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TMX320F28069UPFPA

Texas Instruments

TMX320F28069UPFPA by Texas Instruments

TMX320F28069UPFPA by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 102400 RAM bytes. It operates at a max clock frequency of 90 MHz, suitable for industrial applications requiring CAN, I2C, SCI, SPI, and USB connectivity. With 12 ADC channels and PWM channels each, it offers versatile peripheral options for efficient system control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,440 parts In-Stock

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Vyrian

USA . 3,048 parts In-Stock

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3,048

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Distributors (Availability)

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AZTECH Wire

Italy . 665 parts In-Stock

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$5.022

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665

$5.022

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One Stop Electronics

USA . 172 parts In-Stock

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$6.000

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Parana Technologies

USA . 1,577 parts In-Stock

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$65.332

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DigiPath Technology Company

USA . 1,407 parts In-Stock

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$71.939

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$66.184

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1,407

$71.939

$66.184

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ChromeModa Solutions

Germany . 4,046 parts In-Stock

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$73.407

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$60.194

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$73.407

$60.194

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IDEA Electronic Components Group

UK . 1,110 parts In-Stock

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$73.407

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$69.737

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$66.066

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1,110

$73.407

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$66.066

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Lixinc

USA . 3,797 parts In-Stock

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Corphita

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999

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Microchip USA

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Overview

Unleash the power of innovation with the TMX320F28069UPFPA microcontroller from Texas Instruments. Designed with cutting-edge technology and precision engineering, this product offers unmatched performance and reliability in a wide range of applications. From industrial automation to consumer electronics, this microcontroller is versatile and efficient, providing value and benefits to customers looking for high-quality solutions. Trust Texas Instruments to deliver superior products that meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Improves durability and reliability of the microcontroller.

Surface Mount: YES

Enables easy and convenient installation onto circuit boards.

Maximum Supply Voltage: 1.995 V

Allows for efficient power usage while ensuring optimal performance.

Bit Size: 32

Offers high processing capabilities and supports complex applications.

Power Supplies (V): 1.8,3.3

Provides flexibility in power options for various applications.

No. of Terminals: 80

Allows for versatile connectivity options and expandability.

Minimum Supply Voltage: 1.71 V

Ensures stable operation even at lower power input levels.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with potential temperature fluctuations.

CPU Family: TMS320

Known for high performance and reliability in microcontroller applications.

ADC Channels: YES

Enables analog to digital conversion for sensor interfacing and data acquisition.

DMA Channels: YES

Facilitates direct memory access for efficient data transfers.

ROM Words: 131072

Ample memory capacity for storing program instructions and data.

Maximum Clock Frequency: 90 MHz

Supports high-speed processing tasks and real-time applications.

Peripheral IC Type: MICROCONTROLLER

Tailored for embedded system applications requiring control and processing capabilities.

RAM Bytes: 102400

Sufficient random access memory for buffering and temporary data storage.

Connectivity: CAN, I2C, SCI(2), SPI(2), USB

Offers versatile communication interfaces for interfacing with various devices.

No. of I/O Lines: 40

Sufficient input/output lines for interfacing with external components and peripherals.

Technical Specifications

Microcontrollers TMX320F28069UPFPA attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

TMS320

Maximum Clock Frequency:

90 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G80

Length:

12 mm

No. of I/O Lines:

40

No. of Terminals:

80

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP80,.55SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

102400

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

90 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C, SCI(2), SPI(2), USB

Peripherals:

COMPARATOR(3), DMA(6), PWM(20), TIMER(3), WDT

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

TMX320F28069UPFPA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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