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TMX320C28346ZFE

Texas Instruments

TMX320C28346ZFE by Texas Instruments

TMX320C28346ZFE by Texas Instruments is a 32-bit microcontroller with 256 terminals, 20 external data bus width, and 150 MHz max clock frequency. It is ideal for applications requiring high-speed processing and multiple ADC/DMA channels, such as industrial automation and automotive control systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,186 parts In-Stock

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Digiode

USA . 3,581 parts In-Stock

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3,581

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Distributors (Availability)

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One Stop Electronics

USA . 492 parts In-Stock

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$12.000

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492

$12.000

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AZTECH Wire

Italy . 387 parts In-Stock

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$19.031

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387

$19.031

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Parana Technologies

USA . 1,593 parts In-Stock

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$36.735

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$36.735

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DigiPath Technology Company

USA . 94 parts In-Stock

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$40.450

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94

$40.450

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ChromeModa Solutions

Germany . 1,389 parts In-Stock

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$41.275

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$33.846

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1,389

$41.275

$33.846

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IDEA Electronic Components Group

UK . 643 parts In-Stock

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$41.275

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$39.211

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$37.148

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643

$41.275

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$37.148

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Corphita

USA . 4,431 parts In-Stock

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Overview

Unlock the full potential of your next project with the TMX320C28346ZFE microcontroller by Texas Instruments. Known for their top-notch quality and innovation, Texas Instruments offers a wide range of applications for this powerful device. From industrial automation to consumer electronics, this microcontroller provides unparalleled value, benefits, and advantages to customers. With its advanced features and reliable performance, the TMX320C28346ZFE is the perfect choice for all your microcontroller needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for microcontrollers due to its durability and cost-effectiveness.

Surface Mount: YES

Surface mount technology allows for smaller and more compact designs, making this microcontroller suitable for applications where space is limited.

Maximum Supply Voltage: 1.26 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of systems.

Address Bus Width: 32

A wider address bus allows for the microcontroller to access a larger memory space, enabling more complex and data-intensive applications.

Package Shape: SQUARE

The square package shape is easy to mount and align on PCBs, making the assembly process more efficient.

Bit Size: 32

A 32-bit architecture enables faster processing speeds and improved performance in handling complex algorithms and computations.

No. of Terminals: 256

Having a greater number of terminals provides more connectivity options for interfacing with external devices and peripherals.

Package Style (Meter): GRID ARRAY

The grid array package style offers better thermal conductivity and mechanical strength, ensuring reliability in various operating conditions.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage allows for energy-efficient operation and extends battery life in portable devices.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to interface with analog sensors and devices, expanding its application range.

DMA Channels: YES

Direct memory access channels improve data transfer efficiency and reduce processor load, enhancing overall system performance.

Terminal Position: BOTTOM

Having terminals at the bottom simplifies the PCB layout and routing, optimizing signal integrity and reducing interference.

Maximum Seated Height: 2.1 mm

The low seated height allows for slim and compact device designs, ideal for space-constrained applications.

Width: 17 mm

A compact width dimension facilitates integration into small form factor devices without compromising functionality.

External Data Bus Width: 20

A wider external data bus improves data transfer rates between the microcontroller and external memory or peripherals, enhancing overall system performance.

Maximum Clock Frequency: 150 MHz

A high maximum clock frequency enables fast execution of instructions, making the microcontroller suitable for real-time processing applications.

Length: 17 mm

The short length dimension saves space on the PCB, allowing for more compact and efficient system designs.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product integrates various peripherals and interfaces on a single chip, simplifying system design and reducing component count.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in different environments.

Terminal Form: BALL

Ball terminals provide secure and reliable connections, ensuring stable operation in demanding applications.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage ensures stable and consistent performance of the microcontroller under normal operating conditions.

PWM Channels: YES

Pulse-width modulation channels enable precise control of analog signals, making the microcontroller suitable for applications requiring accurate signal manipulation.

ROM Programmability: MROM

MROM (Mask ROM) allows for secure and permanent programming of firmware, ensuring data integrity and preventing unauthorized access or modification.

Terminal Pitch: 1 mm

The fine terminal pitch enables high-density packaging and allows for miniaturization of the overall system footprint.

Speed: 300 rpm

With a speed of 300 rpm, this microcontroller can handle fast data processing and real-time communication tasks efficiently.

No. of I/O Lines: 88

Having 88 I/O lines provides ample connectivity options for interfacing with external devices, sensors, and peripherals, making the microcontroller versatile and adaptable to various applications.

Technical Specifications

Microcontrollers TMX320C28346ZFE attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

150 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

20

JESD-30 Code:

S-PBGA-B256

Length:

17 mm

No. of I/O Lines:

88

No. of Terminals:

256

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

ROM Programmability:

MROM

Maximum Seated Height:

2.1 mm

Speed:

300 rpm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

17 mm

Peripheral IC Type:

Trade Compliance

TMX320C28346ZFE Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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