts In-Stock

1+ parts

$55.915

100+ parts

$53.119

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$50.324

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67

$55.915

$53.119

$50.324

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Component Stockers USA

USA . 724 parts In-Stock

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$99.990

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724

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Corphita

USA . 2,767 parts In-Stock

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2,767

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Perfect Parts

USA . 560 parts In-Stock

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560

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Microchip USA

USA . 457 parts In-Stock

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457

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Overview

Unlock the potential of your projects with the TMX320F28075PTPT microcontroller by Texas Instruments. Built with precision and expertise, Texas Instruments delivers top-notch quality in every product. This versatile microcontroller is perfect for a wide range of applications, offering unmatched value and benefits to customers. From its advanced features to its reliable performance, the TMX320F28075PTPT is designed to elevate your projects to new heights. Experience innovation like never before with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight and durable, making the product suitable for portable and rugged applications.

Surface Mount: YES

Surface mount technology allows for easy integration onto PCBs, saving space and enabling mass production.

Maximum Supply Voltage: 1.26 V

Operates efficiently within a low voltage range, reducing power consumption and heat generation.

Address Bus Width: 20

Wide address bus width enables access to a large memory space, crucial for handling complex algorithms and data processing.

Package Shape: SQUARE

Square package shape facilitates efficient PCB layout and space utilization.

Bit Size: 32

32-bit architecture provides enhanced computing power and performance for demanding applications.

DAC Channels: YES

Integrated DAC channels allow for precise analog signal generation, essential for audio, sensor interfaces, and other applications.

No. of Terminals: 176

Abundance of terminals offers flexibility for connecting external peripherals and interfaces, expanding the product's functionality.

Minimum Supply Voltage: 1.14 V

Low minimum supply voltage ensures compatibility with a wide range of power sources and energy-efficient operation.

Maximum Operating Temperature: 105 °C

High maximum operating temperature tolerance makes the product suitable for industrial applications where temperature fluctuations occur.

Minimum Operating Temperature: -40 °C

Wide temperature operating range allows the product to function reliably in extreme environmental conditions.

ADC Channels: YES

Built-in ADC channels enable accurate analog-to-digital conversion, crucial for capturing real-world signals in various applications.

DMA Channels: YES

DMA channels offload data transfer tasks from the CPU, improving system efficiency and performance.

Terminal Position: QUAD

Quad terminal positioning simplifies PCB assembly and enhances connectivity options for peripherals and interfaces.

ROM Words: 524288

Generous ROM size accommodates extensive program storage, allowing for complex firmware and software implementations.

Maximum Seated Height: 1.6 mm

Low seated height profile saves space and enables design flexibility in compact electronic devices.

Digital To Analog Convertors: 3-Ch 12-Bit

Multiple DAC channels with 12-bit resolution offer high-precision analog signal generation capabilities for diverse applications.

Width: 24 mm

Compact width dimension facilitates space-efficient PCB layout and integration into small form factor devices.

External Data Bus Width: 32

Wide external data bus width ensures efficient data transfer and processing capabilities for handling large datasets.

Peripherals: COMPARATOR(16), DMA(6), PWM(40), TEMPERATURE SENSOR, TIMER(3), WDT(2)

Rich set of peripherals including comparators, DMA controllers, PWM channels, temperature sensor, timers, and watchdog timer enhance the product's versatility and functionality.

Maximum Clock Frequency: 100 MHz

High maximum clock frequency enables rapid data processing and execution of complex algorithms, suitable for high-performance applications.

Length: 24 mm

Compact length dimension contributes to space-saving design and easy integration into diverse electronic systems.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh industrial environments with temperature variations.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC-based microcontroller architecture offers high computational efficiency and performance for embedded control applications.

RAM Bytes: 102400

Large RAM capacity provides ample space for data storage and temporary computations, enhancing overall system responsiveness.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Terminal Form: GULL WING

Gull wing terminal form simplifies PCB mounting and soldering processes, ensuring secure and reliable electrical connections.

Analog To Digital Convertors: 17-Ch 12-Bit

Multiple ADC channels with 12-bit resolution facilitate accurate analog signal acquisition and conversion for diverse sensor and control applications.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage ensures consistent performance and reliable operation under varying load conditions.

PWM Channels: YES

Presence of PWM channels enables precise control of analog signals such as motor speed, light intensity, and power modulation.

Connectivity: CAN(2), I2C(2), SCI(4), SPI(3), USB

Multiple connectivity options including CAN, I2C, SCI, SPI, and USB facilitate seamless communication with external devices and networks.

ROM Programmability: FLASH

FLASH programmable ROM allows for easy firmware updates and configuration changes without requiring specialized equipment.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting on PCBs, conserving space and supporting miniaturization in electronic designs.

Speed: 120 rpm

High-speed operation at 120 rpm supports rapid data processing and real-time control applications, ensuring smooth system performance.

On Chip Program ROM Width: 8

On-chip program ROM width of 8 bits allows for efficient storage and execution of program instructions, enhancing processing speed.

No. of I/O Lines: 97

Abundance of I/O lines facilitates versatile interfacing with external devices, sensors, and peripherals, enhancing the product's connectivity and functionality.

Technical Specifications

Microcontrollers TMX320F28075PTPT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

20

Bit Size:

32

Maximum Clock Frequency:

100 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G176

Length:

24 mm

No. of I/O Lines:

97

No. of Terminals:

176

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

RAM Bytes:

102400

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

120 rpm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

24 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(2), SCI(4), SPI(3), USB

Peripherals:

COMPARATOR(16), DMA(6), PWM(40), TEMPERATURE SENSOR, TIMER(3), WDT(2)

Analog To Digital Convertors:

17-Ch 12-Bit

Digital To Analog Convertors:

3-Ch 12-Bit

Trade Compliance

TMX320F28075PTPT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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