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TMX370C150FNA

Texas Instruments

TMX370C150FNA by Texas Instruments

TMX370C150FNA by Texas Instruments is an 8-bit microcontroller with 256 bytes of RAM. Operating at 5V, it has a max supply current of 45mA and operates in industrial temperature range (-40 to 85°C). Ideal for applications requiring high-speed processing in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,794 parts In-Stock

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4,794

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Vyrian

USA . 4,152 parts In-Stock

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4,152

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Distributors (Availability)

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AZTECH Wire

Italy . 771 parts In-Stock

1+ parts

$13.414

100+ parts

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771

$13.414

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One Stop Electronics

USA . 1,081 parts In-Stock

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$31.000

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1,081

$31.000

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Parana Technologies

USA . 68 parts In-Stock

1+ parts

$48.978

100+ parts

$4,548.312

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$44.080

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68

$48.978

$4,548.312

$44.080

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DigiPath Technology Company

USA . 127 parts In-Stock

1+ parts

$53.930

100+ parts

$49.616

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127

$53.930

$49.616

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ChromeModa Solutions

Germany . 5,570 parts In-Stock

1+ parts

$55.031

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$45.125

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5,570

$55.031

$45.125

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IDEA Electronic Components Group

UK . 726 parts In-Stock

1+ parts

$55.031

100+ parts

$52.279

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$49.528

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726

$55.031

$52.279

$49.528

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Corphita

USA . 3,606 parts In-Stock

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3,606

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Overview

Unleash the power of innovation with the TMX370C150FNA from Texas Instruments, a leading manufacturer in the industry. This microcontroller offers seamless integration and unparalleled performance, making it ideal for a wide range of applications. From automotive to industrial automation, this product delivers value and efficiency like no other. Experience the benefits of cutting-edge technology and elevate your projects to new heights with the TMX370C150FNA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material ensures durability and reliability, making this microcontroller suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient PCB mounting, saving space and simplifying assembly.

Package Shape: SQUARE

Square package shape provides stability and ease of mounting, ensuring secure attachment to the PCB.

Bit Size: 8

8-bit architecture provides a good balance between performance and cost, making this microcontroller suitable for a wide range of applications.

Power Supplies (V): 5

Operating at 5V, this microcontroller can easily interface with standard components and circuits, offering compatibility and ease of use.

No. of Terminals: 68

With 68 terminals, this microcontroller can support a variety of input/output connections, enabling flexibility in system designs.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers good protection for the microcontroller, safeguarding it from external elements and ensuring long-term reliability.

Maximum Operating Temperature: 85 °C

Operating efficiently up to 85°C, this microcontroller is suitable for industrial applications where elevated temperatures may be encountered.

CPU Family: TMS370

Belonging to the TMS370 CPU family, this microcontroller benefits from proven technology and support, ensuring compatibility and ease of integration.

Minimum Operating Temperature: -40 °C

Capable of operating in harsh environments down to -40°C, this microcontroller is suitable for a wide range of industrial and automotive applications.

Terminal Position: QUAD

Quad terminal positioning simplifies PCB layout and facilitates smoother assembly, enhancing the overall reliability of the end product.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ranges, this microcontroller can withstand tough operating conditions, making it a reliable choice for industrial applications.

RAM Bytes: 256

With 256 bytes of RAM, this microcontroller can handle data processing efficiently, enabling smooth operation of various applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this microcontroller energy-efficient and reliable in noisy environments.

Terminal Form: J BEND

J bend terminal form simplifies soldering and assembly processes, ensuring secure connections and enhancing the overall durability of the system.

Maximum Supply Current: 45 mA

With a maximum supply current of 45 mA, this microcontroller offers low power consumption, making it suitable for battery-operated devices and energy-efficient systems.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V, this microcontroller simplifies interfacing with other components and ensures compatibility with standard power sources.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27 mm, this microcontroller allows for easy and precise connections, enhancing the overall robustness and reliability of the system.

Speed: 5 rpm

Operating at a speed of 5 rpm, this microcontroller provides fast and efficient processing, enabling quick response times in real-time applications.

Technical Specifications

Microcontrollers TMX370C150FNA attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

Bit Size:

8

CPU Family:

TMS370

JESD-30 Code:

S-PQCC-J68

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

256

Speed:

5 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

45 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

TMX370C150FNA Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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