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TMX320C28343ZHH

Texas Instruments

TMX320C28343ZHH by Texas Instruments

TMX320C28343ZHH by Texas Instruments is a 32-bit microcontroller with 16-bit address bus width, operating at up to 300 MHz. It features 88 I/O lines, ADC and DMA channels, suitable for industrial applications requiring high-speed processing and low power consumption. The package style is grid array with a low profile and fine pitch design.

Median Price

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Lifecycle Status

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4

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1k+

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Vyrian

USA . 3,574 parts In-Stock

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Digiode

USA . 2,297 parts In-Stock

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ACDS - Activité Composants Distribution Service

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R&J Components

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AZTECH Wire

Italy . 292 parts In-Stock

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$14.350

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One Stop Electronics

USA . 1,172 parts In-Stock

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Parana Technologies

USA . 617 parts In-Stock

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DigiPath Technology Company

USA . 723 parts In-Stock

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IDEA Electronic Components Group

UK . 277 parts In-Stock

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ChromeModa Solutions

Germany . 223 parts In-Stock

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Microchip USA

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Corphita

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Overview

Unleash the power of cutting-edge technology with the TMX320C28343ZHH microcontroller by Texas Instruments. Crafted with precision and expertise, this device offers unparalleled reliability and performance in a variety of applications. From industrial automation to consumer electronics, this microcontroller provides seamless integration and high-speed processing capabilities, ensuring optimal functionality for your projects. Experience the value and benefits of Texas Instruments' superior quality and innovation with the TMX320C28343ZHH microcontroller. Elevate your designs and exceed expectations with this state-of-the-art solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable package material ensures the longevity and reliability of the product.

Surface Mount: YES

Ease of installation and compact design for space-saving applications.

Maximum Supply Voltage: 1.26 V

Efficient power consumption at a relatively low maximum supply voltage.

Address Bus Width: 16

Support for high memory addressability and data transfer capabilities.

Package Shape: SQUARE

Simplify PCB layout and component placement for manufacturing.

Bit Size: 32

High processing capability and support for complex operations.

Power Supplies (V): 1.1,3.3

Versatile power supply options for different voltage requirements.

No. of Terminals: 179

Sufficient number of terminals for multiple connections and interfaces.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Enhanced thermal performance, compact design, and high-density integration.

Minimum Supply Voltage: 1.14 V

Operational efficiency at low power supply levels.

Maximum Operating Temperature: 105 °C

Suitable for industrial environments with high temperature requirements.

CPU Family: TMS320

Reliable and well-known CPU family for performance and compatibility.

Minimum Operating Temperature: -40 °C

Wide operating temperature range for versatility in various environments.

ADC Channels: YES

Ability to interface with analog sensors and devices for data acquisition.

DMA Channels: YES

Efficient data transfer capabilities for improved system performance.

Terminal Position: BOTTOM

Simplified and organized layout for easy PCB design and assembly.

ROM Words: 8192

Adequate memory capacity for program storage and data handling.

Maximum Seated Height: 1.4 mm

Low-profile design for space-constrained applications.

Width: 12 mm

Compact form factor for portable and space-saving devices.

External Data Bus Width: 32

High-speed data transfer and processing capabilities.

Maximum Clock Frequency: 300 MHz

High clock frequency for fast processing and response times.

Length: 12 mm

Symmetrical dimensions for uniform component layout.

Temperature Grade: INDUSTRIAL

Robust construction and performance for industrial applications.

Peripheral IC Type: MICROCONTROLLER

Integrated peripherals for added functionality and versatility.

RAM Bytes: 133120

Ample RAM for data storage and processing requirements.

Technology: CMOS

Efficient and low-power consumption technology for energy savings.

Terminal Form: BALL

Secure and reliable terminal connections for durability.

Nominal Supply Voltage: 1.2 V

Stable and optimal voltage supply for consistent performance.

PWM Channels: YES

Support for PWM signals for precise control and modulation.

ROM Programmability: MROM

Non-volatile memory for secure program storage and data retention.

Terminal Pitch: 0.8 mm

Fine pitch for dense component packing and space optimization.

Speed: 300 rpm

High-speed operation for rapid data processing and system responsiveness.

No. of I/O Lines: 88

Plenty of input/output lines for connecting to various external devices and peripherals.

Technical Specifications

Microcontrollers TMX320C28343ZHH attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES AT 1.05V AT 200MHZ

Address Bus Width:

16

Bit Size:

32

CPU Family:

TMS320

Maximum Clock Frequency:

300 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B179

Length:

12 mm

No. of I/O Lines:

88

No. of Terminals:

179

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA179,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.1,3.3

Qualification:

Not Qualified

RAM Bytes:

133120

ROM Words:

8192

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Speed:

300 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMX320C28343ZHH Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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