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TMX320F28075PZPT

Texas Instruments

TMX320F28075PZPT by Texas Instruments

Texas Instruments TMX320F28075PZPT is a 32-bit microcontroller with 3-Ch 12-Bit DAC and 14-Ch 12-Bit ADC. It operates at up to 100 MHz, has 102400 bytes of RAM, and offers various peripherals like PWM(24) and DMA(6). Ideal for industrial applications requiring high-speed processing and precise analog-to-digital conversion.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,907 parts In-Stock

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Vyrian

USA . 2,221 parts In-Stock

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ComSIT Distribution GmbH

Germany . 360 parts In-Stock

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One Stop Electronics

USA . 1,154 parts In-Stock

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$1.000

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$1.000

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AZTECH Wire

Italy . 780 parts In-Stock

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$15.325

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Parana Technologies

USA . 10 parts In-Stock

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$20.471

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$20.529

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10

$20.471

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$20.529

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ChromeModa Solutions

Germany . 5,582 parts In-Stock

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$23.001

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$18.861

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$23.001

$18.861

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IDEA Electronic Components Group

UK . 1,219 parts In-Stock

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$23.001

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$21.851

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$20.701

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$23.001

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Lixinc

USA . 16,049 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,727 parts In-Stock

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Corphita

USA . 2,571 parts In-Stock

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DigiPath Technology Company

USA . 1,293 parts In-Stock

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$20.738

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Microchip USA

USA . 157 parts In-Stock

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Kepictronics

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Overview

Unleash the power of innovation with the TMX320F28075PZPT by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microcontrollers that are designed to revolutionize the way you approach technology. With a wide range of applications in various industries, this microcontroller offers unmatched value, benefits, and advantages to customers. Whether you're looking to enhance automation processes, improve efficiency, or drive performance, the TMX320F28075PZPT is the perfect solution for your next project. Embrace cutting-edge technology and elevate your creations with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly.

Maximum Supply Voltage: 1.26 V

Operates efficiently within a low maximum supply voltage, reducing power consumption.

Address Bus Width: 7

A wide address bus allows for efficient memory addressing and data transfer capabilities.

Bit Size: 32

With a 32-bit architecture, the microcontroller can handle complex calculations and processes effectively.

DAC Channels: YES

Integrated DAC channels provide accurate analog output capabilities for various applications.

No. of Terminals: 100

The high number of terminals allows for versatile connectivity and interface options.

Minimum Supply Voltage: 1.14 V

Operates at a low minimum supply voltage, making it suitable for low-power applications.

Maximum Operating Temperature: 105 °C

Capable of operating at high temperatures, ideal for industrial environments.

Minimum Operating Temperature: -40 °C

Can withstand low temperatures, ensuring reliable performance in harsh conditions.

ADC Channels: YES

Integrated ADC channels provide accurate analog input capabilities for various sensing applications.

DMA Channels: YES

DMA channels offer efficient data transfer between peripherals and memory, enhancing performance.

ROM Words: 524288

Large ROM capacity allows for storing a significant amount of program data and instructions.

Analog To Digital Convertors: 14-Ch 12-Bit

Multiple ADC channels with high resolution enable precise analog-to-digital conversion for sensor readings.

RAM Bytes: 102400

Generous RAM size provides ample memory for data storage and manipulation during operation.

Technical Specifications

Microcontrollers TMX320F28075PZPT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

7

Bit Size:

32

Maximum Clock Frequency:

100 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

41

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

RAM Bytes:

102400

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

120 rpm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(2), SCI(3), SPI(3), USB

Peripherals:

COMPARATOR(8), DMA(6), PWM(24), TEMPERATURE SENSOR, TIMER(3), WDT(2)

Analog To Digital Convertors:

14-Ch 12-Bit

Digital To Analog Convertors:

3-Ch 12-Bit

Trade Compliance

TMX320F28075PZPT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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