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TMX320F28035PNT

Texas Instruments

TMX320F28035PNT by Texas Instruments

TMX320F28035PNT by Texas Instruments is a 32-bit microcontroller with 64 terminals, operating at up to 60 MHz. It features DAC and ADC channels, along with PWM support. Ideal for industrial applications requiring high-speed processing and precise control in a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,927 parts In-Stock

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Digiode

USA . 357 parts In-Stock

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357

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AZTECH Wire

Italy . 425 parts In-Stock

1+ parts

$7.365

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$7.365

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One Stop Electronics

USA . 1,400 parts In-Stock

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$20.000

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$20.000

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Microchip USA

USA . 348 parts In-Stock

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$27.970

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$27.570

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$27.370

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$27.170

348

$27.970

$27.570

$27.370

$27.170

Parana Technologies

USA . 1,934 parts In-Stock

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$62.234

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IDEA Electronic Components Group

UK . 2,097 parts In-Stock

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$69.926

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$66.430

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$62.933

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2,097

$69.926

$66.430

$62.933

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ChromeModa Solutions

Germany . 707 parts In-Stock

1+ parts

$69.926

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$57.339

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707

$69.926

$57.339

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Corphita

USA . 4,082 parts In-Stock

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DigiPath Technology Company

USA . 179 parts In-Stock

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$63.045

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Overview

Unlock the power of innovation with the Texas Instruments TMX320F28035PNT microcontroller. Built with precision and expertise by a trusted industry leader, this versatile device boasts a wide range of applications in various industries. From automotive to industrial automation, this high-quality microcontroller offers unparalleled performance and reliability. Experience seamless integration and optimal functionality, all while enjoying the value and benefits that Texas Instruments is known for. Trust in the TMX320F28035PNT to elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic or epoxy material provides durability and reliability to the package, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 1.995 V

Higher maximum supply voltage allows for flexibility in power supply options, enhancing compatibility with different systems.

Bit Size: 32

32-bit architecture enables processing of larger data sets and complex algorithms, improving overall performance.

DAC Channels: YES

Digital-to-analog converter channels enable the microcontroller to interface with analog devices, expanding its compatibility and application range.

Power Supplies (V): 1.8,3.3

Multiple power supply options provide flexibility in voltage requirements, allowing the microcontroller to be used in a variety of systems.

No. of Terminals: 64

Having a larger number of terminals allows for more connectivity options and interfaces, enhancing the versatility of the microcontroller.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Different package styles offer flexibility in mounting and integration options, catering to various design requirements.

Minimum Supply Voltage: 1.71 V

Lower minimum supply voltage ensures efficient power consumption and operation, prolonging the lifespan of the microcontroller.

Maximum Operating Temperature: 105 °C

High maximum operating temperature ensures reliability in harsh environmental conditions, making it suitable for industrial applications.

CPU Family: TMS320

Being part of the TMS320 CPU family indicates compatibility with a proven and reliable processor architecture, ensuring stable performance.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the microcontroller to function in extreme cold environments without compromising performance.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to read analog signals, expanding its capabilities in sensor interfacing and data acquisition.

Terminal Position: QUAD

Quad terminal position offers a balanced layout for easy connections and signal routing, simplifying PCB design and assembly.

ROM Words: 65536

Large ROM capacity allows for storing a vast amount of program data and instructions, supporting complex applications and firmware.

Maximum Seated Height: 1.6 mm

Low seated height enables compact designs and slim form factors, making the microcontroller suitable for space-constrained installations.

Width: 12 mm

Compact width dimension helps in fitting the microcontroller into tight spaces or alongside other components on the PCB, optimizing PCB layout.

Maximum Clock Frequency: 60 MHz

High clock frequency allows for faster processing and execution of instructions, enhancing the overall speed and performance of the microcontroller.

Length: 12 mm

Short length dimension contributes to a smaller footprint on the PCB, saving board space and enabling compact designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments with varying temperature conditions, enhancing overall durability.

Peripheral IC Type: MICROCONTROLLER

Designed specifically as a microcontroller peripheral IC, ensuring dedicated functionality and optimized performance for microcontroller applications.

RAM Bytes: 10240

Sufficient RAM capacity allows for storing and manipulating data during program execution, supporting multitasking and data-intensive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in noisy environments.

Terminal Form: GULL WING

Gull wing terminal form simplifies soldering and PCB assembly processes, ensuring secure connections and robust mechanical bonding.

Nominal Supply Voltage: 1.8 V

Stable nominal supply voltage ensures consistent and reliable operation of the microcontroller, preventing voltage fluctuations and potential damage.

PWM Channels: YES

Pulse width modulation channels enable precise control of output signals, facilitating motor control, power regulation, and signal modulation.

ROM Programmability: FLASH

Flash ROM programmability allows for easy firmware updates and modifications without requiring specialized equipment, enhancing flexibility and scalability.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting and connection, supporting miniaturization and compact designs in space-constrained applications.

Speed: 60 rpm

High operating speed of 60 rpm ensures swift processing and response times, improving overall system performance and efficiency.

No. of I/O Lines: 45

Large number of I/O lines provides ample interfacing options for external devices and peripherals, increasing the versatility and connectivity of the microcontroller.

Technical Specifications

Microcontrollers TMX320F28035PNT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

TMS320

Maximum Clock Frequency:

60 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

12 mm

No. of I/O Lines:

45

No. of Terminals:

64

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

10240

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

60 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMX320F28035PNT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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