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TMX320F28035PAGT

Texas Instruments

TMX320F28035PAGT by Texas Instruments

TMX320F28035PAGT by Texas Instruments is a 32-bit microcontroller with 60 MHz clock frequency, 64 terminals, and 1.71-1.995 V supply range. Ideal for industrial applications requiring high-speed processing, ADC channels, and PWM capabilities in a compact thin profile package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,657 parts In-Stock

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7,657

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Digiode

USA . 4,384 parts In-Stock

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4,384

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ACDS - Activité Composants Distribution Service

France . 50 parts In-Stock

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50

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Rotakorn

Sweden . 47 parts In-Stock

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47

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ComSIT Distribution GmbH

Germany . 30 parts In-Stock

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30

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Distributors (Availability)

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AZTECH Wire

Italy . 683 parts In-Stock

1+ parts

$18.241

100+ parts

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683

$18.241

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Parana Technologies

USA . 861 parts In-Stock

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$25.353

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$25.976

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861

$25.353

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$25.976

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Microchip USA

USA . 321 parts In-Stock

1+ parts

$27.060

100+ parts

$26.670

1k+ parts

$26.480

10k+ parts

$26.280

321

$27.060

$26.670

$26.480

$26.280

DigiPath Technology Company

USA . 570 parts In-Stock

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$27.916

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570

$27.916

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ChromeModa Solutions

Germany . 3,768 parts In-Stock

1+ parts

$28.486

100+ parts

$23.359

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3,768

$28.486

$23.359

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IDEA Electronic Components Group

UK . 1,371 parts In-Stock

1+ parts

$28.486

100+ parts

$27.062

1k+ parts

$25.637

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1,371

$28.486

$27.062

$25.637

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One Stop Electronics

USA . 379 parts In-Stock

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$34.000

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379

$34.000

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Lixinc

USA . 16,682 parts In-Stock

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Corphita

USA . 4,611 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 2,981 parts In-Stock

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2,981

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Overview

Unlock the potential of your next project with the TMX320F28035PAGT microcontroller by Texas Instruments. Known for their top-quality products, Texas Instruments delivers a reliable and versatile solution for a wide range of applications in the microcontroller category. With its advanced features and innovative technology, this microcontroller offers unmatched value and benefits to customers looking to optimize their designs. Trust Texas Instruments to provide you with a superior product that will take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective, lightweight, and durable, making the microcontroller suitable for a wide range of applications.

Surface Mount: YES

Facilitates easy and efficient PCB assembly, saving time and reducing manufacturing costs.

Maximum Supply Voltage: 1.995 V

Allows for versatile power supply options and compatibility with various systems.

Package Shape: SQUARE

Square shape enables efficient use of board space and easy placement on the PCB.

Bit Size: 32

32-bit architecture provides enhanced processing power and performance capabilities.

Power Supplies (V): 1.8, 3.3

Supports multiple power supply voltages, offering flexibility in system design and optimization.

No. of Terminals: 64

Sufficient number of terminals for connecting various peripherals and components, enhancing functionality.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

These package styles provide compact form factor, high density integration, and efficient heat dissipation.

Minimum Supply Voltage: 1.71 V

Low minimum supply voltage for energy efficiency and optimized power consumption.

Maximum Operating Temperature: 105 °C

High maximum operating temperature makes the microcontroller suitable for industrial applications with demanding environmental conditions.

CPU Family: TMS320

Part of the TMS320 family known for high performance and efficiency, ensuring reliable operation.

Minimum Operating Temperature: -40 °C

Wide temperature range allows the microcontroller to operate reliably in extreme cold environments.

ADC Channels: YES

Integrated ADC channels enable analog-to-digital conversion, expanding the range of sensors and devices that can be interfaced.

Terminal Position: QUAD

Quad terminal position makes PCB layout and routing more organized, improving signal integrity and reducing interference.

ROM Words: 65536

Large ROM capacity for storing program code and data, supporting complex applications and algorithms.

Maximum Seated Height: 1.2 mm

Low seated height enables slim and compact device designs, especially beneficial for space-constrained applications.

Width: 10 mm

Narrow width allows for efficient board space utilization and compact system integration.

Maximum Clock Frequency: 60 MHz

High clock frequency for fast data processing and real-time operation, suitable for time-sensitive applications.

Length: 10 mm

Compact length contributes to the overall small footprint of the microcontroller, ideal for miniaturized devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh environments with wide temperature variations.

Peripheral IC Type: MICROCONTROLLER

Specifically designed as a microcontroller, tailored to meet the processing and control requirements of embedded systems.

RAM Bytes: 10240

Generous RAM capacity for temporary data storage and manipulation, supporting multitasking and data-intensive applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speed, enhancing energy efficiency and performance.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and robust mechanical connection, ensuring reliable electrical contact.

Nominal Supply Voltage: 1.8 V

Stable nominal supply voltage for consistent performance and compatibility with a wide range of components and peripherals.

PWM Channels: YES

Integrated PWM channels for precise control of motors, actuators, and other devices requiring variable speed or intensity.

ROM Programmability: FLASH

Flash ROM programmability allows for easy firmware updates and reprogramming, enhancing flexibility and upgradability.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting and intricate PCB layouts, maximizing board space utilization.

Speed: 60 rpm

High speed capability for rapid data processing and responsiveness, suitable for real-time control applications.

No. of I/O Lines: 33

Sufficient number of I/O lines for connecting external devices, sensors, and interfaces, enhancing system versatility and expandability.

Technical Specifications

Microcontrollers TMX320F28035PAGT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

TMS320

Maximum Clock Frequency:

60 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

10240

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

60 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

TMX320F28035PAGT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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