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TMX320F28377DZWTT

Texas Instruments

TMX320F28377DZWTT by Texas Instruments

TMX320F28377DZWTT by Texas Instruments is a 32-bit microcontroller with 337 terminals, operating at up to 20 MHz. It features DAC and ADC channels, PWM capabilities, and ROM programmability. Ideal for industrial applications requiring high-speed processing and precise control functions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,837 parts In-Stock

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Digiode

USA . 92 parts In-Stock

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92

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One Stop Electronics

USA . 875 parts In-Stock

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$8.000

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875

$8.000

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AZTECH Wire

Italy . 406 parts In-Stock

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$10.594

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Parana Technologies

USA . 2,302 parts In-Stock

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$57.613

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$57.613

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DigiPath Technology Company

USA . 1,180 parts In-Stock

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$63.439

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$58.364

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$63.439

$58.364

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ChromeModa Solutions

Germany . 4,203 parts In-Stock

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$64.734

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$53.082

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4,203

$64.734

$53.082

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IDEA Electronic Components Group

UK . 1,769 parts In-Stock

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$64.734

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$61.497

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$58.261

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1,769

$64.734

$61.497

$58.261

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Lixinc

USA . 9,038 parts In-Stock

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Corphita

USA . 1,724 parts In-Stock

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Microchip USA

USA . 347 parts In-Stock

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Kepictronics

USA . 50 parts In-Stock

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Overview

Unveiling the Texas Instruments TMX320F28377DZWTT microcontroller, a cutting-edge innovation that guarantees top-notch quality and unparalleled performance. Manufactured by industry leader Texas Instruments, this device is designed for a wide range of applications, ensuring reliability and efficiency in every use. With advanced features like DAC and ADC channels, DMA channels, and PWM channels, this microcontroller offers unmatched value and benefits to customers seeking superior functionality and precision in their projects. Upgrade your systems with the TMX320F28377DZWTT and experience the difference in performance and quality today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides a good balance of durability and cost-effectiveness, making it a suitable choice for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, making the product suitable for mass production.

Maximum Supply Voltage: 1.26 V

Operating within this voltage range ensures efficient power consumption and reliable performance for the microcontroller.

Package Shape: SQUARE

Square packages are space-efficient and easy to mount on PCBs, making them a practical choice for compact electronic designs.

Bit Size: 32

A 32-bit architecture allows for more complex processing tasks and higher overall performance compared to lower bit sizes.

DAC Channels: YES

Having DAC channels enables the microcontroller to convert digital signals into analog outputs, supporting a wider range of applications.

No. of Terminals: 337

A higher number of terminals provide more connectivity options and flexibility for interfacing with external components and peripherals.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a compact and reliable design with a low profile and fine pitch for optimal space utilization on PCBs.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage allows for operation in energy-efficient and low-power modes, extending battery life in portable devices.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, the microcontroller can withstand harsh environmental conditions and industrial applications.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures reliable operation in extreme cold conditions, making the microcontroller suitable for diverse environments.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides good conductivity and corrosion resistance for long-term reliability in various operating environments.

ADC Channels: YES

Analog-to-digital converter channels allow the microcontroller to read and process analog signals, expanding its capabilities for sensor interfacing and measurement applications.

DMA Channels: YES

Direct memory access channels improve data transfer efficiency and offload the CPU, enhancing overall system performance for real-time processing tasks.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates easier PCB layout and routing, enabling more efficient and compact designs.

Maximum Seated Height: 1.4 mm

The low seated height allows for a slim profile and compact design, making the microcontroller suitable for space-constrained applications.

Width: 16 mm

The compact width dimension enables easy integration of the microcontroller into various electronic devices and systems with limited space availability.

Maximum Clock Frequency: 20 MHz

A high maximum clock frequency of 20 MHz provides fast processing speeds and responsiveness for time-critical applications and real-time control tasks.

Maximum Time At Peak Reflow Temperature (s): 30

The specified reflow time ensures proper soldering and mounting of the microcontroller during manufacturing processes, ensuring reliable connections.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the microcontroller can withstand standard assembly processes without compromising its performance or reliability.

Length: 16 mm

The compact length dimension allows for space-efficient placement on PCBs and integration into small form factor electronic devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh environments with extreme temperature fluctuations, making the product suitable for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient and fast processing capabilities, making the microcontroller suitable for high-performance computing applications.

Technology: CMOS

CMOS technology enables low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in various operating conditions.

Terminal Form: BALL

Ball terminal form facilitates reliable soldering connections and easy assembly onto PCBs, ensuring robust electrical connections for optimal performance.

Nominal Supply Voltage: 1.2 V

Operating at a nominal supply voltage of 1.2 V provides a balanced performance profile with a good trade-off between power efficiency and processing speed.

PWM Channels: YES

Pulse-width modulation channels enable precision control of analog signals, making the microcontroller suitable for motor control, power management, and lighting applications.

ROM Programmability: FLASH

Flash ROM programmability allows for flexible firmware updates and customization, enabling easy integration of new features and improvements without replacing the microcontroller.

Terminal Pitch: 0.8 mm

A compact terminal pitch of 0.8 mm enables high-density mounting and efficient use of PCB space, making the microcontroller suitable for compact and space-constrained designs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the microcontroller has a moderate sensitivity to moisture during storage and handling, requiring standard precautions for moisture protection during assembly.

Speed: 200 rpm

A speed of 200 rpm indicates the maximum rotational speed supported by the microcontroller for motor control applications, ensuring precise and responsive performance.

No. of I/O Lines: 169

The high number of I/O lines provides extensive interface options for connecting to external devices and peripherals, enhancing the microcontroller's versatility and compatibility with diverse systems.

Technical Specifications

Microcontrollers TMX320F28377DZWTT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

20 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B337

JESD-609 Code:

e1

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

169

No. of Terminals:

337

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

ROM Programmability:

FLASH

Maximum Seated Height:

1.4 mm

Speed:

200 rpm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TMX320F28377DZWTT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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